JP5736033B2 - 硬化性組成物 - Google Patents
硬化性組成物 Download PDFInfo
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- JP5736033B2 JP5736033B2 JP2013506549A JP2013506549A JP5736033B2 JP 5736033 B2 JP5736033 B2 JP 5736033B2 JP 2013506549 A JP2013506549 A JP 2013506549A JP 2013506549 A JP2013506549 A JP 2013506549A JP 5736033 B2 JP5736033 B2 JP 5736033B2
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- IFESPHOLAILUKF-UHFFFAOYSA-N 4-[1-(7-oxabicyclo[4.1.0]heptan-4-ylmethoxy)ethoxymethyl]-7-oxabicyclo[4.1.0]heptane Chemical compound C1CC2OC2CC1COC(C)OCC1CC2OC2CC1 IFESPHOLAILUKF-UHFFFAOYSA-N 0.000 description 1
- SXNMNCDJKOUXSF-UHFFFAOYSA-N 4-[2-(7-oxabicyclo[4.1.0]heptan-4-ylmethyl)heptyl]-7-oxabicyclo[4.1.0]heptane Chemical compound C1CC2OC2CC1CC(CCCCC)CC1CC2OC2CC1 SXNMNCDJKOUXSF-UHFFFAOYSA-N 0.000 description 1
- OECTYKWYRCHAKR-UHFFFAOYSA-N 4-vinylcyclohexene dioxide Chemical compound C1OC1C1CC2OC2CC1 OECTYKWYRCHAKR-UHFFFAOYSA-N 0.000 description 1
- YIROYDNZEPTFOL-UHFFFAOYSA-N 5,5-Dimethylhydantoin Chemical compound CC1(C)NC(=O)NC1=O YIROYDNZEPTFOL-UHFFFAOYSA-N 0.000 description 1
- NHJIDZUQMHKGRE-UHFFFAOYSA-N 7-oxabicyclo[4.1.0]heptan-4-yl 2-(7-oxabicyclo[4.1.0]heptan-4-yl)acetate Chemical compound C1CC2OC2CC1OC(=O)CC1CC2OC2CC1 NHJIDZUQMHKGRE-UHFFFAOYSA-N 0.000 description 1
- HWTDMFJYBAURQR-UHFFFAOYSA-N 80-82-0 Chemical class OS(=O)(=O)C1=CC=CC=C1[N+]([O-])=O HWTDMFJYBAURQR-UHFFFAOYSA-N 0.000 description 1
- ONMOULMPIIOVTQ-UHFFFAOYSA-N 98-47-5 Chemical compound OS(=O)(=O)C1=CC=CC([N+]([O-])=O)=C1 ONMOULMPIIOVTQ-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N Acrylic acid Chemical compound OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 241001247482 Amsonia Species 0.000 description 1
- ADAHGVUHKDNLEB-UHFFFAOYSA-N Bis(2,3-epoxycyclopentyl)ether Chemical compound C1CC2OC2C1OC1CCC2OC21 ADAHGVUHKDNLEB-UHFFFAOYSA-N 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- 229940126062 Compound A Drugs 0.000 description 1
- FBPFZTCFMRRESA-FSIIMWSLSA-N D-Glucitol Natural products OC[C@H](O)[C@H](O)[C@@H](O)[C@H](O)CO FBPFZTCFMRRESA-FSIIMWSLSA-N 0.000 description 1
- FBPFZTCFMRRESA-JGWLITMVSA-N D-glucitol Chemical compound OC[C@H](O)[C@@H](O)[C@H](O)[C@H](O)CO FBPFZTCFMRRESA-JGWLITMVSA-N 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 1
- NLDMNSXOCDLTTB-UHFFFAOYSA-N Heterophylliin A Natural products O1C2COC(=O)C3=CC(O)=C(O)C(O)=C3C3=C(O)C(O)=C(O)C=C3C(=O)OC2C(OC(=O)C=2C=C(O)C(O)=C(O)C=2)C(O)C1OC(=O)C1=CC(O)=C(O)C(O)=C1 NLDMNSXOCDLTTB-UHFFFAOYSA-N 0.000 description 1
- 229910052779 Neodymium Inorganic materials 0.000 description 1
- ALQSHHUCVQOPAS-UHFFFAOYSA-N Pentane-1,5-diol Chemical compound OCCCCCO ALQSHHUCVQOPAS-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
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- 229910052777 Praseodymium Inorganic materials 0.000 description 1
