JP5680735B2 - プレス装置 - Google Patents
プレス装置 Download PDFInfo
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- JP5680735B2 JP5680735B2 JP2013250246A JP2013250246A JP5680735B2 JP 5680735 B2 JP5680735 B2 JP 5680735B2 JP 2013250246 A JP2013250246 A JP 2013250246A JP 2013250246 A JP2013250246 A JP 2013250246A JP 5680735 B2 JP5680735 B2 JP 5680735B2
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/49105—Connecting at different heights
- H01L2224/49107—Connecting at different heights on the semiconductor or solid-state body
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Presses And Accessory Devices Thereof (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Wire Bonding (AREA)
- Led Device Packages (AREA)
Description
痕が発生するおそれがある。また、このような機構では、図例のように、ノックアウトピン60の上下動をガイドするガイド機構等を別途設ける場合があり、いわゆる品対交換が必要となる。さらに、近年のバンプ等のサイズ拡大化によるノックアウトピンの配置スペースの減少化、およびバンプ周囲の接触禁止エリアを有する基板に対応できない。
部材が直接当たるものではないので、バンプ形成体の損傷等を有効に防止できる。
21 粒子部材(バンプ)
22 プレスヘッド
22a 下端平坦面
23 下プレスヘッド
25 上下動機構
26 位置把握手段
28 サーボプレス
29、30 加熱体
37 レーザ変位センサ
40 くさび部材
41 押圧機構
42 断熱材
50 エアブロー手段
M 連結手段
Claims (6)
- 下端平坦面を有する上プレスヘッドと、この上プレスヘッドを上下動させる上下動機構とを備え、上下動機構によって上プレスヘッドを下降させて、粒子部材形成体に形成された粒子部材を押圧するプレス装置であって、
前記上下動機構を、駆動源をサーボモータを用いてこのサーボモータで制御されるサーボプレスにて構成し、かつ、前記粒子部材形成体と前記上プレスヘッドの下端平坦面との間の位置関係を把握する位置把握手段を備え、前記サーボプレスによる押圧時に、プレス荷重と、位置把握手段により把握した位置関係との相関関係の把握を行うことを特徴とするプレス装置。 - 前記位置把握手段の位置把握の基準データは、プレス前の粒子部材形成体の厚さ寸法であることを特徴とする請求項1に記載のプレス装置。
- 上プレスヘッドを加熱する加熱体と、上プレスヘッドと加熱体とを一体化する連結手段とを備え、前記連結手段は、くさび部材と、このくさび部材を外方からプレスヘッド側へ
押圧してくさび部材を介してプレスヘッドを加熱体に密接させる押圧機構とを有すること
特徴とする請求項1又は請求項2に記載のプレス装置。 - 上プレスヘッドと、下プレスヘッドとを備え、プレス後の上プレスヘッド上昇時に、バンプ形成体に対して上方側からエアを吹き付けてこの粒子部材形成体を下ヘッド側に残すエアブロー手段を設け、このエアブロー手段は、粒子部材形成体の外縁部に対して直接的にエアをブローすることを特徴とする請求項1〜請求項3のいずれか1項に記載のプレス装置。
- 粒子部材形成体に形成された粒子部材の頂部を上プレスヘッドの下端平坦面で押圧して平坦化するコイニングに用いることを特徴とする請求項1〜請求項4のいずれかの1項のプレス装置。
- 発光素子の電極と基板側電極との間に介在される粒子部材にて導通した状態で異方性導電接着剤を介して発光素子と基板側電極とを接着するフリップチップ実装に用いることを特徴とする請求項1〜請求項4のいずれかの1項のプレス装置。
Priority Applications (1)
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JP2013250246A JP5680735B2 (ja) | 2012-12-04 | 2013-12-03 | プレス装置 |
Applications Claiming Priority (3)
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JP2012265329 | 2012-12-04 | ||
JP2012265329 | 2012-12-04 | ||
JP2013250246A JP5680735B2 (ja) | 2012-12-04 | 2013-12-03 | プレス装置 |
Publications (2)
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JP2014132647A JP2014132647A (ja) | 2014-07-17 |
JP5680735B2 true JP5680735B2 (ja) | 2015-03-04 |
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JP2013250246A Active JP5680735B2 (ja) | 2012-12-04 | 2013-12-03 | プレス装置 |
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JP (1) | JP5680735B2 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
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CN113432763B (zh) * | 2021-06-17 | 2023-07-21 | 中北大学 | 夹芯式pvdf压力计真空环境压制装置及方法 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH10189663A (ja) * | 1996-12-26 | 1998-07-21 | Shibuya Kogyo Co Ltd | ボンディング装置 |
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