JP5730981B2 - プレス装置 - Google Patents
プレス装置 Download PDFInfo
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- JP5730981B2 JP5730981B2 JP2013250256A JP2013250256A JP5730981B2 JP 5730981 B2 JP5730981 B2 JP 5730981B2 JP 2013250256 A JP2013250256 A JP 2013250256A JP 2013250256 A JP2013250256 A JP 2013250256A JP 5730981 B2 JP5730981 B2 JP 5730981B2
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- 238000010438 heat treatment Methods 0.000 claims description 54
- 238000003825 pressing Methods 0.000 claims description 54
- 239000002245 particle Substances 0.000 claims description 42
- 239000000758 substrate Substances 0.000 claims description 39
- 239000000853 adhesive Substances 0.000 claims description 31
- 230000001070 adhesive effect Effects 0.000 claims description 31
- 239000011148 porous material Substances 0.000 claims description 20
- 238000003780 insertion Methods 0.000 claims description 4
- 230000037431 insertion Effects 0.000 claims description 4
- 238000007599 discharging Methods 0.000 claims description 3
- 230000015572 biosynthetic process Effects 0.000 claims description 2
- 230000013011 mating Effects 0.000 claims description 2
- 238000000034 method Methods 0.000 description 18
- 239000000463 material Substances 0.000 description 10
- 238000006073 displacement reaction Methods 0.000 description 9
- 230000001105 regulatory effect Effects 0.000 description 7
- 239000010453 quartz Substances 0.000 description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 6
- 239000004840 adhesive resin Substances 0.000 description 5
- 229920006223 adhesive resin Polymers 0.000 description 5
- 238000007664 blowing Methods 0.000 description 5
- 239000013078 crystal Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 5
- 230000002093 peripheral effect Effects 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 238000002788 crimping Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 238000013459 approach Methods 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 239000000470 constituent Substances 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 230000002277 temperature effect Effects 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- -1 chip resistor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000012798 spherical particle Substances 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/49105—Connecting at different heights
- H01L2224/49107—Connecting at different heights on the semiconductor or solid-state body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/078—Adhesive characteristics other than chemical
- H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
- H01L2924/07811—Extrinsic, i.e. with electrical conductive fillers
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- Led Device Packages (AREA)
- Wire Bonding (AREA)
Description
圧力を加えるものがある。