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- 229910018287 SbF 5 Inorganic materials 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- 229910010413 TiO 2 Inorganic materials 0.000 description 1
- 239000007983 Tris buffer Substances 0.000 description 1
- FDLQZKYLHJJBHD-UHFFFAOYSA-N [3-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=CC(CN)=C1 FDLQZKYLHJJBHD-UHFFFAOYSA-N 0.000 description 1
- NIYNIOYNNFXGFN-UHFFFAOYSA-N [4-(hydroxymethyl)cyclohexyl]methanol;7-oxabicyclo[4.1.0]heptane-4-carboxylic acid Chemical compound OCC1CCC(CO)CC1.C1C(C(=O)O)CCC2OC21.C1C(C(=O)O)CCC2OC21 NIYNIOYNNFXGFN-UHFFFAOYSA-N 0.000 description 1
- MFIBZDZRPYQXOM-UHFFFAOYSA-N [dimethyl-[3-(oxiran-2-ylmethoxy)propyl]silyl]oxy-dimethyl-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound C1OC1COCCC[Si](C)(C)O[Si](C)(C)CCCOCC1CO1 MFIBZDZRPYQXOM-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
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- 239000003513 alkali Substances 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- 150000001642 boronic acid derivatives Chemical class 0.000 description 1
- 125000001246 bromo group Chemical group Br* 0.000 description 1
- HQABUPZFAYXKJW-UHFFFAOYSA-N butan-1-amine Chemical compound CCCCN HQABUPZFAYXKJW-UHFFFAOYSA-N 0.000 description 1
- 229910052792 caesium Inorganic materials 0.000 description 1
- 239000004202 carbamide Substances 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 125000001309 chloro group Chemical group Cl* 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011231 conductive filler Substances 0.000 description 1
- 125000000753 cycloalkyl group Chemical group 0.000 description 1
- RLMGYIOTPQVQJR-UHFFFAOYSA-N cyclohexane-1,3-diol Chemical compound OC1CCCC(O)C1 RLMGYIOTPQVQJR-UHFFFAOYSA-N 0.000 description 1
- VKONPUDBRVKQLM-UHFFFAOYSA-N cyclohexane-1,4-diol Chemical compound OC1CCC(O)CC1 VKONPUDBRVKQLM-UHFFFAOYSA-N 0.000 description 1
- DNWBGZGLCKETOT-UHFFFAOYSA-N cyclohexane;1,3-dioxane Chemical compound C1CCCCC1.C1COCOC1 DNWBGZGLCKETOT-UHFFFAOYSA-N 0.000 description 1
- HGCIXCUEYOPUTN-UHFFFAOYSA-N cyclohexene Chemical compound C1CCC=CC1 HGCIXCUEYOPUTN-UHFFFAOYSA-N 0.000 description 1
- 238000007033 dehydrochlorination reaction Methods 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 235000014113 dietary fatty acids Nutrition 0.000 description 1
- 239000000539 dimer Substances 0.000 description 1
- 230000009365 direct transmission Effects 0.000 description 1
- 150000004662 dithiols Chemical class 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000194 fatty acid Substances 0.000 description 1
- 229930195729 fatty acid Natural products 0.000 description 1
- 150000004665 fatty acids Chemical class 0.000 description 1
- HOXINJBQVZWYGZ-UHFFFAOYSA-N fenbutatin oxide Chemical compound C=1C=CC=CC=1C(C)(C)C[Sn](O[Sn](CC(C)(C)C=1C=CC=CC=1)(CC(C)(C)C=1C=CC=CC=1)CC(C)(C)C=1C=CC=CC=1)(CC(C)(C)C=1C=CC=CC=1)CC(C)(C)C1=CC=CC=C1 HOXINJBQVZWYGZ-UHFFFAOYSA-N 0.000 description 1
