JP5744528B2 - Colored photosensitive resin composition for touch panel, touch panel, and display device - Google Patents

Description

  The present invention relates to a colored photosensitive resin composition for a touch panel, a touch panel, and a display device.

  Currently, touch panels are widely used as input means in display devices having a liquid crystal display or the like. Among them, a capacitive touch panel is attracting attention because it is optically bright and has a simple structure.

  The capacitive touch panel has a dielectric, and a first conductor and a second conductor formed in different patterns on both sides of the dielectric, respectively. The first conductor and the second conductor are connected to an external control circuit via a lead-out wiring formed in a region outside the active area. According to such a capacitive touch panel, the position of the external conductor is based on an electromagnetic change or a change in capacitance that occurs when an external conductor (typically a finger) comes into contact with or approaches the touch panel. Can be detected.

JP 2010-198615 A

By the way, in this touch panel, in order to be able to use metal as the first conductor and the second conductor, it has been proposed to hide the first conductor and the second conductor behind the black matrix. (See Patent Document 1). It is also under consideration to hide the extraction wiring behind the black matrix so that it cannot be seen from the user side. In such a case, since it is necessary to etch the metal film after forming the black matrix, chemical resistance is important as a material for the black matrix.
Further, when a display device provided with a touch panel is used in an in-vehicle application such as a car navigation system, weather resistance is important as a black matrix material.

  However, when the colored photosensitive resin composition for the black matrix of the color filter is diverted to a touch panel application, there is a problem that the required level is not satisfied in terms of chemical resistance and weather resistance.

  This invention is made | formed in view of the said subject, It is excellent in chemical-resistance and a weather resistance, The coloring photosensitive resin composition for touchscreens used suitably for a touchscreen use, The coloring photosensitive resin composition for touchscreens It aims at providing the touchscreen which has the cured resin pattern formed using, and a display apparatus provided with the touchscreen.

  The inventors of the present invention have made extensive studies to achieve the above object. As a result, it has been found that the above problems can be solved by including an epoxy compound as a binder compound of the colored photosensitive resin composition, and the present invention has been completed. Specifically, the present invention provides the following.

  A first aspect of the present invention includes (A) a binder compound, (B) a photopolymerizable monomer, (C) a photopolymerization initiator, and (D) a colorant, and the (A) binder compound is an epoxy compound. It is the coloring photosensitive resin composition for touchscreens containing.

  The second aspect of the present invention is a touch panel having a cured resin pattern formed using the colored photosensitive resin composition for a touch panel in the first aspect.

  The 2nd aspect of this invention is a display apparatus provided with the touch panel in a 2nd aspect.

  According to the present invention, a colored photosensitive resin composition for a touch panel that is excellent in chemical resistance and weather resistance and is suitably used for touch panel applications, and a cured resin pattern formed using the colored photosensitive resin composition for a touch panel. A touch panel having the touch panel and a display device including the touch panel can be provided.

≪Colored photosensitive resin composition for touch panel≫
The colored photosensitive resin composition for touch panels according to the present invention (hereinafter simply referred to as “colored photosensitive resin composition”) includes (A) a binder compound, (B) a photopolymerizable monomer, and (C) a photopolymerization initiator. And (D) a coloring agent is contained. Hereinafter, each component contained in the colored photosensitive resin composition will be described.

<(A) Binder compound>
The colored photosensitive resin composition according to the present invention contains an epoxy compound as a binder compound (A) (hereinafter also referred to as “component (A)”).

［式中、Ｒ^ａ１はｋ個の活性水素基を有する有機化合物中の活性水素基を除いた残基である。ｎ１，ｎ２，・・・，ｎｋはそれぞれ独立に０〜１００の整数を示し、その和は１〜１００である。ｋは１〜１００の整数を示す。Ａは置換基Ｂを有するオキシシクロヘキサン骨格又は置換基Ｂを有するオキシノルボルネン骨格であり、下記式（Ａ−２）又は（Ａ−３）で表される。

（式中、Ｂはそれぞれ独立に下記式（Ａ−４），式（Ａ−５），又は式（Ａ−６）で表される基である。

ただし、該エポキシ化合物中には前記式（Ａ−４）で表される基が１個以上含まれる。Ｒ^ａ２はアルキル基、アルキルカルボニル基、又はアリールカルボニル基を示す。）］ The epoxy compound is not particularly limited, and a conventionally known epoxy compound that functions as a binder can be used. Among them, an epoxy represented by the following formula (A-1) from the viewpoint of chemical resistance and weather resistance. Compounds are preferred.

[Wherein R ^a1 is a residue obtained by removing an active hydrogen group in an organic compound having k active hydrogen groups. n1, n2,..., nk each independently represents an integer of 0 to 100, and the sum thereof is 1 to 100. k represents an integer of 1 to 100. A is an oxycyclohexane skeleton having a substituent B or an oxynorbornene skeleton having a substituent B, and is represented by the following formula (A-2) or (A-3).

(In the formula, each B is independently a group represented by the following formula (A-4), formula (A-5), or formula (A-6)).

However, the epoxy compound contains one or more groups represented by the formula (A-4). R ^a2 represents an alkyl group, an alkylcarbonyl group, or an arylcarbonyl group. ]]

In the above formula (A-1), R ^a1 is a residue obtained by removing an active hydrogen group in an organic compound having an active hydrogen group, and an organic compound having an active hydrogen group as a precursor thereof is an alcohol. , Phenols, carboxylic acids, amines, thiols and the like.

The alcohols may be monohydric alcohols or polyhydric alcohols. Specifically, aliphatic alcohols such as methanol, ethanol, propanol, butanol, pentanol, hexanol, octanol; aromatic alcohols such as benzyl alcohol; ethylene glycol, diethylene glycol, triethylene glycol, polyethylene glycol, propylene glycol, dipropylene Glycol, 1,3-butanediol, 1,4-butanediol, pentanediol, 1,6-hexanediol, neopentyl glycol, hydroxypivalic acid neopentyl glycol ester, cyclohexanedimethanol, glycerin, diglycerin, polyglycerin, And polyhydric alcohols such as trimethylolpropane, trimethylolethane, pentaerythritol and dipentaerythritol.
Examples of the phenols include phenol, cresol, catechol, pyrogallol, hydroquinone, hydroquinone monomethyl ether, bisphenol A, bisphenol F, 4,4′-dihydroxybenzophenone, bisphenol S, a phenol resin, and a cresol novolac resin.
The above carboxylic acids include formic acid, acetic acid, propionic acid, butyric acid, fatty acids of animal and vegetable oils, fumaric acid, maleic acid, adipic acid, dodecanedioic acid, trimellitic acid, pyromellitic acid, polyacrylic acid, phthalic acid, isophthalic acid And terephthalic acid. Moreover, the compound which has both a hydroxyl group and a carboxyl group, such as lactic acid, a citric acid, and oxycaproic acid, is also mentioned.
Examples of the amines include monomethylamine, dimethylamine, monoethylamine, diethylamine, propylamine, monobutylamine, dibutylamine, pentylamine, hexylamine, cyclohexylamine, octylamine, dodecylamine, 4,4'-diaminodiphenylmethane, isophorone. Examples include diamine, toluene diamine, hexamethylene diamine, xylene diamine, diethylenetriamine, triethylenetetramine, and ethanolamine.
Examples of the thiols include mercapto such as methyl mercaptan, ethyl mercaptan, propyl mercaptan, and phenyl mercaptan; mercapto such as ethylene glycol dimercaptopropionate, trimethylolpropane trimercaptopropionate, pentaerythritol tetramercaptopropionate And propionic acid or mercaptopropionic acid polyhydric alcohol ester.

