JP5727495B2 - 凹型ラッチを用いたウェーハコンテナ - Google Patents

凹型ラッチを用いたウェーハコンテナ Download PDF

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Publication number
JP5727495B2
JP5727495B2 JP2012536726A JP2012536726A JP5727495B2 JP 5727495 B2 JP5727495 B2 JP 5727495B2 JP 2012536726 A JP2012536726 A JP 2012536726A JP 2012536726 A JP2012536726 A JP 2012536726A JP 5727495 B2 JP5727495 B2 JP 5727495B2
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JP
Japan
Prior art keywords
latch
lower housing
housing
rib
base
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2012536726A
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English (en)
Japanese (ja)
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JP2013508997A5 (https=
JP2013508997A (ja
Inventor
ディー． パイラント ジェイムズ
ディー． パイラント ジェイムズ
エル． ウェイバー アラン
エル． ウェイバー アラン
Original Assignee
テックスケム アドバンスド プロダクツ インコーポレーテッド エスディーエヌ．ビーエイチディー．
テックスケム アドバンスド プロダクツ インコーポレーテッド エスディーエヌ．ビーエイチディー．
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Application filed by テックスケム アドバンスド プロダクツ インコーポレーテッド エスディーエヌ．ビーエイチディー．, テックスケム アドバンスド プロダクツ インコーポレーテッド エスディーエヌ．ビーエイチディー． filed Critical テックスケム アドバンスド プロダクツ インコーポレーテッド エスディーエヌ．ビーエイチディー．
Publication of JP2013508997A publication Critical patent/JP2013508997A/ja
Publication of JP2013508997A5 publication Critical patent/JP2013508997A5/ja
Application granted granted Critical
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D85/00—Containers, packaging elements or packages, specially adapted for particular articles or materials
    • B65D85/30—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
    • B65D85/38—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure for delicate optical, measuring, calculating or control apparatus
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
    • H10P72/1902—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers specially adapted for a single substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D53/00—Sealing or packing elements; Sealings formed by liquid or plastics material
    • B65D53/04—Discs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D77/00—Packages formed by enclosing articles or materials in preformed containers, e.g. boxes, cartons, sacks or bags
    • B65D77/10—Container closures formed after filling
    • B65D77/16—Container closures formed after filling by collapsing and twisting mouth portion
    • B65D77/18—Container closures formed after filling by collapsing and twisting mouth portion and securing by a deformable clip or binder
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
    • H10P72/1914—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by locking systems
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
    • H10P72/1918—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by coupling elements, kinematic members, handles or elements to be externally gripped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
    • H10P72/1922—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by the construction of the closed carrier
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2223/00—Investigating materials by wave or particle radiation
    • G01N2223/60—Specific applications or type of materials
    • G01N2223/611—Specific applications or type of materials patterned objects; electronic devices
    • G01N2223/6116—Specific applications or type of materials patterned objects; electronic devices semiconductor wafer

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Packaging Frangible Articles (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2012536726A 2009-10-27 2010-06-28 凹型ラッチを用いたウェーハコンテナ Active JP5727495B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/606,921 US8813964B2 (en) 2009-08-26 2009-10-27 Wafer container with recessed latch
US12/606,921 2009-10-27
PCT/MY2010/000108 WO2011053109A1 (en) 2009-10-27 2010-06-28 Wafer container with recessed latch

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2015075651A Division JP2015149498A (ja) 2009-10-27 2015-04-02 凹型ラッチを用いたウェーハコンテナ

Publications (3)

Publication Number Publication Date
JP2013508997A JP2013508997A (ja) 2013-03-07
JP2013508997A5 JP2013508997A5 (https=) 2013-08-15
JP5727495B2 true JP5727495B2 (ja) 2015-06-03

Family

ID=43922293

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2012536726A Active JP5727495B2 (ja) 2009-10-27 2010-06-28 凹型ラッチを用いたウェーハコンテナ
JP2015075651A Pending JP2015149498A (ja) 2009-10-27 2015-04-02 凹型ラッチを用いたウェーハコンテナ