- 239000007850 fluorescent dye Substances 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 125000005843 halogen group Chemical group 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- WJSATVJYSKVUGV-UHFFFAOYSA-N hexane-1,3,5-triol Chemical compound CC(O)CC(O)CCO WJSATVJYSKVUGV-UHFFFAOYSA-N 0.000 description 1
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 1
- 238000007757 hot melt coating Methods 0.000 description 1
- 150000001469 hydantoins Chemical class 0.000 description 1
- XMBWDFGMSWQBCA-UHFFFAOYSA-N hydrogen iodide Chemical class I XMBWDFGMSWQBCA-UHFFFAOYSA-N 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 125000004029 hydroxymethyl group Chemical group [H]OC([H])([H])* 0.000 description 1
- YAMHXTCMCPHKLN-UHFFFAOYSA-N imidazolidin-2-one Chemical compound O=C1NCCN1 YAMHXTCMCPHKLN-UHFFFAOYSA-N 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000007759 kiss coating Methods 0.000 description 1
- 150000002602 lanthanoids Chemical class 0.000 description 1
- 239000004611 light stabiliser Substances 0.000 description 1
- 239000012669 liquid formulation Substances 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 229910052752 metalloid Inorganic materials 0.000 description 1
- 150000002738 metalloids Chemical class 0.000 description 1
- ZMVMYBGDGJLCHV-UHFFFAOYSA-N n-methyl-4-[[4-(methylamino)phenyl]methyl]aniline Chemical compound C1=CC(NC)=CC=C1CC1=CC=C(NC)C=C1 ZMVMYBGDGJLCHV-UHFFFAOYSA-N 0.000 description 1
- 125000000449 nitro group Chemical group [O-][N+](*)=O 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- DHEHEJGXTUCSQF-UHFFFAOYSA-N oxiran-2-ylmethyl 2-ethyl-2,5-dimethylhexanoate Chemical compound CC(C)CCC(C)(CC)C(=O)OCC1CO1 DHEHEJGXTUCSQF-UHFFFAOYSA-N 0.000 description 1
- 125000005704 oxymethylene group Chemical group [H]C([H])([*:2])O[*:1] 0.000 description 1
- NFHFRUOZVGFOOS-UHFFFAOYSA-N palladium;triphenylphosphane Chemical compound [Pd].C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 NFHFRUOZVGFOOS-UHFFFAOYSA-N 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 125000000538 pentafluorophenyl group Chemical group FC1=C(F)C(F)=C(*)C(F)=C1F 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 150000004714 phosphonium salts Chemical class 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920002755 poly(epichlorohydrin) Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 239000001294 propane Substances 0.000 description 1
- 229960004063 propylene glycol Drugs 0.000 description 1
- 235000013772 propylene glycol Nutrition 0.000 description 1
- LVTJOONKWUXEFR-FZRMHRINSA-N protoneodioscin Natural products O(C[C@@H](CC[C@]1(O)[C@H](C)[C@@H]2[C@]3(C)[C@H]([C@H]4[C@@H]([C@]5(C)C(=CC4)C[C@@H](O[C@@H]4[C@H](O[C@H]6[C@@H](O)[C@@H](O)[C@@H](O)[C@H](C)O6)[C@@H](O)[C@H](O[C@H]6[C@@H](O)[C@@H](O)[C@@H](O)[C@H](C)O6)[C@H](CO)O4)CC5)CC3)C[C@@H]2O1)C)[C@H]1[C@H](O)[C@H](O)[C@H](O)[C@@H](CO)O1 LVTJOONKWUXEFR-FZRMHRINSA-N 0.000 description 1
- 125000004309 pyranyl group Chemical group O1C(C=CC=C1)* 0.000 description 1