  In addition, organic compounds having active hydrogen groups include polyvinyl alcohol, polyvinyl acetate partial hydrolyzate, starch, cellulose, cellulose acetate, cellulose acetate butyrate, hydroxyethyl cellulose, acrylic polyol resin, styrene allyl alcohol copolymer resin, styrene. -Maleic acid copolymer resin, alkyd resin, polyester polyol resin, polyester carboxylic acid resin, polycaprolactone polyol resin, polypropylene polyol, polytetramethylene glycol and the like can also be mentioned.

The organic compound having an active hydrogen group may have an unsaturated double bond in its skeleton. Specific examples include allyl alcohol, acrylic acid, methacrylic acid, 3-cyclohexenemethanol, tetrahydrophthalic acid and the like.
These organic compounds having an active hydrogen group can be used alone or in combination of two or more.

In the above formula (A-1), n1, n2,..., Nk each independently represents an integer of 0-100, and the sum thereof is 1-100. Moreover, k shows the integer of 1-100.
n1, n2,..., nk are each independently preferably an integer of 2 to 10, more preferably an integer of 3 to 6. Moreover, it is preferable that it is 4-30, and, as for the sum of n1, n2, ..., nk, it is more preferable that it is 4-20. By setting the sum to 4 or more, the crosslinking density after curing can be increased and the hardness can be increased. Moreover, by making the said sum 30 or less, the solubility to a solvent can be improved and handling property can be improved.

  In the above formula (A-1), A is an oxycyclohexane skeleton having a substituent B or an oxynorbornene skeleton having a substituent B, and is represented by the above formula (A-2) or (A-3). A is preferably represented by the above formula (A-2). The k A's may be the same or different.

  It is essential that the epoxy compound represented by the above formula (A-1) contains at least one group represented by the above formula (A-4). On the other hand, the fewer groups represented by the above formula (A-6), the better.

The epoxy compound represented by the above formula (A-1) is prepared by using an organic compound having an active hydrogen group as an initiator, as disclosed in Japanese Patent Publication No. 7-119270, or 4-vinylcyclohexene-1-oxide or 5- Polyether resin obtained by ring-opening polymerization of a mixture of vinylbicyclo [2.2.1] hept-2-ene-2-oxide and a compound having one epoxy group, ie, vinyl group side chain and cyclohexane It is produced by epoxidizing a polyether resin having a skeleton or a vinyl group side chain and a norbornene skeleton with peracetic acid or hydrogen peroxide.
As a commercial item, EHPE3150 (the sum of n1 to nk is 15 on average) manufactured by Daicel Chemical Industries, Ltd. is preferable.

Moreover, as an epoxy compound, an alicyclic epoxy compound can also be used.
As the alicyclic epoxy compound, 3,4-epoxycyclohexylmethyl-3 ′, 4′-epoxycyclohexanecarboxylate, 2- (3,4-epoxycyclohexyl-5,5-spiro-3,4-epoxy) cyclohexane Meta-dioxane, bis (3,4-epoxycyclohexylmethyl) adipate, bis (3,4-epoxy-6-methylcyclohexylmethyl) adipate, 3,4-epoxy-6-methylcyclohexyl-3 ′, 4′- Epoxy-6′-methylcyclohexanecarboxylate, ε-caprolactone-modified 3,4-epoxycyclohexylmethyl-3 ′, 4′-epoxycyclohexanecarboxylate, trimethylcaprolactone-modified 3,4-epoxycyclohexylmethyl-3 ′, 4′- Epoxy cyclohexane carbo Sylate, β-methyl-δ-valerolactone modified 3,4-epoxycyclohexylmethyl-3 ′, 4′-epoxycyclohexanecarboxylate, methylene bis (3,4-epoxycyclohexane), di (3,4-epoxy) of ethylene glycol (Cyclohexylmethyl) ether, ethylene bis (3,4-epoxycyclohexanecarboxylate), epoxycyclohexahydrophthalate dioctyl, epoxycyclohexahydrophthalate di-2-ethylhexyl, and the like.
Commercially available products include Celoxide 2021, 2021P, 2081, 2083, 2085 manufactured by Daicel Chemical Industries, Epolide GT-300, GT-301, GT-302, GT-400, 401, 403, etc. Santo Tote ST-3000, ST-4000, ST-5080, ST-5100, etc., manufactured by the company are preferred.

  Furthermore, as an epoxy compound, a novolak type epoxy compound, a bisphenol A type epoxy compound, a cresol novolak type epoxy compound, a biphenyl type epoxy compound, or the like can also be used.

As said novolak-type epoxy compound, that whose epoxy equivalent is 200-220 is preferable. Examples of commercially available products include Epicron N-660, N-665, N-670, N-673, N-680, N-690, N-695, N-685-EXP, and N-672, manufactured by Dainippon Ink. EXP, N-655-EXP-S, N-865, N-865-80M, YDCN-701, YDCN-702, YDCN-703, YDCN-704, YDCN-704L, and the like.
Commercially available products of the above bisphenol A type epoxy compounds include EPOTOTO YD-115, YD-118T, YD-127, YD-128, YD-134, YD-8125, YD-7011R, ZX manufactured by Nippon Kayaku Epoxy Manufacturing Co., Ltd. -1059, YDF-8170, YDF-170, etc., Denasel EX-1101, EX-1102, EX-1103 etc. manufactured by Nagase ChemteX Corporation, Plaxel GL-61, GL-62, G101 manufactured by Daicel Chemical Industries, Ltd. , G102 and the like.
Examples of commercially available cresol novolac epoxy compounds include Epototo YDPN-638, YDPN-701, YDPN-702, YDPN-703, and YDPN-704 manufactured by Nippon Kayaku Epoxy Manufacturing Co., Ltd. and Denacol manufactured by Nagase ChemteX Corporation. EM-125 etc. are mentioned.
Examples of the biphenyl type epoxy compound include 3,5,3 ′, 5′-tetramethyl-4,4′-diglycidylbiphenyl and the like.