下プレスヘッドは、上面に凹球面を有する下部材と、下面に前記下部材の凹球面に嵌合する凸球面を有する上部材と、上部材の凸球面と下部材の凹球面との間にエアを供給するエア供給・吸引機構と、上部材の外側から押圧して、下部材に対する上部材の位置を固定する固定機構とを有する倣い手段を備え、下部材の凹球面に上部材の凸球面を嵌合させてこれらの間にエアを供給した状態で、上プレスヘッドを下降させて、上プレスヘッドの下端平坦面にて上部材の上面平坦面を押圧して上プレスヘッドと下プレスヘッドとの平行出しを行い、この平行出し状態で凹球面と凸球面との間のエアの排出・吸引により上部材の下部材に対する位置固定を行い、前記エア供給・吸引機構は、前記下部材の少なくとも凹球面形成部位が多孔質材料で構成され、この多孔質材料を介して凹球面と凸球面との間にエアを供給するものである。
21 粒子部材(バンプ)
22a 下端平坦面
22 上プレスヘット
23 下プレスヘット
29、30 加熱体
40 ねじ構造体
41 下部材
42 凹球面
43 凸球面
44 上部材
44a 上面平坦面
45 エア供給・吸引機構
46 固定機構
56 固定部
71a、71b ピン部材
72a、72b 係合部材
73a、73b 規制部材
74 コの字体嵌合部
75 ボール
76 ボールプランジャ
R ロック機構
Claims (9)
- 上プレスヘッドと、下プレスヘッドと、下プレスヘッドにて受けられた粒子部材形成体に形成される粒子部材を押圧するプレス装置であって、
下プレスヘッドは、上面に凹球面を有する下部材と、下面に前記下部材の凹球面に嵌合する凸球面を有する上部材と、上部材の凸球面と下部材の凹球面との間にエアを供給するエア供給・吸引機構と、上部材の外側から押圧して、下部材に対する上部材の位置を固定する固定機構とを有する倣い手段を備え、下部材の凹球面に上部材の凸球面を嵌合させてこれらの間にエアを供給した状態で、上プレスヘッドを下降させて、上プレスヘッドの下端平坦面にて上部材の上面平坦面を押圧して上プレスヘッドと下プレスヘッドとの平行出しを行い、この平行出し状態で凹球面と凸球面との間のエアの排出・吸引により上部材の下部材に対する位置固定を行い、前記エア供給・吸引機構は、前記下部材の少なくとも凹球面形成部位が多孔質材料で構成され、この多孔質材料を介して凹球面と凸球面との間にエアを供給することを特徴とするプレス装置。 - 多孔質材料は、少なくとも装置使用時に負荷される垂直荷重に対応する受け面積と厚みを有することを特徴とする請求項1に記載のプレス装置。
- 固定機構は、下部材側の固定部に装着されて、螺進退によって上部材に対してその外側から接近・離間する耐偏荷重用のねじ構造体にて構成されることを特徴とする請求項1又は請求項2に記載のプレス装置。
- 上プレスヘッドと、下プレスヘッドと、下プレスヘッドを加熱する加熱体とを備えたプレス装置であって、
下プレスヘッドが加熱体上に載置された状態で下プレスヘッドと加熱体とがロックされるロック機構を備え、このロック機構は、ピン部材と、下プレスヘッドの時計回り又は反時計回りの係合方向の回動でピン部材が係合し、反係合方向の回動でその係合が解除される係合部材とからなることを特徴とする請求項1〜請求項3のいずれか1項に記載のプレス装置。 - ピン部材が下プレスヘッド側に設けられるとともに、係合部材が加熱体側に設けられ、係合部材は、下プレスヘッドの係合方向の回動でピン部材が嵌入し、下プレスヘッドの反係合方向の回動でピン部材の嵌入が解除されるコの字体にて構成されることを特徴とする請求項4に記載のプレス装置。
- 係合部材には、下プレスヘッドの位置ずれを規制する規制部材が付設されることを特徴とする請求項4又は請求項5に記載のプレス装置。
- 規制部材は、ピン部材が嵌入するコの字体嵌合部に突入するボールを有するボールプランジャにて構成されることを特徴とする請求項6に記載のプレス装置。
- 粒子部材形成体に形成された粒子部材の頂部を上プレスヘッドの下端平坦面で押圧して平坦化するコイニングに用いることを特徴とする請求項1〜請求項7のいずれか1項に記載のプレス装置。
- 発光素子の電極と基板側電極との間に介在される粒子部材にて導通した状態で異方性導電接着剤を介して発光素子と基板側電極とを接着するフリップチップ実装に用いることを特徴とする請求項1〜請求項7のいずれか1項に記載のプレス装置。
Priority Applications (1)
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JP2013250256A JP5730981B2 (ja) | 2012-12-04 | 2013-12-03 | プレス装置 |
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JP2012265333 | 2012-12-04 | ||
JP2012265333 | 2012-12-04 | ||
JP2013250256A JP5730981B2 (ja) | 2012-12-04 | 2013-12-03 | プレス装置 |
Publications (2)
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JP2014132649A JP2014132649A (ja) | 2014-07-17 |
JP5730981B2 true JP5730981B2 (ja) | 2015-06-10 |
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Families Citing this family (2)
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JP7053308B2 (ja) * | 2018-02-27 | 2022-04-12 | キヤノンマシナリー株式会社 | プレス装置及びプレス装置調整方法 |
CN113432763B (zh) * | 2021-06-17 | 2023-07-21 | 中北大学 | 夹芯式pvdf压力计真空环境压制装置及方法 |
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JP2012099719A (ja) * | 2010-11-04 | 2012-05-24 | Maxis-Shinto Corp | バンプコイニングヘッド |
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