- 125000004076 pyridyl group Chemical group 0.000 description 1
- 229910052761 rare earth metal Inorganic materials 0.000 description 1
- 150000002910 rare earth metals Chemical class 0.000 description 1
- 230000006798 recombination Effects 0.000 description 1
- 238000005215 recombination Methods 0.000 description 1
- 239000012763 reinforcing filler Substances 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 238000010022 rotary screen printing Methods 0.000 description 1
- 229910052706 scandium Inorganic materials 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 150000003342 selenium Chemical class 0.000 description 1
- 239000011669 selenium Substances 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 238000007764 slot die coating Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000000600 sorbitol Substances 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 125000001424 substituent group Chemical group 0.000 description 1
- PXQLVRUNWNTZOS-UHFFFAOYSA-N sulfanyl Chemical class [SH] PXQLVRUNWNTZOS-UHFFFAOYSA-N 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 230000002195 synergetic effect Effects 0.000 description 1
- 229910052714 tellurium Inorganic materials 0.000 description 1
- PORWMNRCUJJQNO-UHFFFAOYSA-N tellurium atom Chemical compound [Te] PORWMNRCUJJQNO-UHFFFAOYSA-N 0.000 description 1
- 238000001029 thermal curing Methods 0.000 description 1
- 125000001544 thienyl group Chemical group 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 150000004992 toluidines Chemical class 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
- 239000013638 trimer Substances 0.000 description 1
- 229910052720 vanadium Inorganic materials 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical class O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
- C09D183/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
- C08L83/06—Polysiloxanes containing silicon bound to oxygen-containing groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P20/00—Technologies relating to chemical industry
- Y02P20/50—Improvements relating to the production of bulk chemicals
- Y02P20/582—Recycling of unreacted starting or intermediate materials
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Epoxy Resins (AREA)
- Polyethers (AREA)
- Silicon Polymers (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Polymerisation Methods In General (AREA)
Description
表面のパターン形成と形状形成を行い、マイクロレンズを使用するには、かなり複雑でコストのかかる装備が必要となる。さらに、このような技術を、より大きなスケールにてコスト効率の良い仕方で再現することは困難である。マイクロレンズは、かなり高価であり、広い面積に対して再現するのが極めて困難である。マイクロレンズは、塗布可能な溶液中に組み込むことができない。マイクロレンズは、注意深いデリケートな積層プロセスを通してのみ素子中に組み込むことができる。
本発明の好ましい実施態様によれば、硬化性組成物の成分A及び/又は成分Bにおけるx及び/又はyは1である。
本発明の好ましい実施態様によれば、硬化性組成物の成分A及び/又は成分BにおけるPa及び/又はPbは脂環式エポキシ基である。
本発明の好ましい実施態様によれば、硬化性組成物の成分Aはビス[2−(3,4−エポキシシクロヘキシル)エチル]テトラメチルジシロキサンである。
(A) 式(I)のオルガノシロキサン成分A
本発明によれば、硬化性樹脂組成物は、下記の式(I)
本発明によれば、硬化性樹脂組成物は、下記の式(II)
本発明によれば、硬化性樹脂組成物は、シロキサン基のない少なくとも1種のカチオン硬化可能な有機成分Cを含む。