  It is preferable that the colored photosensitive resin composition according to the present invention further contains another binder compound in addition to the epoxy compound. Examples of such other binder compounds include (meth) acrylic acid, fumaric acid, maleic acid, monomethyl fumarate, monoethyl fumarate, 2-hydroxyethyl (meth) acrylate, ethylene glycol monomethyl ether (meth) acrylate, and ethylene glycol. Monoethyl ether (meth) acrylate, glycerol (meth) acrylate, (meth) acrylamide, acrylonitrile, methacrylonitrile, methyl (meth) acrylate, ethyl (meth) acrylate, isobutyl (meth) acrylate, 2-ethylhexyl (meth) acrylate , Benzyl (meth) acrylate, ethylene glycol di (meth) acrylate, diethylene glycol diacrylate, triethylene glycol di (meth) acrylate, tetrae Lenglycol di (meth) acrylate, butylene glycol dimethacrylate, propylene glycol di (meth) acrylate, trimethylolpropane tri (meth) acrylate, tetramethylolpropane tetra (meth) acrylate, pentaerythritol tri (meth) acrylate, pentaerythritol tetra Oligomers in which (meth) acrylate, dipentaerythritol penta (meth) acrylate, dipentaerythritol hexa (meth) acrylate, 1,6-hexanediol di (meth) acrylate, cardoepoxy diacrylate, etc. are polymerized; polyhydric alcohols (Meth) acrylate obtained by reacting (meth) acrylic acid with polyester prepolymer obtained by condensing monobasic acid or polybasic acid with G: polyurethane (meth) acrylate obtained by reacting a polyol with a compound having two isocyanate groups and then reacting with (meth) acrylic acid; bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S Type epoxy resin, phenol or cresol novolac type epoxy resin, resol type epoxy resin, triphenolmethane type epoxy resin, polycarboxylic acid polyglycidyl ester, polyol polyglycidyl ester, aliphatic or cycloaliphatic epoxy resin, amine epoxy resin, dihydroxy Examples thereof include an epoxy (meth) acrylate resin obtained by reacting an epoxy resin such as a benzene type epoxy resin with (meth) acrylic acid. Furthermore, a resin obtained by reacting an epoxy (meth) acrylate resin with a polybasic acid anhydride can also be suitably used.

Moreover, as another binder compound, a resin obtained by further reacting a reaction product of an epoxy compound and an unsaturated group-containing carboxylic acid compound with a polybasic acid anhydride can also be suitably used. Among these, the compound represented by the following formula (A-7) is preferable because of its high curability.

In the above formula (A-7), X represents a group represented by the following formula (A-8).

In the above formula (A-8), each R ^a3 independently represents a hydrogen atom, a hydrocarbon group having 1 to 6 carbon atoms, or a halogen atom, each R ^a4 independently represents a hydrogen atom or a methyl group, W represents a single bond or a group represented by the following formula (A-9).

  Moreover, in said formula (A-7), Y shows the residue remove | excluding the acid anhydride group (-CO-O-CO-) from the dicarboxylic anhydride. Examples of dicarboxylic acid anhydrides include maleic anhydride, succinic anhydride, itaconic anhydride, phthalic anhydride, tetrahydrophthalic anhydride, hexahydrophthalic anhydride, methylendomethylenetetrahydrophthalic anhydride, chlorendic anhydride, methyltetrahydro Examples thereof include phthalic anhydride and glutaric anhydride.

Moreover, in said formula (A-7), Z shows the residue remove | excluding two acid anhydride groups from tetracarboxylic dianhydride. Examples of tetracarboxylic dianhydrides include pyromellitic anhydride, benzophenone tetracarboxylic dianhydride, biphenyl tetracarboxylic dianhydride, biphenyl ether tetracarboxylic dianhydride, and the like.
Moreover, in said formula (A-7), m shows the integer of 0-20.

  The acid value of the compound represented by the above formula (A-7) is preferably 10 to 150 mgKOH / g, more preferably 70 to 110 mgKOH / g in terms of resin solids. Sufficient developability can be obtained by setting the acid value to 10 mgKOH / g or more. Moreover, by making an acid value into 150 mgKOH / g or less, sufficient sclerosis | hardenability can be obtained and surface property can be made favorable.

  Moreover, it is preferable that it is 1000-40000, and, as for the mass mean molecular weight of the compound represented by the said Formula (A-7), it is more preferable that it is 2000-30000. By setting the mass average molecular weight to 1000 or more, heat resistance and film strength can be improved. Moreover, sufficient solubility with respect to a developing solution can be acquired by making a mass mean molecular weight into 40000 or less.

  The content of the component (A) is preferably 30 to 90% by mass and more preferably 50 to 70% by mass with respect to the solid content of the colored photosensitive resin composition according to the present invention. Moreover, it is preferable that the ratio of the epoxy compound with respect to the whole quantity of (A) component is 30-70 mass%, and it is more preferable that it is 40-60 mass%. By setting the ratio of the epoxy compound to 30% by mass or more, chemical resistance and weather resistance can be improved. Moreover, the fall of a sensitivity and developability can be suppressed by the ratio of an epoxy compound being 70 mass% or less.

<(B) Photopolymerizable monomer>
(B) As a photopolymerizable monomer (henceforth "(B) component"), it does not specifically limit, A conventionally well-known monofunctional monomer and polyfunctional monomer can be used.

  Examples of the monofunctional monomer include (meth) acrylamide, methylol (meth) acrylamide, methoxymethyl (meth) acrylamide, ethoxymethyl (meth) acrylamide, propoxymethyl (meth) acrylamide, butoxymethoxymethyl (meth) acrylamide, and N-methylol. (Meth) acrylamide, N-hydroxymethyl (meth) acrylamide, (meth) acrylic acid, fumaric acid, maleic acid, maleic anhydride, itaconic acid, itaconic anhydride, citraconic acid, citraconic anhydride, crotonic acid, 2-acrylamide 2-methylpropanesulfonic acid, tert-butylacrylamidesulfonic acid, methyl (meth) acrylate, ethyl (meth) acrylate, butyl (meth) acrylate, 2-ethylhexyl (meth) acrylate Rate, cyclohexyl (meth) acrylate, 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 2-hydroxybutyl (meth) acrylate, 2-phenoxy-2-hydroxypropyl (meth) acrylate, 2- (Meth) acryloyloxy-2-hydroxypropyl phthalate, glycerin mono (meth) acrylate, tetrahydrofurfuryl (meth) acrylate, dimethylamino (meth) acrylate, glycidyl (meth) acrylate, 2,2,2-trifluoroethyl ( And (meth) acrylate, 2,2,3,3-tetrafluoropropyl (meth) acrylate, and half (meth) acrylate of a phthalic acid derivative. These monofunctional monomers can be used alone or in combination of two or more.

  On the other hand, as the above polyfunctional monomer, ethylene glycol di (meth) acrylate, diethylene glycol di (meth) acrylate, tetraethylene glycol di (meth) acrylate, propylene glycol di (meth) acrylate, polypropylene glycol di (meth) acrylate, butylene Glycol di (meth) acrylate, neopentyl glycol di (meth) acrylate, 1,6-hexane glycol di (meth) acrylate, trimethylolpropane tri (meth) acrylate, glycerin di (meth) acrylate, pentaerythritol triacrylate, penta Erythritol tetraacrylate, dipentaerythritol pentaacrylate, dipentaerythritol hexaacrylate, pentaerythritol di ( ) Acrylate, pentaerythritol tri (meth) acrylate, pentaerythritol tetra (meth) acrylate, dipentaerythritol penta (meth) acrylate, dipentaerythritol hexa (meth) acrylate, 2,2-bis (4- (meth) acryl Roxydiethoxyphenyl) propane, 2,2-bis (4- (meth) acryloxypolyethoxyphenyl) propane, 2-hydroxy-3- (meth) acryloyloxypropyl (meth) acrylate, ethylene glycol diglycidyl ether di ( (Meth) acrylate, diethylene glycol diglycidyl ether di (meth) acrylate, diglycidyl phthalate di (meth) acrylate, glycerin triacrylate, glycerin polyglycidyl ether Re (meth) acrylate, urethane (meth) acrylate (ie, tolylene diisocyanate), reaction product of trimethylhexamethylene diisocyanate and hexamethylene diisocyanate and 2-bidoxyethyl (meth) acrylate, methylenebis (meth) acrylamide, (meth) Examples thereof include polyfunctional monomers such as acrylamide methylene ether, polyhydric alcohol and N-methylol (meth) acrylamide condensate, and triacryl formal. These polyfunctional monomers can be used alone or in combination of two or more.

