JP5735085B2 - プレス装置 - Google Patents
プレス装置 Download PDFInfo
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- JP5735085B2 JP5735085B2 JP2013250259A JP2013250259A JP5735085B2 JP 5735085 B2 JP5735085 B2 JP 5735085B2 JP 2013250259 A JP2013250259 A JP 2013250259A JP 2013250259 A JP2013250259 A JP 2013250259A JP 5735085 B2 JP5735085 B2 JP 5735085B2
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Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/49105—Connecting at different heights
- H01L2224/49107—Connecting at different heights on the semiconductor or solid-state body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/078—Adhesive characteristics other than chemical
- H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
- H01L2924/07811—Extrinsic, i.e. with electrical conductive fillers
Landscapes
- Press Drives And Press Lines (AREA)
- Wire Bonding (AREA)
- Control Of Presses (AREA)
Description
21、21A、21B 粒子部材(バンプ)
22a 下端平坦面
22 上プレスヘッド
23 下プレスヘット
24 位置把握手段
25 上下動機構
26 水晶圧電式センサ
27 圧力制御手段
28 サーボプレス
101、102 形成体チャック機構
105 位置補正機構
N 搬送機構
U プレスユニット
Claims (7)
- 上プレスヘッドと下プレスヘッドとを有し、下プレスヘッドにて受けられた粒子部材形成体に形成される粒子部材の内で特定の粒子部材を押圧するプレスユニットを複数機備えたプレス装置であって、
各プレスユニットのプレス位置において、特定の粒子部材の頂部のみを上プレスヘッドの下端平坦面で押圧するように粒子部材形成体の位置を認識し、補正する機構を備えたことを特徴とするプレス装置。 - 粒子部材が形成された粒子部材形成体を各プレスユニットのプレス位置にそれぞれ搬送する搬送機構を備えたことを特徴とする請求項1に記載のプレス装置。
- 各搬送機構は、一対の形成体チャック機構を有し、一方の形成体チャック機構にて粒子部材形成体をプレス位置に供給した状態で、他方の形成体チャック機構にて粒子部材形成体をプレス位置から送出した状態とし、他方の形成体チャック機構にて粒子部材形成体をプレス位置に供給した状態で、一方の形成体チャック機構にて粒子部材形成体をプレス位置から送出した状態とすることを特徴とする請求項1又は請求項2に記載のプレス装置。
- 各プレスユニットは、下端平坦面を有する上プレスヘッドと、この上プレスヘッドを上下動させる上下動機構と、上プレスヘッドによる押圧力を検出する水晶圧電式センサと、この水晶圧電式センサにて検出した押圧力に基づいて前記上下動機構を制御する圧力制御手段とを備え、前記上下動機構を、駆動源をサーボモータとするサーボプレスにて構成したことを特徴とする請求項1〜請求項3のいずれか1項に記載のプレス装置。
- 各プレスユニットは、下端平坦面を有する上プレスヘッドと、この上プレスヘッドを上下動させる上下動機構とを備え、上下動機構によって上プレスヘッドを下降させて、粒子部材形成体に形成された粒子部材をこのプレスヘッドで押圧するプレス装置であって、前記上下動機構を、駆動源をサーボモータを用いてこのサーボモータで制御されるサーボプレスにて構成し、かつ、前記粒子部材形成体と前記上プレスヘッドの下端平坦面との間の位置関係を把握する位置把握手段を備え、前記サーボプレスによる荷重制御と、位置把握手段による位置制御とを行うことを特徴とする請求項1〜請求項3のいずれか1項に記載のプレス装置。
- 粒子部材形成体に形成された粒子部材の頂部を上プレスヘッドの下端平坦面で押圧して平坦化するコイニングに用いることを特徴とする請求項1〜請求項5のいずれか1項に記載のプレス装置。
- 発光素子の電極と基板側電極との間に介在される粒子部材にて導通した状態で異方性導電接着剤を介して発光素子と基板側電極とを接着するフリップチップ実装に用いることを特徴とする請求項1〜請求項5のいずれか1項に記載のプレス装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013250259A JP5735085B2 (ja) | 2012-12-04 | 2013-12-03 | プレス装置 |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012265335 | 2012-12-04 | ||
JP2012265335 | 2012-12-04 | ||
JP2013250259A JP5735085B2 (ja) | 2012-12-04 | 2013-12-03 | プレス装置 |
Publications (2)
Publication Number | Publication Date |
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JP2014132650A JP2014132650A (ja) | 2014-07-17 |
JP5735085B2 true JP5735085B2 (ja) | 2015-06-17 |
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JP2013250259A Active JP5735085B2 (ja) | 2012-12-04 | 2013-12-03 | プレス装置 |
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JP (1) | JP5735085B2 (ja) |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3166374B2 (ja) * | 1993-01-27 | 2001-05-14 | 三菱電機株式会社 | プリント配線板のパッド平坦化方法および平坦化装置 |
JPH10163215A (ja) * | 1996-12-05 | 1998-06-19 | Matsushita Electric Ind Co Ltd | バンプレベリング装置及びその方法 |
JP2885283B2 (ja) * | 1996-12-27 | 1999-04-19 | 日本電気株式会社 | フリップチップ接続用回路素子 |
JP4057261B2 (ja) * | 2001-08-09 | 2008-03-05 | 松下電器産業株式会社 | 半導体装置及びその製造方法 |
JP2009231762A (ja) * | 2008-03-25 | 2009-10-08 | Sharp Corp | 半導体チップの組立装置 |
JP2012099719A (ja) * | 2010-11-04 | 2012-05-24 | Maxis-Shinto Corp | バンプコイニングヘッド |
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