エタンジオールジ(3,4−エポキシシクロヘキシルメチル)エーテル、ビニルシクロヘキセンジオキシド、ジシクロペンタジエンエポキシド、または2−(3,4−エポキシシクロヘキシル−5,5−スピロ−3,4−エポキシ)シクロヘキサン−1,3−ジオキサンなどがある。
エチルジエチレングリコール(3−エチル−3−オキセタニルメチル)エーテル、ジシクロペンタジエン(3−エチル−3−オキセタニルメチル)エーテル、ジシクロペンテニルオキシエチル(3−エチル−3−オキセタニルメチル)エーテル、ジシクロペンテニル(3−エチル−3−オキセタニルメチル)エーテル、テトラヒドロフルフリル(3−エチル−3−オキセタニルメチル)エーテル、テトラブロモフェニル(3−エチル−3−オキセタニルメチル)エーテル、2−テトラブロモフェノキシエチル(3−エチル−3−オキセタニルメチル)エーテル、トリブロモフェニル(3−エチル−3−オキセタニルメチル)エーテル、2−トリブロモフェノキシエチル(3−エチル−3−オキセタニルメチル)エーテル、2−ヒドロキシエチル(3−エチル−3−オキセタニルメチル)エーテル、
2−ヒドロキシプロピル(3−エチル−3−オキセタニルメチル)エーテル、ブトキシエチル(3−エチル−3−オキセタニルメチル)エーテル、ペンタクロロフェニル(3−エチル−3−オキセタニルメチル)エーテル、ペンタブロモフェニル(3−エチル−3−オキセタニルメチル)エーテル、およびボルニル(3−エチル−3−オキセタニルメチル)エーテル等。本発明において使用することができる、化合物中に2つ以上のオキセタン環を有する化合物の例としては、3,7−ビス(3−オキセタニル)−5−オキサ−ノナン、3,3’−(1,3−(2−メチレニル)プロパンジイルビス(オキシメチレン))ビス(3−エチルオキセタン)、1,4−ビス[(3−エチル−3−オキセタニルメトキシ)メチル]ベンゼン、1,2−ビス[(3−エチル−3−オキセタニルメトキシ)メチル]エタン、1,3−ビス[(3−エチル−3−オキセタニルメトキシ)メチル]プロパン、エチレングリコールビス(3−エチル−3−オキセタニルメチル)エーテル、ジシクロペンテニルビス(3−エチル−3−オキセタニルメチル)エーテル、トリエチレングリコールビス(3−エチル−3−オキセタニルメチル)エーテル、テトラエチレングリコールビス(3−エチル−3−オキセタニルメチル)エーテル、トリシクロデカンジイルジメチレン(3−エチル−3−オキセタニルメチル)エーテル、トリメチロールプロパントリス(3−エチル−3−オキセタニルメチル)エーテル、1,4−ビス(3−エチル−3−オキセタニルメトキシ)ブタン、1,6−ビス(3−エチル−3−オキセタニルメトキシ)ヘキサン、ペンタエリスリトールトリス(3−エチル−3−オキセタニルメチル)エーテル、ペンタエリスリトールテトラキス(3−エチル−3−オキセタニルメチル)エーテル、ポリエチレングリコールビス(3−エチル−3−オキセタニルメチル)エーテル、ジペンタエリスリトールヘキサキス(3−エチル−3−オキセタニルメチル)エーテル、ジペンタエリスリトールペンタキス(3−エチル−3−オキセタニルメチル)エーテル、ジペンタエリスリトールテトラキス(3−エチル−3−オキセタニルメチル)エーテル、カプロラクトン変性ジペンタエリスリトールヘキサキス(3−エチル−3−オキセタニルメチル)エーテル、カプロラクトン変性ジペンタエリスリトールペンタキス(3−エチル−3−オキセタニルメチル)エーテル、ジトリメチロールプロパンテトラキス(3−エチル−3−オキセタニルメチル)エーテル、EO−変性ビスフェノールAビス(3−エチル−3−オキセタニルメチル)エーテル、PO−変性ビスフェノールAビス(3−エチル−3−オキセタニルメチル)エーテル、EO−変性水素化ビスフェノールAビス(3−エチル−3−オキセタニルメチル)エーテル、PO−変性水素化ビスフェノールAビス(3−エチル−3−オキセタニルメチル)エーテル、およびEO−変性ビスフェノールF(3−エチル−3−オキセタニルメチル)エーテル等がある。市販のオキセタン化合物としては、Perstorp社から市販のトリメチロールプロパンオキセタン(TMPO)、ならびに東亜合成(株)から市販のアロンオキセタンOXT−101、OXT−121、OXT−212、およびOXT−221がある。
本発明によれば、硬化性組成物は少なくともカチオン性開始剤Dを含む。開始剤は、異なる開始剤及び/又は増感剤の組み合わせ物を含む開始系であってよい。しかしながら開始系はさらに、単独で使用したときには全く開始特性を示さないが、組み合わせて使用したときには開始特性を示す、異なる化合物の組み合わせ物を含む系であってよい。カチオン性開始剤は、カチオン性光開始剤であってもよいし、あるいは熱及び/又は温度の作用によって活性化されてもよい。
一般には、カチオン硬化可能な樹脂中に含まれる熱により活性化可能なカチオン性開始剤の量は、カチオン重合可能な樹脂の量を基準として0.05〜30重量%(好ましくは0.5〜15重量%)である。
(1) 紫外(UV)線によって硬化可能な光硬化性組成物であって、
(A)下記の式(I)
で示される少なくとも1種のオルガノシロキサン成分A;
(B)下記の式(II)
で示される少なくとも1種の第2のオルガノシロキサン成分B;
(C)シロキサン基のない少なくとも1種のエポキシ成分及び/又はオキセタン成分C;および
(D)少なくとも1種のカチオン性光開始剤D;
を含む上記光硬化性組成物。
(2) 硬化性組成物の総重量を基準として、A)15〜75重量%の、好ましくは35〜55重量%の成分A;B)15〜75重量%の、好ましくは35〜55重量%の成分B;C)1〜40重量%の、好ましくは5〜15重量%の成分C;およびD)0.1〜10重量%の、好ましくは1.5〜5重量%の成分D;を含む、(1)に記載の硬化性組成物。
(3) 硬化性組成物の総重量を基準として、A)25〜65重量%の成分A;B)25〜65重量%の成分B;C)3〜25重量%の成分C;およびD)1〜7重量%の成分D;を含む、(1)に記載の硬化性組成物。
(4) 成分Bにおけるnが、7〜200の範囲の整数であり、好ましくは7〜100の範囲の整数であり、さらに好ましくは7〜50の範囲の整数である、(1)〜(3)のいずれかに記載の硬化性組成物。
(5) 成分Aまたは成分Bにおけるxとyが1である、(1)〜(4)のいずれかに記載の硬化性組成物。
(6) 成分Aまたは成分BにおけるPaとPbがエポキシ基である、(1)〜(5)のいずれかに記載の硬化性組成物。
(7) 成分Aまたは成分BにおけるPaとPbが脂環式エポキシ基である、(1)〜(6)のいずれかに記載の硬化性組成物。
(8) 成分Aまたは成分BにおけるR 1 とR 2 が1〜3個のC原子を有する直鎖状脂肪族基である、(1)〜(7)のいずれかに記載の硬化性組成物。