  The content of the component (B) is preferably 20 to 60% by mass and more preferably 30 to 50% by mass with respect to the component (A). By setting it within the above range, curability can be improved and pattern formation can be facilitated.

<(C) Photopolymerization initiator>
(C) It does not specifically limit as a photoinitiator (henceforth "(C) component"), A conventionally well-known photoinitiator can be used. Examples of such a photopolymerization initiator include acetophenones such as acetophenone, 2,2-diethoxyacetophenone, p-dimethylacetophenone, p-dimethylaminopropiophenone, dichloroacetophenone, trichloroacetophenone, and p-tert-butylacetophenone; Benzophenones such as benzophenone, 2-chlorobenzophenone, p, p'-bisdimethylaminobenzophenone; benzoin ethers such as benzoin methyl ether, benzoin isopropyl ether, benzoin isobutyl ether; thioxanthene, 2-chlorothioxanthene, 2, Sulfur compounds such as 4-diethylthioxanthene, 2-methylthioxanthene, 2-isopropylthioxanthene; 2-ethylanthraquinone, octamethylanthraquinone Anthraquinones such as 1,2-benzanthraquinone and 2,3-diphenylanthraquinone; Organic peroxides such as benzoyl peroxide and cumene peroxide; 2-mercaptobenzoimidar, 2-mercaptobenzoxazole, 2-mercaptobenzo Thiol compounds such as thiazole; imidazolyl compounds such as 2- (o-chlorophenyl) -4,5-di (m-methoxyphenyl) -imidazolyl dimer; triazine compounds such as p-methoxytriazine; 2,4,6- Tris (trichloromethyl) -s-triazine, 2-methyl-4,6-bis (trichloromethyl) -s-triazine, 2- [2- (5-methylfuran-2-yl) ethenyl] -4,6- Bis (trichloromethyl) -s-triazine, 2- [2- (furan-2-yl) eth L] -4,6-bis (trichloromethyl) -s-triazine, 2- [2- (4-diethylamino-2-methylphenyl) ethenyl] -4,6-bis (trichloromethyl) -s-triazine, 2 -[2- (3,4-Dimethoxyphenyl) ethenyl] -4,6-bis (trichloromethyl) -s-triazine, 2- (4-methoxyphenyl) -4,6-bis (trichloromethyl) -s- Triazine, 2- (4-ethoxystyryl) -4,6-bis (trichloromethyl) -s-triazine, 2- (4-n-butoxyphenyl) -4,6-bis (trichloromethyl) -s-triazine, etc. A triazine compound having a halomethyl group; an aminoketone compound such as 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) -butan-1-one; Thanon -1- [9-ethyl-6- (2-methylbenzoyl) -9H- carbazol-3-yl] -1- (O-acetyl oxime) oxime ester compounds and the like; and the like.

  Among these, an oxime ester compound is preferable from the viewpoint of sufficiently maintaining the sensitivity of the colored photosensitive resin composition and improving the straightness of the pattern. As such an oxime ester compound, what is represented by a following formula (C-1) is preferable.

In the above formula (C-1), R ^c1 represents —NO ₂ or —COR ^c5 . R ^c5 represents a heterocyclic group, a condensed cyclic aromatic group, or an aromatic group, which may have a substituent. R ^{c2 to} R ^c4 each independently represent a monovalent organic group.

^Examples of the heterocyclic group represented by R ^c5 include a 5-membered ring or more, preferably a 5-membered or 6-membered heterocyclic group containing at least one atom of a nitrogen atom, a sulfur atom, and an oxygen atom. Examples of heterocyclic groups include nitrogen-containing 5-membered ring groups such as pyrrolyl, imidazolyl and pyrazolyl groups; nitrogen-containing 6-membered ring groups such as pyridyl, pyrazinyl, pyrimidyl and pyridazinyl groups; thiazolyl and isothiazolyl groups Nitrogen-containing sulfur groups such as oxazolyl groups and isoxazolyl groups; sulfur-containing groups such as thienyl groups and thiopyranyl groups; oxygen-containing groups such as furyl groups and pyranyl groups; Among these, those containing one nitrogen atom or one sulfur atom are preferable. This heterocyclic ring may contain a condensed ring. Examples of the heterocyclic group containing a condensed ring include a benzothienyl group.

^Examples of the condensed cyclic aromatic group represented by R ^c5 include a naphthyl group, an anthryl group, and a phenanthryl group. Moreover, a phenyl group is mentioned as an aromatic group shown by ^Rc1 .

The heterocyclic group, the condensed cyclic aromatic group, or the aromatic group may have a substituent. In particular, when R ^c5 is an aromatic group, it preferably has a substituent. Examples of such substituent include —NO ₂ , —CN, —SO ₂ R ^c6 , —COR ^c6 , —NR ^c7 R ^c8 , —R ^c9 , —OR ^c9 , —O—R ^c10 —O—R ^{c11, and the} like. Is mentioned.

R ^c6 each independently represents an alkyl group, which may be substituted with a halogen atom, and may be interrupted by an ether bond, a thioether bond, or an ester bond. The alkyl group for R ^c6 preferably has 1 to 5 carbon atoms, and examples thereof include a methyl group, an ethyl group, a propyl group, an isopropyl group, a butyl group, and an isobutyl group.

R ^c7 and R ^c8 each independently represent a hydrogen atom, an alkyl group, or an alkoxy group, which may be substituted with a halogen atom, and among these, the alkylene part of the alkyl group and the alkoxy group is an ether bond, It may be interrupted by a thioether bond or an ester bond. R ^c7 and R ^c8 may be bonded to each other to form a ring structure. The alkyl group or alkoxy group in R ^c7 and R ^c8 preferably has 1 to 5 carbon atoms. For example, methyl group, ethyl group, propyl group, isopropyl group, butyl group, isobutyl group, methoxy group, ethoxy group, A propoxy group etc. are mentioned.

^{Examples of the} ring structure that can be formed by combining R ^c7 and R ^c8 include a heterocyclic ring. Examples of the heterocyclic ring include 5-membered or more, preferably 5 to 7-membered heterocyclic rings containing at least a nitrogen atom. This heterocyclic ring may contain a condensed ring. Examples of the heterocyclic ring include piperidine ring, morpholine ring, thiomorpholine ring and the like. Among these, a morpholine ring is preferable.

R ^c9 represents an alkyl group in which some or all of the hydrogen atoms may be substituted with a halogen atom. The alkyl group for R ^c9 preferably has 1 to 5 carbon atoms, and examples thereof include a methyl group, an ethyl group, a propyl group, an isopropyl group, a butyl group, and an isobutyl group.

