JP5680736B2 - プレス装置 - Google Patents
プレス装置 Download PDFInfo
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- JP5680736B2 JP5680736B2 JP2013250250A JP2013250250A JP5680736B2 JP 5680736 B2 JP5680736 B2 JP 5680736B2 JP 2013250250 A JP2013250250 A JP 2013250250A JP 2013250250 A JP2013250250 A JP 2013250250A JP 5680736 B2 JP5680736 B2 JP 5680736B2
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- 239000010453 quartz Substances 0.000 claims description 13
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 13
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- 230000000694 effects Effects 0.000 description 4
- 239000011810 insulating material Substances 0.000 description 4
- 238000007747 plating Methods 0.000 description 3
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
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- 239000011347 resin Substances 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- -1 chip resistor Substances 0.000 description 1
- 230000001276 controlling effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
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- 229910052763 palladium Inorganic materials 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000012798 spherical particle Substances 0.000 description 1
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Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Press Drives And Press Lines (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Wire Bonding (AREA)
- Led Device Packages (AREA)
Description
21 粒子部材(バンプ)
22a 下端平坦面
22 上プレスヘッド
23 下プレスヘッド
25 上下動機構
26 水晶圧電式センサ
27 圧力制御手段
28 サーボプレス
30 加熱体
37 ばね手段
40 くさび部材
41 押圧機構
42 断熱材
50 エアブロー手段
M 連結手段
Claims (5)
- 下端平坦面を有する上プレスヘッドと、この上プレスヘッドを上下動させる上下動機構とを備え、上下動機構によって上プレスヘッドを下降させて、粒子部材形成体に形成された粒子部材を押圧するプレス装置であって、
上プレスヘッドによる押圧力を検出する水晶圧電式センサと、この水晶圧電式センサにて検出した押圧力に基づいて前記上下動機構を制御する圧力制御手段とを備え、前記上下動機構を、駆動源をサーボモータとするサーボプレスにて構成し、上プレスヘッドを加熱する加熱体と、上プレスヘッドと加熱体とを一体化する連結手段とを備え、連結手段は、くさび部材と、このくさび部材を上プレスヘッド側へ押圧して上プレスヘッドを加熱体側へ押し上げる押圧機構とを有することを特徴とするプレス装置。 - 上プレスヘッドとサーボプレスとの間に停止時の衝撃緩和用のばね手段を配設したことを特徴とする請求項1に記載のプレス装置。
- 上プレスヘッドと、下プレスヘッドとを備え、プレス後の上プレスヘッド上昇時に、粒子部材形成体に対して上方側からエアを吹き付けてこの粒子部材形成体を下プレスヘッド側に残すエアブロー手段を設け、このエアブロー手段は、粒子部材形成体の外縁部に対して直接的にエアをブローすることを特徴とする請求項1又は請求項2に記載のプレス装置。
- 粒子部材形成体に形成された粒子部材の頂部を上プレスヘッドの下端平坦面で押圧して平坦化するコイニングに用いることを特徴とする請求項1〜請求項3のいずれかの1項のプレス装置。
- 発光素子の電極と基板側電極との間に介在される粒子部材にて導通した状態で異方性導電接着剤を介して発光素子と基板側電極とを接着するフリップチップ実装に用いることを特徴とする請求項1〜請求項3のいずれかの1項のプレス装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013250250A JP5680736B2 (ja) | 2012-12-04 | 2013-12-03 | プレス装置 |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012265331 | 2012-12-04 | ||
JP2012265331 | 2012-12-04 | ||
JP2013250250A JP5680736B2 (ja) | 2012-12-04 | 2013-12-03 | プレス装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2014132648A JP2014132648A (ja) | 2014-07-17 |
JP5680736B2 true JP5680736B2 (ja) | 2015-03-04 |
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Application Number | Title | Priority Date | Filing Date |
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JP2013250250A Active JP5680736B2 (ja) | 2012-12-04 | 2013-12-03 | プレス装置 |
Country Status (1)
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JP (1) | JP5680736B2 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111633678A (zh) * | 2020-05-15 | 2020-09-08 | 博众精工科技股份有限公司 | 一种保压吸取机构 |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105762238B (zh) * | 2016-04-11 | 2018-02-16 | 东莞市凯昶德电子科技股份有限公司 | Led自动上料机 |
CN113327868B (zh) * | 2020-02-28 | 2023-05-30 | 上海微电子装备(集团)股份有限公司 | 键合头、键合设备和键合方法 |
CN112659613A (zh) * | 2020-12-21 | 2021-04-16 | 滕州市百兴机械有限公司 | 一种智能伺服数控液压机 |
JP2024050043A (ja) * | 2022-09-29 | 2024-04-10 | Tdk株式会社 | 基板処理装置 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10189663A (ja) * | 1996-12-26 | 1998-07-21 | Shibuya Kogyo Co Ltd | ボンディング装置 |
JP2006167788A (ja) * | 2004-12-20 | 2006-06-29 | Komatsu Sanki Kk | プレス成形装置 |
JP5020541B2 (ja) * | 2006-05-17 | 2012-09-05 | 大崎エンジニアリング株式会社 | 圧着装置及び圧着方法 |
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- 2013-12-03 JP JP2013250250A patent/JP5680736B2/ja active Active
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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CN111633678A (zh) * | 2020-05-15 | 2020-09-08 | 博众精工科技股份有限公司 | 一种保压吸取机构 |
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