(9) 成分Aがビス[2−(3,4−エポキシシクロヘキシル)エチル]テトラメチルジシロキサンである、(1)〜(8)のいずれかに記載の硬化性組成物。
(10) 成分BにおけるPaとPbがエポキシシクロヘキシル基であり、成分BにおけるR 1 、R 2 、R 3 、およびR 4 がメチル基である、(1)〜(9)のいずれかに記載の硬化性組成物。
(11) 成分Cが、2つのエポキシ基を有する脂環式エポキシ樹脂、水素化ビスフェノールAのジグリシジルエーテル、およびトリメチロールプロパンオキセタンの群から選ばれる、(1)〜(10)のいずれかに記載の硬化性組成物。
(12) 不透明で光透過性の層の製造方法であって、a)(1)〜(11)のいずれかに記載の硬化性組成物の、5〜300マイクロメートルの厚さを有する層を供給する工程;およびb)該層を紫外線及び/又は熱で硬化させる工程;を含む上記製造方法。
(13) (12)に記載の方法に従って得られる不透明で光透過性の層、または(1)〜(11)のいずれかに記載の硬化組成物。
(14) 400〜700nmの範囲の光波長範囲において70%より高い光透過率を示し、これにより400〜700nmの範囲の光波長範囲における拡散透過光/全透過光の比率が90%より高い、(13)に記載の不透明で光透過性の層。
実施例に示されている配合物は、複数種の成分を、マグネチックスターラー(Heidolph MR Hei−End)を使用して500rpmで10分混合することによって作製される。
成分を混合した後、配合物を、プラスチックピペットを使用するバーコーター(RKコントロールコーター)によりポリカーボネート基板(Makrofol DE)上に塗布し、次いでワイヤーバーを使用して、フィルムとして施した。次いでこのフィルムを、UVAを使用するUVオーブン中で3J/cm2にて硬化させた(Dr. Grobel UV-Mat)。最後に、コーティングをポリカーボネート基板からはがした。
AFMによる測定は、SMENA走査ヘッドを取り付けたNT−MDT原子間力顕微鏡を使用して、セミコンタクトモード(1Hzの周波数および30×30ミクロンのスキャン)で操作して行った。
全透過光と拡散透過光は、150mmのインテグレーテッド・スフィア(integrared sphere)を取り付けたPerkin Elmer Lambda 900スペクトロメータを使用して、30マイクロメートル厚さのフィルムに対して測定した。全透過光の測定の場合は、フィルムをスフィアの前に置いた。フィルムの光透過率は、フィルムを通った全透過光とフィルム自体への入射光との比である。拡散透過光の測定に対しては、インテグレーティング・スフィア(integrating sphere)の孔を通過する正透過光(specular transmitted light)だけを測定するために、フィルムを、インテグレーティング・スフィアの孔から670mm離して配置した。正反射(specular)は、直接透過成分(散乱なしで透過した光)と呼ばれる。次いで拡散透過光を、全透過光と正透過光との間の差として算出した。図1は、表IのF1〜F12の硬化性組成物を硬化させることによって得られる異なった層に対する、400〜800nmの光波長範囲における拡散透過光/全透過光の実測比を示す。図1bisは、表IのF1〜F12の硬化性組成物を硬化させることによって得られる異なった層に対する、400〜800nmの光波長範囲における実測全透過光を示す。
発光素子及び/又はOLEDを製造するには、a)本発明の硬化性組成物の5〜300μmの厚さを有する層を供給する工程;およびb)該層を紫外線および/又は熱で硬化させる工程;を含む、不透明で光透過性の層の製造法を使用するのが好ましい。
Claims (8)
- 紫外(UV)線によって硬化可能な光硬化性組成物であって、
(A)下記の式(I)
で示される少なくとも1種のオルガノシロキサン成分A;
(B)下記の式(II)
で示される少なくとも1種の第2のオルガノシロキサン成分Bであって、下記から選択される成分B:
エポキシプロポキシプロピル末端ポリジメチルシロキサン、
エポキシプロポキシプロピル末端ポリフェニルメチルシロキサン、
(エポキシプロポキシプロピル)ジメトキシシリル末端ポリジメチルシロキサン、
モノ−(2,3−エポキシ)プロピルエーテル末端ポリジメチルシロキサン、および
エポキシシクロヘキシルエチル末端ポリジメチルシロキサン;
(C)シロキサン基のない少なくとも1種のエポキシ成分及び/又はオキセタン成分C;および
(D)少なくとも1種のカチオン性光開始剤D;
を含む上記光硬化性組成物。 - 硬化性組成物の総重量を基準として、(A)15〜75重量%の成分A;(B)15〜75重量%の成分B;(C)1〜40重量%の成分C;および(D)0.1〜10重量%の成分D;を含む、請求項1に記載の硬化性組成物。
- 成分Aが、ビス[2−(3,4−エポキシシクロヘキシル)エチル]テトラメチルジシロキサンである、請求項1または2に記載の硬化性組成物。
- 成分BにおけるPaとPbがエポキシシクロヘキシル基であり、成分BにおけるR1、R2、R3およびR4がメチル基である、請求項1〜3のいずれかに記載の硬化性組成物。
- 成分Cが、2つのエポキシ基を有する脂環式エポキシ樹脂、水素化ビスフェノールAのジグリシジルエーテル、およびトリメチロールプロパンオキセタンの群から選ばれる、請求項1〜4のいずれかに記載の硬化性組成物。
- 400〜700nmの光波長範囲において70%より高い光透過率を示す層の製造方法であって、
a)請求項1〜5のいずれかに記載の硬化性組成物の、5〜300マイクロメートルの厚さを有する層を供給する工程;および
b)該層を紫外線及び/又は熱で硬化させる工程;
を含む上記製造方法。 - 請求項6に記載の方法に従って得られる層。
- 請求項1〜5のいずれかに記載の硬化性組成物を硬化して得られる硬化組成物。
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Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2383817A1 (en) * | 2010-04-29 | 2011-11-02 | Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO | Light-emitting device and method for manufacturing the same |
US10858539B2 (en) | 2012-06-12 | 2020-12-08 | Korea Advanced Institute Of Science And Technology | Siloxane hard-coating resin composition |