R ^c10 and R ^c11 each independently represent an alkyl group, which may be substituted with a halogen atom, and may be interrupted by an ether bond, a thioether bond, or an ester bond. Preferred carbon numbers and specific examples thereof are the same as those described above for R ^c6 .

Among these, preferred examples of R ^c5 include a pyrrolyl group, a pyridyl group, a thienyl group, a thiopyralyl group, a benzothienyl group, a naphthyl group, and a phenyl group having a substituent.

In the above formula (C-1), R ^c2 represents a monovalent organic group. The organic group is preferably a group represented by -R ^c12 , -OR ^c12 , ^{-COR c12} , -SR ^c12 , -NR ^c12 R ^c13 . R ^c12 and R ^c13 each independently represents an alkyl group, an alkenyl group, an aryl group, an aralkyl group, or a heterocyclic group, which may be substituted with a halogen atom, an alkyl group, or a heterocyclic group, Among them, the alkylene part of the alkyl group and the aralkyl group may be interrupted by an unsaturated bond, an ether bond, a thioether bond, or an ester bond. R ^c12 and R ^c13 may combine to form a ring structure with the nitrogen atom.

The alkyl group ^represented by R ^c12 and R ^c13 is preferably an alkyl group having 1 to 20 carbon atoms, and more preferably an alkyl group having 1 to 5 carbon atoms. Examples of alkyl groups include methyl, ethyl, n-propyl, isopropyl, n-butyl, isobutyl, sec-butyl, tert-butyl, n-pentyl, isopentyl, sec-pentyl. Group, tert-pentyl group, n-hexyl group, n-heptyl group, n-octyl group, isooctyl group, sec-octyl group, tert-octyl group, n-nonyl group, isononyl group, n-decyl group, isodecyl group And a straight chain or branched chain group such as Moreover, this alkyl group may have a substituent. Examples of those having a substituent include a methoxyethoxyethyl group, an ethoxyethoxyethyl group, a propyloxyethoxyethyl group, and a methoxypropyl group.

As the alkenyl group ^represented by R ^c12 and R ^c13 , those having 1 to 20 carbon atoms are preferable, and those having 1 to 5 carbon atoms are more preferable. Examples of alkenyl groups include linear or branched groups such as vinyl, allyl, butenyl, ethenyl, and propynyl groups. Moreover, this alkenyl group may have a substituent. Examples of those having a substituent include 2- (benzoxazol-2-yl) ethenyl group and the like.

As the aryl group ^represented by R ^c12 and R ^c13 , those having 6 to 20 carbon atoms are preferable, and those having 6 to 10 carbon atoms are more preferable. Examples of the aryl group include phenyl group, tolyl group, xylyl group, ethylphenyl group, naphthyl group, anthryl group, phenanthryl group and the like.

The aralkyl group ^represented by R ^c12 and R ^c13 is preferably one having 7 to 20 carbon atoms, and more preferably one having 7 to 12 carbon atoms. Examples of the aralkyl group include benzyl group, α-methylbenzyl group, α, α-dimethylbenzyl group, phenylethyl group, phenylethenyl group and the like.

^Examples of the heterocyclic group ^represented by R ^c12 and R ^c13 include 5-membered or more, preferably 5- to 7-membered heterocyclic groups containing at least one atom of a nitrogen atom, a sulfur atom, and an oxygen atom. This heterocyclic group may contain a condensed ring. Examples of the heterocyclic group include pyrrolyl, pyridyl, pyrimidyl, furyl, and thienyl groups.

Among these R ^c12 and R ^c13 , the alkylene part of the alkyl group and the aralkyl group may be interrupted by an unsaturated bond, an ether bond, a thioether bond, or an ester bond.

A ring structure that can be formed by combining R ^c12 and R ^c13 includes a heterocyclic ring. Examples of the heterocyclic ring include 5-membered or more, preferably 5 to 7-membered heterocyclic rings containing at least a nitrogen atom. This heterocyclic ring may contain a condensed ring. Examples of the heterocyclic ring include piperidine ring, morpholine ring, thiomorpholine ring and the like.

Among these, R ^c2 is most preferably a methyl group, an ethyl group, a propyl group, or a phenyl group.

In the above formula (C-1), R ^c3 represents a monovalent organic group. Examples of the organic group include an alkyl group having 1 to 5 carbon atoms, an aryl group having 6 to 12 carbon atoms which may have a substituent, a group represented by the following formula (C-2), or a substituent. The heterocyclic group which may have is preferable. Examples of the substituent include the same groups as in R ^c5 above. Examples of the aryl group having 6 to 12 carbon atoms include a phenyl group, a naphthyl group, an anthryl group, and a phenanthryl group.

In the above formula (C-2), R ^c14 represents an alkylene group having 1 to 5 carbon atoms which may be interrupted by an oxygen atom. Examples of such an alkylene group include methylene group, ethylene group, n-propylene group, isopropylene group, n-butylene group, isobutylene group, sec-butylene group, n-pentylene group, isopentylene group, sec-pentylene group and the like. A linear or branched group is mentioned. Among these, R ^c14 is most preferably an ^isopropylene group.

In formula (C-2), R ^c15 represents a monovalent organic group represented by —NR ^c16 R ^c17 (R ^c16 and R ^c17 each independently represents a monovalent organic group). Among such organic groups, if the structure of R ^c15 is represented by the following formula (C-3), it is preferable in that the solubility of the photopolymerization initiator can be improved.

In said formula (C-3), R ^{< c18 >} , R ^<c19> shows a C1-C5 alkyl group each independently. Examples of such an alkyl group include methyl group, ethyl group, n-propyl group, isopropyl group, n-butyl group, isobutyl group, sec-butyl group, tert-butyl group, n-pentyl group, isopentyl group, sec- Examples thereof include a pentyl group and a tert-pentyl group. Among these, R ^c18 and R ^c19 are most preferably methyl groups.

^Examples of the heterocyclic group represented by R ^c3 include 5-membered or more, preferably 5- or 6-membered heterocyclic groups containing at least one of a nitrogen atom, a sulfur atom, and an oxygen atom. Examples of heterocyclic groups include nitrogen-containing 5-membered ring groups such as pyrrolyl, imidazolyl and pyrazolyl groups; nitrogen-containing 6-membered ring groups such as pyridyl, pyrazinyl, pyrimidyl and pyridazinyl groups; thiazolyl and isothiazolyl groups Nitrogen-containing sulfur groups such as oxazolyl groups and isoxazolyl groups; sulfur-containing groups such as thienyl groups and thiopyranyl groups; oxygen-containing groups such as furyl groups and pyranyl groups; Among these, those containing one nitrogen atom or sulfur atom are preferable. This heterocyclic ring may contain a condensed ring. Examples of the heterocyclic group containing a condensed ring include a benzothienyl group.

Moreover, the heterocyclic group may have a substituent. Examples of the substituent include the same groups as in R ^c5 above.

