JP5723800B2 - 半導体チップの圧縮樹脂封止成形方法及び装置 - Google Patents
半導体チップの圧縮樹脂封止成形方法及び装置 Download PDFInfo
- Publication number
- JP5723800B2 JP5723800B2 JP2012020663A JP2012020663A JP5723800B2 JP 5723800 B2 JP5723800 B2 JP 5723800B2 JP 2012020663 A JP2012020663 A JP 2012020663A JP 2012020663 A JP2012020663 A JP 2012020663A JP 5723800 B2 JP5723800 B2 JP 5723800B2
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- resin
- substrate
- resin sealing
- molding
- sealing
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- 229920005989 resin Polymers 0.000 title claims description 395
- 239000011347 resin Substances 0.000 title claims description 395
- 238000007789 sealing Methods 0.000 title claims description 124
- 238000000465 moulding Methods 0.000 title claims description 89
- 238000000034 method Methods 0.000 title claims description 41
- 239000004065 semiconductor Substances 0.000 title claims description 38
- 239000000758 substrate Substances 0.000 claims description 159
- 239000000463 material Substances 0.000 claims description 66
- 230000002265 prevention Effects 0.000 claims description 40
- 230000006835 compression Effects 0.000 claims description 27
- 238000007906 compression Methods 0.000 claims description 27
- 238000003825 pressing Methods 0.000 claims description 21
- 238000007654 immersion Methods 0.000 claims description 2
- 239000000470 constituent Substances 0.000 claims 1
- 230000000694 effects Effects 0.000 description 5
- 238000003780 insertion Methods 0.000 description 5
- 230000037431 insertion Effects 0.000 description 5
- 229920001187 thermosetting polymer Polymers 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000007788 liquid Substances 0.000 description 3
- 230000002411 adverse Effects 0.000 description 2
- 238000007598 dipping method Methods 0.000 description 2
- 229920002050 silicone resin Polymers 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000006837 decompression Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000009969 flowable effect Effects 0.000 description 1
- -1 for example Substances 0.000 description 1
- 239000008187 granular material Substances 0.000 description 1
- 230000009931 harmful effect Effects 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 230000011218 segmentation Effects 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
Images
Landscapes
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012020663A JP5723800B2 (ja) | 2012-02-02 | 2012-02-02 | 半導体チップの圧縮樹脂封止成形方法及び装置 |
| TW102100216A TWI527273B (zh) | 2012-02-02 | 2013-01-04 | Method and apparatus for sealing resin sealing of semiconductor wafer and apparatus for preventing edge of resin |
| KR1020130004818A KR101432423B1 (ko) | 2012-02-02 | 2013-01-16 | 반도체 칩의 압축 수지 밀봉 성형 방법 및 장치와 수지 버어 방지용 테이프 |
| MYPI2013000198A MY173863A (en) | 2012-02-02 | 2013-01-18 | Resin sealing compression molding method and apparatus for semiconductor chips, and resin burr prevention tape |
| CN201310022344.8A CN103247739B (zh) | 2012-02-02 | 2013-01-22 | 半导体芯片的压缩树脂密封成型方法和装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012020663A JP5723800B2 (ja) | 2012-02-02 | 2012-02-02 | 半導体チップの圧縮樹脂封止成形方法及び装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2013158943A JP2013158943A (ja) | 2013-08-19 |
| JP2013158943A5 JP2013158943A5 (ko) | 2014-12-11 |
| JP5723800B2 true JP5723800B2 (ja) | 2015-05-27 |
Family
ID=49171612
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012020663A Active JP5723800B2 (ja) | 2012-02-02 | 2012-02-02 | 半導体チップの圧縮樹脂封止成形方法及び装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5723800B2 (ko) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6525580B2 (ja) * | 2014-12-24 | 2019-06-05 | Ｔｏｗａ株式会社 | 樹脂成形装置及び樹脂成形方法 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008205149A (ja) * | 2007-02-20 | 2008-09-04 | Towa Corp | 発光体の形成方法及び金型 |
| JP2008207450A (ja) * | 2007-02-27 | 2008-09-11 | Towa Corp | 発光素子の圧縮成形方法 |
-
2012
- 2012-02-02 JP JP2012020663A patent/JP5723800B2/ja active Active
Also Published As
| Publication number | Publication date |
|---|---|
| JP2013158943A (ja) | 2013-08-19 |
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