US9617449B2 (en) | 2012-06-12 | 2017-04-11 | Korea Advanced Institute Of Science And Technology | Siloxane hard coating resin |
US20140057115A1 (en) * | 2012-08-22 | 2014-02-27 | The Walman Optical Company | Coating composition and method |
KR101405532B1 (ko) * | 2013-10-29 | 2014-06-20 | 주식회사 네패스신소재 | 에폭시 수지 조성물 및 이를 포함하는 광반도체 장치 |
EP3486286B1 (en) * | 2013-12-26 | 2020-05-13 | Daicel Corporation | Curable composition for lens, lens and optical device |
WO2015129503A1 (ja) * | 2014-02-28 | 2015-09-03 | 株式会社ダイセル | 硬化性組成物及びその硬化物、並びにウェハレベルレンズ |
CN114479010A (zh) * | 2014-08-08 | 2022-05-13 | 株式会社大赛璐 | 具有特殊形状的环氧树脂成型物、以及具备该成型物的光学装置 |
US11198795B2 (en) | 2015-02-17 | 2021-12-14 | The Walman Optical Company | Glycidyl ether based optical coating compositions |
JP6200591B2 (ja) * | 2015-04-17 | 2017-09-20 | 積水化学工業株式会社 | インクジェット塗布用電子デバイス用封止剤及び電子デバイスの製造方法 |
KR101934266B1 (ko) * | 2015-07-29 | 2019-01-03 | 삼성에스디아이 주식회사 | 윈도우 필름용 조성물, 이로부터 형성된 플렉시블 윈도우 필름 및 이를 포함하는 플렉시블 디스플레이 장치 |
KR101840219B1 (ko) * | 2015-08-31 | 2018-03-20 | 삼성에스디아이 주식회사 | 저온 경화 조성물, 그로부터 형성된 경화막, 및 상기 경화막을 갖는 전자 장치 |
TWI575016B (zh) * | 2015-12-03 | 2017-03-21 | 財團法人工業技術研究院 | 環氧樹脂組成物及包含該組成物之熱介面材料 |
JP7010824B2 (ja) * | 2017-06-07 | 2022-01-26 | 積水化学工業株式会社 | 有機el表示素子用封止剤 |
EP3460959A1 (de) * | 2017-09-20 | 2019-03-27 | Siemens Aktiengesellschaft | Elektrisches isolationsmaterial und/oder imprägnierharz für die wickelbandisolierung einer mittel- und/oder hochspannungsmaschine sowie ein isolationssystem daraus |
CN107955581B (zh) * | 2017-11-21 | 2020-08-14 | 黑龙江省科学院石油化学研究院 | 一种环氧有机硅改性光固化led封装胶及其制备方法 |
KR102657208B1 (ko) * | 2017-12-15 | 2024-04-12 | 세키스이가가쿠 고교가부시키가이샤 | 전자 디바이스용 봉지제 및 유기 el 표시 소자용 봉지제 |
WO2019117298A1 (ja) * | 2017-12-15 | 2019-06-20 | 積水化学工業株式会社 | 電子デバイス用封止剤及び有機el表示素子用封止剤 |
JP6904245B2 (ja) * | 2017-12-27 | 2021-07-14 | 信越化学工業株式会社 | 感光性樹脂組成物、パターン形成方法、及び光半導体素子の製造方法 |
KR20220078629A (ko) | 2019-10-03 | 2022-06-10 | 다우 실리콘즈 코포레이션 | 자외선 경화성 오가노폴리실록산 조성물 및 그의 용도 |
TWI819546B (zh) * | 2022-03-29 | 2023-10-21 | 國立高雄科技大學 | 矽氧烷官能團環氧樹脂光固化物之抗腐蝕塗層製備方法 |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4058401A (en) | 1974-05-02 | 1977-11-15 | General Electric Company | Photocurable compositions containing group via aromatic onium salts |
US4336363A (en) | 1979-02-12 | 1982-06-22 | General Electric Company | Heat curable compositions containing sulfonium salts |
US4393185A (en) | 1981-06-02 | 1983-07-12 | Ciba-Geigy Corporation | Thermally polymerizable mixtures and processes for the thermally-initiated polymerization of cationically polymerizable compounds |
EP0379464B1 (de) | 1989-01-16 | 1993-02-10 | Ciba-Geigy Ag | Araliphatische Sulfoniumsalze und deren Verwendung |
CA2008848A1 (en) * | 1989-03-30 | 1990-09-30 | Karen D. Riding | Epoxysiloxane cure promoters and accelerators for cationic uv cure systems |