In the above formula (C-1), R ^c4 represents a monovalent organic group. Among these, it is preferable that it is a C1-C5 alkyl group. Examples of such an alkyl group include methyl group, ethyl group, n-propyl group, isopropyl group, n-butyl group, isobutyl group, sec-butyl group, tert-butyl group, n-pentyl group, isopentyl group, sec- Examples thereof include a pentyl group and a tert-pentyl group. Among these, R ^c4 is most preferably a methyl group.

  The content of the component (C) is preferably 0.1 to 50% by mass and more preferably 1 to 45% by mass with respect to the solid content of the colored photosensitive resin composition according to the present invention. By setting it within the above range, sufficient heat resistance and chemical resistance can be obtained, and poor curing can be suppressed.

<(D) Colorant>
The colorant (D) (hereinafter also referred to as “component (D)”) is not particularly limited, and a conventionally known colorant can be used.

  Examples of the colorant include compounds classified as pigments in the color index (CI; issued by The Society of Dyers and Colorists), specifically the following color index (C.I. I.) Numbers are given.

C. I. Pigment Yellow 1 (hereinafter, “CI Pigment Yellow” is the same and only the number is described) 3, 11, 12, 13, 14, 15, 16, 17, 20, 24, 31, 53, 55, 60, 61, 65, 71, 73, 74, 81, 83, 86, 93, 95, 97, 98, 99, 100, 101, 104, 106, 108, 109, 110, 113, 114, 116, 117, 119, 120, 125, 126, 127, 128, 129, 137, 138, 139, 147, 148, 150, 151, 152, 153, 154, 155, 156, 166, 167, 168, 175, 180, 185;
C. I. Pigment Orange 1 (hereinafter, “CI Pigment Orange” is the same, and only the number is described) 5, 13, 14, 16, 17, 24, 34, 36, 38, 40, 43, 46, 49, 51, 55, 59, 61, 63, 64, 71, 73;
C. I. Pigment Violet 1 (hereinafter, “CI Pigment Violet” is the same and only the number is described), 19, 23, 29, 30, 32, 36, 37, 38, 39, 40, 50;
C. I. Pigment Red 1 (hereinafter, “CI Pigment Red” is the same and only the number is described) 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 14, 15, 16, 17, 18, 19, 21, 22, 23, 30, 31, 32, 37, 38, 40, 41, 42, 48: 1, 48: 2, 48: 3, 48: 4, 49: 1, 49: 2, 50: 1, 52: 1, 53: 1, 57, 57: 1, 57: 2, 58: 2, 58: 4, 60: 1, 63: 1, 63: 2, 64: 1, 81: 1, 83, 88, 90: 1, 97, 101, 102, 104, 105, 106, 108, 112, 113, 114, 122, 123, 144, 146, 149, 150, 151, 155, 166, 168, 170, 171, 172, 174, 175, 176, 177, 178, 79, 180, 185, 187, 188, 190, 192, 193, 194, 202, 206, 207, 208, 209, 215, 216, 217, 220, 223, 224, 226, 227, 228, 240, 242, 243, 245, 254, 255, 264, 265;
C. I. Pigment Blue 1 (hereinafter, “CI Pigment Blue” is the same and only the numbers are described), 2, 15, 15: 3, 15: 4, 15: 6, 16, 22, 60, 64, 66;
C. I. Pigment green 7, C.I. I. Pigment green 36, C.I. I. Pigment green 37;
C. I. Pigment brown 23, C.I. I. Pigment brown 25, C.I. I. Pigment brown 26, C.I. I. Pigment brown 28;
C. I. Pigment Black 1 and Pigment Black 7.

  Moreover, it is preferable to use a black pigment as a colorant. Black pigments include carbon black, titanium black, copper, iron, manganese, cobalt, chromium, nickel, zinc, calcium, silver, tin and other metal oxides, composite oxides, metal sulfides, metal sulfates, metal alloys Or various pigments can be mentioned regardless of organic substance and inorganic substance, such as metal carbonate. Among these, it is more preferable to use carbon black having high light shielding properties.

  As the carbon black, known carbon blacks such as channel black, furnace black, thermal black, and lamp black can be used, but channel black and furnace black are preferably used.

  The content of the component (D) is preferably 5 to 70% by mass, more preferably 25 to 55% by mass with respect to the solid content of the colored photosensitive resin composition according to the present invention, and 30 to 30%. More preferably, it is 50 mass%.

<(S) Organic solvent>
The colored photosensitive resin composition according to the present invention preferably contains an organic solvent for dilution. Examples of the organic solvent include ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol mono-n-propyl ether, ethylene glycol mono-n-butyl ether, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol mono-n-propyl ether. , Diethylene glycol mono-n-butyl ether, triethylene glycol monomethyl ether, triethylene glycol monoethyl ether, propylene glycol monomethyl ether, propylene glycol monoethyl ether, propylene glycol mono-n-propyl ether, propylene glycol mono-n-butyl ether, di Propylene glycol monomethyl ether, zip (Poly) alkylene glycol monoalkyl ethers such as pyrene glycol monoethyl ether, dipropylene glycol mono-n-propyl ether, dipropylene glycol mono-n-butyl ether, tripropylene glycol monomethyl ether, tripropylene glycol monoethyl ether; ethylene (Poly) alkylene glycol monoalkyl ether acetates such as glycol monomethyl ether acetate, ethylene glycol monoethyl ether acetate, diethylene glycol monomethyl ether acetate, diethylene glycol monoethyl ether acetate, propylene glycol monomethyl ether acetate, propylene glycol monoethyl ether acetate; diethylene glycol dimethyl Other ethers such as ether, diethylene glycol methyl ethyl ether, diethylene glycol diethyl ether and tetrahydrofuran; ketones such as methyl ethyl ketone, cyclohexanone, 2-heptanone and 3-heptanone; methyl 2-hydroxypropionate, ethyl 2-hydroxypropionate, etc. Lactic acid alkyl esters; ethyl 2-hydroxy-2-methylpropionate, methyl 3-methoxypropionate, ethyl 3-methoxypropionate, methyl 3-ethoxypropionate, ethyl 3-ethoxypropionate, ethyl ethoxyacetate, hydroxyacetic acid Ethyl, methyl 2-hydroxy-3-methylbutanoate, 3-methyl-3-methoxybutyl acetate, 3-methyl-3-methoxybutylpropionate, ethyl acetate, n-acetate -Propyl, isopropyl acetate, n-butyl acetate, isobutyl acetate, n-pentyl formate, isopentyl acetate, n-butyl propionate, ethyl butyrate, n-propyl butyrate, isopropyl butyrate, n-butyl butyrate, methyl pyruvate, pyruvin Other esters such as ethyl acetate, n-propyl pyruvate, methyl acetoacetate, ethyl acetoacetate and ethyl 2-oxobutanoate; aromatic hydrocarbons such as toluene and xylene; N-methylpyrrolidone, N, N-dimethyl Examples include amides such as formamide and N, N-dimethylacetamide. These organic solvents can be used alone or in combination of two or more.

  Among these, propylene glycol monomethyl ether, ethylene glycol monomethyl ether acetate, propylene glycol monomethyl ether acetate, propylene glycol monoethyl ether acetate, diethylene glycol dimethyl ether, diethylene glycol methyl ethyl ether, cyclohexanone, and 3-methoxybutyl acetate are (A) component, It is preferable because it exhibits excellent solubility in the component (B) and the component (C) and can improve the dispersibility of insoluble components such as black pigments.