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2015075651A Pending JP2015149498A (ja) 2009-10-27 2015-04-02 凹型ラッチを用いたウェーハコンテナ

Country Status (9)

Country Link
US (2) US8813964B2 (https=)
EP (1) EP2470455A4 (https=)
JP (2) JP5727495B2 (https=)
KR (1) KR20120115207A (https=)
CN (1) CN102666314B (https=)
MY (1) MY159558A (https=)
SG (1) SG10201500640YA (https=)
TW (1) TWI402205B (https=)
WO (1) WO2011053109A1 (https=)

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TWI515160B (zh) 2010-10-19 2016-01-01 安堤格里斯公司 具自動凸緣之前開式晶圓容器
CN103303587B (zh) * 2013-06-20 2014-12-17 芜湖美的厨卫电器制造有限公司 下包装结构
US10153187B2 (en) * 2014-11-11 2018-12-11 Applied Materials, Inc. Methods and apparatus for transferring a substrate
JP6427674B2 (ja) * 2014-12-08 2018-11-21 インテグリス・インコーポレーテッド 基板格納用の一体型コーナースプリングを備える水平基板コンテナ
KR101547177B1 (ko) * 2015-04-03 2015-08-27 (주)상아프론테크 웨이퍼 보관 용기
DE102015105330A1 (de) * 2015-04-08 2016-10-13 Ujet Vehicles S.À.R.L. Batteriebaugruppe und Motorroller mit einer Batteriebaugruppe
US10020213B1 (en) * 2016-12-30 2018-07-10 Sunpower Corporation Semiconductor wafer carriers
TWI697979B (zh) * 2017-02-07 2020-07-01 日商阿基里斯股份有限公司 基板收容容器
US11658059B2 (en) 2018-02-28 2023-05-23 Ii-Vi Delaware, Inc. Thin material handling carrier
JP6952627B2 (ja) * 2018-03-09 2021-10-20 株式会社ジェーイーエル 基板収納容器のロック解除機構
KR102595526B1 (ko) * 2021-09-07 2023-10-30 주식회사 삼에스코리아 웨이퍼 이송 박스
KR102595523B1 (ko) * 2021-09-07 2023-10-30 주식회사 삼에스코리아 웨이퍼 이송 박스
US12271110B2 (en) * 2021-09-09 2025-04-08 Entegris, Inc. Reticle pod having latch including ramped surface
US12255085B2 (en) 2022-03-10 2025-03-18 Innoscience (suzhou) Semiconductor Co., Ltd. Wafer holder and operating method of the same
JP7788905B2 (ja) * 2022-03-25 2025-12-19 アキレス株式会社 半導体ウェーハ搬送容器
US12159799B2 (en) * 2022-03-30 2024-12-03 Achilles Corporation Container for transporting semiconductor wafer
WO2024216456A1 (en) * 2023-04-17 2024-10-24 Viavi Solutions Suzhou Co., Ltd. Cover for a wafer

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US5553711A (en) * 1995-07-03 1996-09-10 Taiwan Semiconductor Manufacturing Company Storage container for integrated circuit semiconductor wafers
JPH09129719A (ja) 1995-08-30 1997-05-16 Achilles Corp 半導体ウエハの収納構造および半導体ウエハの収納・取出し方法
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JPH09148422A (ja) * 1995-11-24 1997-06-06 Mitsubishi Materials Shilicon Corp ウェーハ収納容器の係止構造
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Also Published As

Publication number Publication date
JP2015149498A (ja) 2015-08-20
MY159558A (en) 2017-01-13
EP2470455A1 (en) 2012-07-04
US20140360915A1 (en) 2014-12-11
US8813964B2 (en) 2014-08-26
CN102666314B (zh) 2015-01-28
TW201114663A (en) 2011-05-01
US20110049006A1 (en) 2011-03-03
EP2470455A4 (en) 2014-01-22
CN102666314A (zh) 2012-09-12
KR20120115207A (ko) 2012-10-17
SG10201500640YA (en) 2015-03-30
JP2013508997A (ja) 2013-03-07
TWI402205B (zh) 2013-07-21
WO2011053109A1 (en) 2011-05-05

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