FR2688790B1 (fr) | 1992-03-23 | 1994-05-13 | Rhone Poulenc Chimie | Compositions a base de polyorganosiloxanes a groupements fonctionnels reticulables et leur utilisation pour la realisation de revetements anti-adhesifs. |
TW237466B (ja) | 1992-07-21 | 1995-01-01 | Giba Gerigy Ag | |
ES2134425T3 (es) | 1994-03-16 | 1999-10-01 | Ciba Sc Holding Ag | Sistemas de resina epoxidica de un solo componente para el procedimiento de goteo y el procedimiento de inmersion por rotacion en caliente. |
JP3465452B2 (ja) * | 1995-11-20 | 2003-11-10 | 東洋インキ製造株式会社 | 紫外線硬化型樹脂組成物およびこれを含む被覆剤 |
FR2791995B1 (fr) * | 1999-04-06 | 2001-07-06 | Rhodia Chimie Sa | Composition silicone utile notamment pour la realisation de vernis anti-friction, procede d'application de ce vernis sur un support et support ainsi traite |
US7012363B2 (en) | 2002-01-10 | 2006-03-14 | Universal Display Corporation | OLEDs having increased external electroluminescence quantum efficiencies |
US7279260B2 (en) * | 2002-06-12 | 2007-10-09 | Ricoh Company, Ltd. | Electrophotographic photoconductor having a crosslinked resin layer and method of preparing an electrophotographic photoconductor |
JP4350996B2 (ja) | 2002-11-26 | 2009-10-28 | 日東電工株式会社 | 有機エレクトロルミネッセンス素子、面光源および表示装置 |
FR2849446B1 (fr) * | 2002-12-26 | 2006-07-28 | Rhodia Chimie Sa | Vernis anti-salissures, procede d'application de ce vernis sur un support silicone et support ainsi traite |
WO2006085839A1 (en) * | 2005-01-31 | 2006-08-17 | Polyset Company, Inc. | Solventless, non-polluting radiation curable coatings |
JP2007009086A (ja) * | 2005-06-30 | 2007-01-18 | Toagosei Co Ltd | カチオン硬化性組成物 |
DE102007040246A1 (de) * | 2007-08-25 | 2009-02-26 | Evonik Degussa Gmbh | Strahlenhärtbare Formulierungen |
JP4707729B2 (ja) * | 2008-03-31 | 2011-06-22 | 信越化学工業株式会社 | 剥離紙用低粘度紫外線硬化型シリコーン組成物 |
-
2011
- 2011-02-09 CA CA2796076A patent/CA2796076A1/en not_active Abandoned
- 2011-02-09 CN CN201180021346.4A patent/CN102971382B/zh not_active Expired - Fee Related
- 2011-02-09 EP EP11702272A patent/EP2563862A1/en not_active Withdrawn
- 2011-02-09 JP JP2013506549A patent/JP5736033B2/ja not_active Expired - Fee Related
- 2011-02-09 KR KR1020127027198A patent/KR20130069574A/ko not_active Application Discontinuation
- 2011-02-09 MA MA35319A patent/MA34165B1/fr unknown
- 2011-02-09 US US13/643,560 patent/US20130203882A1/en not_active Abandoned
- 2011-02-09 WO PCT/EP2011/051907 patent/WO2011134686A1/en active Application Filing
- 2011-02-09 SG SG2012079448A patent/SG185053A1/en unknown
- 2011-04-27 TW TW100114611A patent/TWI509025B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
CN102971382B (zh) | 2015-07-08 |
CN102971382A (zh) | 2013-03-13 |
SG185053A1 (en) | 2012-12-28 |
JP2013525551A (ja) | 2013-06-20 |
MA34165B1 (fr) | 2013-04-03 |
CA2796076A1 (en) | 2011-11-03 |
KR20130069574A (ko) | 2013-06-26 |
TWI509025B (zh) | 2015-11-21 |
TW201211160A (en) | 2012-03-16 |
US20130203882A1 (en) | 2013-08-08 |
EP2563862A1 (en) | 2013-03-06 |
WO2011134686A1 (en) | 2011-11-03 |
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