  The content of the component (S) is preferably such that the solid content concentration of the colored photosensitive resin composition according to the present invention is 5 to 30% by mass.

<Other ingredients>
The colored photosensitive resin composition according to the present invention may contain an additive as necessary. Additives include sensitizers, curing accelerators, crosslinking agents, dispersion aids, fillers, adhesion promoters, antioxidants, UV absorbers, anti-aggregation agents, thermal polymerization inhibitors, antifoaming agents, and surface active agents. Agents and the like.

<Preparation method of colored photosensitive resin composition>
The colored photosensitive resin composition according to the present invention can be obtained by mixing all the above components with a stirrer. In addition, you may filter using a membrane filter so that the obtained composition may become uniform.

≪Touch panel and display device≫
The touch panel according to the present invention has a cured resin pattern formed using the colored photosensitive resin composition according to the present invention. The display device according to the present invention includes the touch panel according to the present invention.

  In order to form a cured resin pattern on the touch panel, first, a contact transfer type coating device such as a roll coater, reverse coater, bar coater or the like, a spinner (rotary coating device), a non-contact type coating device such as a curtain flow coater, The colored photosensitive resin composition according to the present invention is applied on a substrate.

  Next, the applied colored photosensitive resin composition is dried to form a coating film. The drying method is not particularly limited. For example, (1) a method of drying on a hot plate at 80 to 120 ° C., preferably 90 to 100 ° C. for 60 to 120 seconds, and (2) room temperature for several hours to several days. Any of a method of leaving it, and a method of removing the solvent by putting it in a warm air heater or an infrared heater for several tens of minutes to several hours may be used.

Next, this coating film is partially exposed by irradiating active energy rays such as ultraviolet rays and excimer laser light through a negative mask. The energy dose to be irradiated varies depending on the composition of the colored photosensitive resin composition, but is preferably about ²⁰ to 200 mJ / cm ² , for example.

  Next, the exposed coating film is developed into a desired shape by developing with a developer. The development method is not particularly limited, and an immersion method, a spray method, or the like can be used. Examples of the developer include organic ones such as monoethanolamine, diethanolamine, and triethanolamine, and aqueous solutions such as sodium hydroxide, potassium hydroxide, sodium carbonate, ammonia, and quaternary ammonium salts.

  Next, post-baking is performed on the developed pattern at about 200 to 250 ° C. At this time, it is preferable to expose the entire surface of the formed pattern.

  In addition to the method of forming the cured resin pattern by partial exposure and development as described above, the cured resin pattern may be formed using, for example, an ink jet printer. In this case, the colored photosensitive resin composition according to the present invention is discharged onto the substrate so as to have a desired pattern shape, and then a cured resin pattern is formed through drying, exposure, and post-baking.

  The display device according to the present invention can be manufactured by incorporating the touch panel on which the cured resin pattern is formed as described above into the display device according to a conventional method.

  Examples of the present invention will be described below, but the scope of the present invention is not limited to these examples. In the following description, “parts” and “%” are based on mass.

<Synthesis Example 1>
First, in a 500 ml four-necked flask, 235 g of bisphenolfluorene type epoxy resin (epoxy equivalent 235), 110 mg of tetramethylammonium chloride, 100 mg of 2,6-di-tert-butyl-4-methylphenol, and 72.0 g of acrylic acid Was heated and dissolved at 90 to 100 ° C. while blowing air at a rate of 25 ml / min. Next, the temperature was gradually raised while the solution was clouded, and the solution was heated to 120 ° C. to be completely dissolved. At this time, the solution gradually became transparent and viscous, but stirring was continued as it was. During this time, the acid value was measured, and heating and stirring were continued until the acid value was less than 1.0 mgKOH / g. It took 12 hours for the acid value to reach the target value. And it cooled to room temperature and obtained the bisphenol fluorene type epoxy acrylate represented by the following formula (A-10) which is colorless and transparent and solid.

Next, after adding 600 g of 3-methoxybutyl acetate to 307.0 g of the bisphenolfluorene type epoxy acrylate thus obtained and dissolving, 80.5 g of benzophenonetetracarboxylic dianhydride and 1 g of tetraethylammonium bromide were added. The mixture was gradually heated and reacted at 110 to 115 ° C. for 4 hours. After confirming the disappearance of the acid anhydride group, 38.0 g of 1,2,3,6-tetrahydrophthalic anhydride was mixed and reacted at 90 ° C. for 6 hours to obtain Resin A1. The disappearance of the acid anhydride group was confirmed by IR spectrum.
This resin A1 corresponds to the compound represented by the above formula (A-7).

<Example 1>
Each component shown below was dissolved in a mixed solvent of 3-methoxybutyl acetate / cyclohexanone / propylene glycol monomethyl ether acetate = 60/20/20 (mass ratio) so as to have a solid content concentration of 15% by mass. After mixing for 2 hours, the mixture was filtered through a membrane filter having a pore size of 5 μm to prepare a colored photosensitive resin composition.
-Binder compound Resin A1 obtained in Synthesis Example 1 95 parts Copolymer of styrene / methacrylic acid = 80/20 (mass ratio) (resin A2, mass average molecular weight 13000) ... 60 parts "EHPE3150" (Daicel Chemical Industries, Ltd .; 1,2-epoxy-4- (2-oxiranyl) cyclohexane adduct of 2,2-bis (hydroxymethyl) -1-butanol; see formula (1) below) 155 parts Photopolymerizable monomer Dipentaerythritol hexaacrylate (Nippon Kayaku Co., Ltd.) 175 parts Photopolymerization initiator “OXE-02” (manufactured by BASF; Etanone-1- [9-ethyl-6- (2 -Methylbenzoyl) -9H-carbazol-3-yl] -1- (O-acetyloxime)) ... 100 parts Colorant Carbon black (manufactured by Mikuni Dye Company) 450 parts

<Examples 2 to 5>
The colored photosensitive resin is the same as in Example 1 except that the composition of the binder compound is changed as shown in Table 1 and the ratio of the epoxy compound to the total amount of the binder compound is 40%, 30%, 20%, and 10%. A composition was prepared. In addition, the numerical value in Table 1 represents a mass part.

<Example 6>
As shown in Table 1, a colored photosensitive resin was used in the same manner as in Example 1 except that “Celoxide 2021P” (manufactured by Daicel Chemical Industries) represented by the following formula (2) was used instead of “EHPE3150”. A composition was prepared.

<Examples 7 to 10>
The colored photosensitive resin is the same as in Example 6 except that the composition of the binder compound is changed as shown in Table 1 and the ratio of the epoxy compound to the total amount of the binder compound is 40%, 30%, 20%, and 10%. A composition was prepared. In addition, the numerical value in Table 1 represents a mass part.

<Example 11>
As shown in Table 1, a colored photosensitive resin was used in the same manner as in Example 1 except that “Celoxide 2081” (manufactured by Daicel Chemical Industries, Ltd.) represented by the following formula (3) was used instead of “EHPE3150”. A composition was prepared.

