SG10201500640YA - Wafer container with recessed latch - Google Patents

Wafer container with recessed latch

Info

Publication number
SG10201500640YA
SG10201500640YA SG10201500640YA SG10201500640YA SG10201500640YA SG 10201500640Y A SG10201500640Y A SG 10201500640YA SG 10201500640Y A SG10201500640Y A SG 10201500640YA SG 10201500640Y A SG10201500640Y A SG 10201500640YA SG 10201500640Y A SG10201500640Y A SG 10201500640YA
Authority
SG
Singapore
Prior art keywords
wafer container
recessed latch
latch
recessed
wafer
Prior art date
Application number
SG10201500640YA
Other languages
English (en)
Inventor
James D Pylant
Alan L Waber
Original Assignee
Texchem Advanced Products Inc Sdn Bhd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Texchem Advanced Products Inc Sdn Bhd filed Critical Texchem Advanced Products Inc Sdn Bhd
Publication of SG10201500640YA publication Critical patent/SG10201500640YA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D85/00—Containers, packaging elements or packages, specially adapted for particular articles or materials
    • B65D85/30—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
    • B65D85/38—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure for delicate optical, measuring, calculating or control apparatus
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
    • H10P72/1902—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers specially adapted for a single substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D53/00—Sealing or packing elements; Sealings formed by liquid or plastics material
    • B65D53/04—Discs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D77/00—Packages formed by enclosing articles or materials in preformed containers, e.g. boxes, cartons, sacks or bags
    • B65D77/10—Container closures formed after filling
    • B65D77/16—Container closures formed after filling by collapsing and twisting mouth portion
    • B65D77/18—Container closures formed after filling by collapsing and twisting mouth portion and securing by a deformable clip or binder
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
    • H10P72/1914—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by locking systems
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
    • H10P72/1918—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by coupling elements, kinematic members, handles or elements to be externally gripped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
    • H10P72/1922—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by the construction of the closed carrier
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2223/00—Investigating materials by wave or particle radiation
    • G01N2223/60—Specific applications or type of materials
    • G01N2223/611—Specific applications or type of materials patterned objects; electronic devices
    • G01N2223/6116—Specific applications or type of materials patterned objects; electronic devices semiconductor wafer

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Packaging Frangible Articles (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
SG10201500640YA 2009-10-27 2010-06-28 Wafer container with recessed latch SG10201500640YA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US12/606,921 US8813964B2 (en) 2009-08-26 2009-10-27 Wafer container with recessed latch

Publications (1)

Publication Number Publication Date
SG10201500640YA true SG10201500640YA (en) 2015-03-30

Family

ID=43922293

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201500640YA SG10201500640YA (en) 2009-10-27 2010-06-28 Wafer container with recessed latch

Country Status (9)

Country Link
US (2) US8813964B2 (https=)
EP (1) EP2470455A4 (https=)
JP (2) JP5727495B2 (https=)
KR (1) KR20120115207A (https=)
CN (1) CN102666314B (https=)
MY (1) MY159558A (https=)
SG (1) SG10201500640YA (https=)
TW (1) TWI402205B (https=)
WO (1) WO2011053109A1 (https=)

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TWI515160B (zh) 2010-10-19 2016-01-01 安堤格里斯公司 具自動凸緣之前開式晶圓容器
CN103303587B (zh) * 2013-06-20 2014-12-17 芜湖美的厨卫电器制造有限公司 下包装结构
US10153187B2 (en) * 2014-11-11 2018-12-11 Applied Materials, Inc. Methods and apparatus for transferring a substrate
JP6427674B2 (ja) * 2014-12-08 2018-11-21 インテグリス・インコーポレーテッド 基板格納用の一体型コーナースプリングを備える水平基板コンテナ
KR101547177B1 (ko) * 2015-04-03 2015-08-27 (주)상아프론테크 웨이퍼 보관 용기
DE102015105330A1 (de) * 2015-04-08 2016-10-13 Ujet Vehicles S.À.R.L. Batteriebaugruppe und Motorroller mit einer Batteriebaugruppe
US10020213B1 (en) * 2016-12-30 2018-07-10 Sunpower Corporation Semiconductor wafer carriers
TWI697979B (zh) * 2017-02-07 2020-07-01 日商阿基里斯股份有限公司 基板收容容器
US11658059B2 (en) 2018-02-28 2023-05-23 Ii-Vi Delaware, Inc. Thin material handling carrier
JP6952627B2 (ja) * 2018-03-09 2021-10-20 株式会社ジェーイーエル 基板収納容器のロック解除機構
KR102595526B1 (ko) * 2021-09-07 2023-10-30 주식회사 삼에스코리아 웨이퍼 이송 박스
KR102595523B1 (ko) * 2021-09-07 2023-10-30 주식회사 삼에스코리아 웨이퍼 이송 박스
US12271110B2 (en) * 2021-09-09 2025-04-08 Entegris, Inc. Reticle pod having latch including ramped surface
US12255085B2 (en) 2022-03-10 2025-03-18 Innoscience (suzhou) Semiconductor Co., Ltd. Wafer holder and operating method of the same
JP7788905B2 (ja) * 2022-03-25 2025-12-19 アキレス株式会社 半導体ウェーハ搬送容器
US12159799B2 (en) * 2022-03-30 2024-12-03 Achilles Corporation Container for transporting semiconductor wafer
WO2024216456A1 (en) * 2023-04-17 2024-10-24 Viavi Solutions Suzhou Co., Ltd. Cover for a wafer

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US4333580A (en) * 1980-09-29 1982-06-08 Associated Plastics, Inc. Mechanism for locking two halves of an underground vault
US5452795A (en) * 1994-11-07 1995-09-26 Gallagher; Gary M. Actuated rotary retainer for silicone wafer box
FR2735754B1 (fr) 1995-06-20 1998-07-17 Astra Plastique Pot, notamment pour le conditionnement de produits alimentaires
US5553711A (en) * 1995-07-03 1996-09-10 Taiwan Semiconductor Manufacturing Company Storage container for integrated circuit semiconductor wafers
JPH09129719A (ja) 1995-08-30 1997-05-16 Achilles Corp 半導体ウエハの収納構造および半導体ウエハの収納・取出し方法
JPH0986588A (ja) * 1995-09-21 1997-03-31 Komatsu Kasei Kk 積層型包装容器
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US6039186A (en) * 1997-04-16 2000-03-21 Fluoroware, Inc. Composite transport carrier
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US6341695B1 (en) 1998-05-07 2002-01-29 Texas Instruments Incorporated Containment device for retaining semiconductor wafers
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US6915906B2 (en) * 2003-07-14 2005-07-12 Peak Plastic & Metal Products (International) Limited Wafer storage container with wafer positioning posts
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Also Published As

Publication number Publication date
JP2015149498A (ja) 2015-08-20
MY159558A (en) 2017-01-13
EP2470455A1 (en) 2012-07-04
US20140360915A1 (en) 2014-12-11
US8813964B2 (en) 2014-08-26
CN102666314B (zh) 2015-01-28
TW201114663A (en) 2011-05-01
US20110049006A1 (en) 2011-03-03
EP2470455A4 (en) 2014-01-22
CN102666314A (zh) 2012-09-12
KR20120115207A (ko) 2012-10-17
JP5727495B2 (ja) 2015-06-03
JP2013508997A (ja) 2013-03-07
TWI402205B (zh) 2013-07-21
WO2011053109A1 (en) 2011-05-05

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