JP5707216B2 - Ｆｐｃ用電磁波シールド材 - Google Patents

Ｆｐｃ用電磁波シールド材 Download PDF

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Publication number
JP5707216B2
JP5707216B2 JP2011098430A JP2011098430A JP5707216B2 JP 5707216 B2 JP5707216 B2 JP 5707216B2 JP 2011098430 A JP2011098430 A JP 2011098430A JP 2011098430 A JP2011098430 A JP 2011098430A JP 5707216 B2 JP5707216 B2 JP 5707216B2
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JP
Japan
Prior art keywords
fpc
shielding material
conductive
conductive paste
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2011098430A
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English (en)
Japanese (ja)
Other versions
JP2012231021A (ja
Inventor
後藤　信弘
信弘 後藤
さなえ 藤井
さなえ 藤井
佑子 稲葉
佑子 稲葉
小国　盛稔
盛稔 小国
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujimori Kogyo Co Ltd
Original Assignee
Fujimori Kogyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujimori Kogyo Co Ltd filed Critical Fujimori Kogyo Co Ltd
Priority to JP2011098430A priority Critical patent/JP5707216B2/ja
Priority to TW101114506A priority patent/TWI468084B/zh
Priority to KR1020120042809A priority patent/KR101407684B1/ko
Priority to CN2012101264474A priority patent/CN102762083A/zh
Priority to CN201510489727.5A priority patent/CN105208843B/zh
Publication of JP2012231021A publication Critical patent/JP2012231021A/ja
Priority to KR1020140047701A priority patent/KR101602214B1/ko
Application granted granted Critical
Publication of JP5707216B2 publication Critical patent/JP5707216B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0086—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single discontinuous metallic layer on an electrically insulating supporting structure, e.g. metal grid, perforated metal foil, film, aggregated flakes, sintering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/212—Electromagnetic interference shielding

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
JP2011098430A 2011-04-26 2011-04-26 Ｆｐｃ用電磁波シールド材 Active JP5707216B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2011098430A JP5707216B2 (ja) 2011-04-26 2011-04-26 Ｆｐｃ用電磁波シールド材
TW101114506A TWI468084B (zh) 2011-04-26 2012-04-24 Electromagnetic wave shielding material for FPC
KR1020120042809A KR101407684B1 (ko) 2011-04-26 2012-04-24 Ｆｐｃ용 전자파 실드재
CN2012101264474A CN102762083A (zh) 2011-04-26 2012-04-26 Fpc用电磁波屏蔽材料
CN201510489727.5A CN105208843B (zh) 2011-04-26 2012-04-26 Fpc用电磁波屏蔽材料
KR1020140047701A KR101602214B1 (ko) 2011-04-26 2014-04-21 Ｆｐｃ용 전자파 실드재

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011098430A JP5707216B2 (ja) 2011-04-26 2011-04-26 Ｆｐｃ用電磁波シールド材

Publications (2)

Publication Number Publication Date
JP2012231021A JP2012231021A (ja) 2012-11-22
JP5707216B2 true JP5707216B2 (ja) 2015-04-22

Family

ID=47056364

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011098430A Active JP5707216B2 (ja) 2011-04-26 2011-04-26 Ｆｐｃ用電磁波シールド材

Country Status (4)