<Examples 12 to 15>
Colored photosensitive resin in the same manner as in Example 11 except that the composition of the binder compound was changed as shown in Table 1, and the ratio of the epoxy compound to the total amount of the binder compound was 40%, 30%, 20%, and 10%. A composition was prepared. In addition, the numerical value in Table 1 represents a mass part.

<Example 16>
As shown in Table 2, a colored photosensitive resin was used in the same manner as in Example 1 except that “Celoxide 2000” (manufactured by Daicel Chemical Industries) represented by the following formula (4) was used instead of “EHPE3150”. A composition was prepared.

<Examples 17 to 20>
Colored photosensitive resin in the same manner as in Example 16 except that the composition of the binder compound was changed as shown in Table 2 and the ratio of the epoxy compound to the total amount of the binder compound was 40%, 30%, 20% and 10%. A composition was prepared. In addition, the numerical value in Table 2 represents a mass part.

<Example 21>
As shown in Table 2, a colored photosensitive resin was used in the same manner as in Example 1 except that “Celoxide 3000” (manufactured by Daicel Chemical Industries, Ltd.) represented by the following formula (5) was used instead of “EHPE3150”. A composition was prepared.

<Examples 22 to 25>
Colored photosensitive resin in the same manner as in Example 21 except that the composition of the binder compound was changed as shown in Table 2 and the ratio of the epoxy compound to the total amount of the binder compound was 40%, 30%, 20% and 10%. A composition was prepared. In addition, the numerical value in Table 2 represents a mass part.

<Comparative Example 1>
A colored photosensitive resin composition was prepared in the same manner as in Example 1 except that the composition of the binder compound was changed as shown in Table 2 and the epoxy compound was not included in the binder compound. In addition, the numerical value in Table 2 represents a mass part.

<Evaluation>
[Evaluation of chemical resistance]
The colored photosensitive resin compositions prepared in Examples 1 to 25 and Comparative Example 1 were applied onto a glass substrate (Corning, E2K glass) using a spin coater (TR25000: manufactured by Tokyo Ohka Kogyo Co., Ltd.), 90 The coating film was dried at 120 ° C. for 120 seconds to form a coating film having a thickness of 1.8 μm. Subsequently, this coating film was irradiated with ultraviolet rays (wavelength 365 nm, irradiation amount 50 mJ) using a mirror projection aligner (TME-150 RTO: manufactured by Topcon Corporation). Then, post-baking was performed in a circulation oven at 230 ° C. for 20 minutes to obtain a cured film.
The glass substrate on which this cured film was formed was immersed for 1 minute in an etching solution at 40 ° C. (H ₃ PO ₄ / CH ₃ COOH / HNO ₃ / H ₂ O = 65/3/12/22), washed with water, Drained by air blow. Furthermore, the glass substrate on which the cured film was formed was immersed in a stripping solution (DMSO / monoethanolamine = 30/70) at 60 ° C. for 1 minute, washed with water, and then drained by air blow.
Thereafter, a cross-hatch test was performed to evaluate the chemical resistance of the cured film. Specifically, in conformity with ISO 2409 (ASTM D-3359), the cured film is cross-cut at 100 stitches at intervals of 2.0 mm (11 cuts in length and width), and the adhesive tape is firmly attached to the cross-cut portions. After that, the adhesive tape was peeled off rapidly to examine the presence or absence of peeling of the cured film, and the evaluation was made in 6 stages from class 0B to class 5B. The results are shown in Tables 1 and 2 below.

[Evaluation of weather resistance]
Using the colored photosensitive resin compositions prepared in Examples 1 to 25 and Comparative Example 1, a cured film was formed on a glass substrate in the same manner as in the above [Evaluation of chemical resistance].
A weather resistance test was performed on the cured film using a weather meter (Xenon X75: manufactured by Suga Test Instruments Co., Ltd.). More specifically, one irradiation test with a temperature of 60 ° C., humidity of 100% RH and UV and one dark test without a temperature of 50 ° C., humidity of 100% RH and UV are defined as one cycle (8 hours). For 25 cycles (200 hours).
Thereafter, in order to evaluate the weather resistance of the cured film, a cross hatch test was performed in the same manner as in the above [Evaluation of chemical resistance]. The results are shown in Tables 1 and 2 below.

  As can be seen from Tables 1 and 2, when the colored photosensitive resin compositions of Examples 1 to 25 containing an epoxy compound as a binder compound were used, after the cross-hatch test and the weather resistance test after the chemical resistance test In both of the cross-hatch tests, adhesion of class 0B or higher was shown. Among them, when the ratio of the epoxy compound to the total amount of the binder compound is 40 to 50%, the adhesion is Class 5B in the cross hatch test after the chemical resistance test, and Class 3B or higher in the cross hatch test after the weather resistance test. In particular, in Examples 1 and 2 using EHPE3150 as an epoxy compound, the adhesion of class 5B was shown in both the cross hatch test after the chemical resistance test and the cross hatch test after the weather resistance test.

  On the other hand, when the colored photosensitive resin composition of Comparative Example 1 containing no epoxy compound was used as the binder compound, it exhibited class 0B adhesion in the cross-hatch test after the weather resistance test, Since the chemical property is remarkably inferior, the coating film was peeled off during the etching treatment or the peeling treatment, and the cross-hatch test after the chemical resistance test was not conducted.

Claims (4)

(A) a binder compound, (B) a photopolymerizable monomer, (C) a photopolymerization initiator, and (D) a colorant,
The look-containing compound represented by the binder (A) compound following epoxy compound represented by (A-1) and the following formula (A-7),
The coloring photosensitive resin composition for touchscreens whose ratio of the said epoxy compound is 40-60 mass% with respect to the whole quantity of the said (A) binder compound .

[Wherein R ^a1 is a residue obtained by removing an active hydrogen group in an organic compound having k active hydrogen groups. n1, n2,..., nk each independently represents an integer of 0 to 100, and the sum thereof is 1 to 100. k represents an integer of 1 to 100. A is an oxycyclohexane skeleton having a substituent B or an oxynorbornene skeleton having a substituent B, and is represented by the following formula (A-2) or (A-3).

(In the formula, each B is independently a group represented by the following formula (A-4), formula (A-5), or formula (A-6)).

However, the epoxy compound contains one or more groups represented by the formula (A-4). R ^a2 represents an alkyl group, an alkylcarbonyl group, or an arylcarbonyl group. ]]

(In the above formula (A-7), X represents a group represented by the following formula (A-8), and Y represents an acid anhydride group (—CO—OCO—) removed from a dicarboxylic acid anhydride. Z represents a residue obtained by removing two acid anhydride groups from tetracarboxylic dianhydride, and m represents an integer of 0 to 20.)

(In said formula (A-8), R ^<3a> shows a hydrogen atom, a C1-C6 hydrocarbon group, or a halogen atom each independently, R ^<4a> shows a hydrogen atom or a methyl group each independently. , W represents a single bond or a group represented by the following formula (A-9).)

It said colorant (D) is a touch panel for colored photosensitive resin composition according to claim 1, wherein the black pigment. Claim 1 or a touch panel having a cured resin pattern formed by using the second touch panel for colored photosensitive resin composition. A display device comprising the touch panel according to claim 3 .