Country Link
JP (1) JP5707216B2 (zh)
KR (2) KR101407684B1 (zh)
CN (2) CN102762083A (zh)
TW (1) TWI468084B (zh)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6081819B2 (ja) * 2013-02-28 2017-02-15 藤森工業株式会社 Ｆｐｃ用電磁波シールド材
WO2014142005A1 (ja) * 2013-03-13 2014-09-18 Dic株式会社 積層体、導電性パターン及び積層体の製造方法
JP6139284B2 (ja) * 2013-06-11 2017-05-31 住友電工プリントサーキット株式会社 シールドフィルム及びプリント配線板
KR101498140B1 (ko) * 2013-07-31 2015-03-04 (주)창성 연성인쇄회로기판의 커버레이어의 제조방법과 이 제조방법을 이용한 연성인쇄회로기판의 제조방법 및 이 제조방법으로 제조된 커버레이어와 연성인쇄회로기판
JP2015065343A (ja) * 2013-09-25 2015-04-09 タツタ電線株式会社 シールド収容体、プリント回路板、電子機器、及び、シールド収容体の製造方法
JP2015065342A (ja) * 2013-09-25 2015-04-09 タツタ電線株式会社 シールド収容体、プリント回路板、及び、電子機器
JP2015159214A (ja) * 2014-02-25 2015-09-03 住友ベークライト株式会社 電磁波シールドフィルム及びフレキシブルプリント基板
KR20170084672A (ko) * 2016-01-12 2017-07-20 후지모리 고교 가부시키가이샤 커버레이 필름
JP2018010888A (ja) * 2016-07-11 2018-01-18 藤森工業株式会社 電磁波シールド材
JP6883400B2 (ja) * 2016-10-04 2021-06-09 藤森工業株式会社 カバーレイフィルム
JP6932498B2 (ja) * 2016-12-08 2021-09-08 デュポン帝人アドバンスドペーパー株式会社 電磁波抑制シート
CN106531344A (zh) * 2016-12-26 2017-03-22 南昌联能科技有限公司 一种用于线缆的电磁屏蔽膜、电磁屏蔽膜的制造方法及线材的制造方法
JP7012446B2 (ja) * 2017-03-17 2022-01-28 藤森工業株式会社 カバーレイフィルム及びその製造方法
CN109306487A (zh) * 2017-07-28 2019-02-05 苏州思锐达新材料有限公司 基于聚酰亚胺薄膜的电磁屏蔽材料及其制备方法与应用
CN107953648A (zh) * 2017-12-27 2018-04-24 太仓金煜电子材料有限公司 一种阻燃级哑黑复合薄膜及其生产方法
CN108718518B (zh) * 2018-05-21 2020-02-07 深圳昌茂粘胶新材料有限公司 一种电磁波屏蔽膜材料及其制备方法
TWI699279B (zh) * 2018-10-22 2020-07-21 長興材料工業股份有限公司 電磁波屏蔽膜及其製備方法與用途
WO2020262283A1 (ja) * 2019-06-27 2020-12-30 日東電工株式会社 透明導電性フィルム
WO2021199649A1 (ja) * 2020-04-01 2021-10-07 北越コーポレーション株式会社 電磁波シールドシートの製造方法、および電磁波シールドシート
JP7001187B1 (ja) * 2021-03-19 2022-01-19 東洋インキＳｃホールディングス株式会社 電磁波シールドシートおよびその製造方法、シールド性配線基板、並びに電子機器
WO2023075652A1 (en) * 2021-10-28 2023-05-04 Telefonaktiebolaget Lm Ericsson (Publ) A method of producing a printed circuit board, and a printed circuit board
KR102558248B1 (ko) * 2021-12-15 2023-07-26 한국지질자원연구원 전자기 간섭 차폐 물질 및 이의 제조 방법
CN115884506B (zh) * 2023-01-03 2023-06-09 苏州艾乐格电子科技有限公司 一种柔性薄膜电路及其制备方法

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JP5139156B2 (ja) * 2008-05-30 2013-02-06 タツタ電線株式会社 電磁波シールド材及びプリント配線板
US20110180764A1 (en) * 2008-06-26 2011-07-28 Dic Corporation Silver-containing powder, method for producing the same, conductive paste using the same, and plastic substrate
JP5446222B2 (ja) * 2008-11-14 2014-03-19 住友電気工業株式会社 導電性ペースト及びそれを用いた電磁波シールドフィルム、電磁波シールドフレキシブルプリント配線板
KR20110128860A (ko) 2009-03-25 2011-11-30 듀폰-미츠이 폴리케미칼 가부시키가이샤 전자부품용 금속층 부착 필름, 그 제조 방법 및 용도
JP2010238870A (ja) * 2009-03-31 2010-10-21 Toyo Ink Mfg Co Ltd 電磁波シールド性カバーレイフィルム、フレキシブルプリント配線板の製造方法、及びフレキシブルプリント配線板。
JP5565764B2 (ja) * 2009-04-01 2014-08-06 東レフィルム加工株式会社 電磁波障害防止用転写フィルム
JP2010287662A (ja) * 2009-06-10 2010-12-24 Dainippon Printing Co Ltd 太陽電池モジュール用裏面保護シート、及び該保護シートを使用した太陽電池モジュール

Also Published As

Publication number Publication date
CN102762083A (zh) 2012-10-31
KR101602214B1 (ko) 2016-03-10
TWI468084B (zh) 2015-01-01
KR20120121357A (ko) 2012-11-05
JP2012231021A (ja) 2012-11-22
KR101407684B1 (ko) 2014-06-17
TW201309111A (zh) 2013-02-16
CN105208843A (zh) 2015-12-30
KR20140063548A (ko) 2014-05-27
CN105208843B (zh) 2018-04-24

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