JP5699006B2 - 変速機制御装置及び電子回路装置 - Google Patents

変速機制御装置及び電子回路装置 Download PDF

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Publication number
JP5699006B2
JP5699006B2 JP2011043464A JP2011043464A JP5699006B2 JP 5699006 B2 JP5699006 B2 JP 5699006B2 JP 2011043464 A JP2011043464 A JP 2011043464A JP 2011043464 A JP2011043464 A JP 2011043464A JP 5699006 B2 JP5699006 B2 JP 5699006B2
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Japan
Prior art keywords
circuit board
resin
electronic circuit
opening
base
Prior art date
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Expired - Fee Related
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JP2011043464A
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English (en)
Japanese (ja)
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JP2012182267A5 (enExample
JP2012182267A (ja
Inventor
清隆 菅野
清隆 菅野
小田倉　安則
安則 小田倉
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Hitachi Astemo Ltd
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Hitachi Automotive Systems Ltd
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Application filed by Hitachi Automotive Systems Ltd filed Critical Hitachi Automotive Systems Ltd
Priority to JP2011043464A priority Critical patent/JP5699006B2/ja
Priority to PCT/JP2012/054162 priority patent/WO2012117899A1/ja
Priority to DE112012001049.3T priority patent/DE112012001049B4/de
Priority to US13/985,235 priority patent/US20130329384A1/en
Publication of JP2012182267A publication Critical patent/JP2012182267A/ja
Publication of JP2012182267A5 publication Critical patent/JP2012182267A5/ja
Application granted granted Critical
Publication of JP5699006B2 publication Critical patent/JP5699006B2/ja
Expired - Fee Related legal-status Critical Current
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0212—Printed circuits or mounted components having integral heating means
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16H—GEARING
    • F16H61/00—Control functions within control units of change-speed- or reversing-gearings for conveying rotary motion ; Control of exclusively fluid gearing, friction gearing, gearings with endless flexible members or other particular types of gearing
    • F16H61/0003—Arrangement or mounting of elements of the control apparatus, e.g. valve assemblies or snapfittings of valves; Arrangements of the control unit on or in the transmission gearbox
    • F16H61/0006—Electronic control units for transmission control, e.g. connectors, casings or circuit boards
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    • H01—ELECTRIC ELEMENTS
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    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/563—Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
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    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
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    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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    • H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
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    • H01L24/42—Wire connectors; Manufacturing methods related thereto
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    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
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    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
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    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15151—Shape the die mounting substrate comprising an aperture, e.g. for underfilling, outgassing, window type wire connections
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    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
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    • H01L2924/19101—Disposition of discrete passive components
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    • H05K2201/09009—Substrate related
    • H05K2201/09072—Hole or recess under component or special relationship between hole and component
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    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
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    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
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    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Control Of Transmission Device (AREA)
JP2011043464A 2011-03-01 2011-03-01 変速機制御装置及び電子回路装置 Expired - Fee Related JP5699006B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2011043464A JP5699006B2 (ja) 2011-03-01 2011-03-01 変速機制御装置及び電子回路装置
PCT/JP2012/054162 WO2012117899A1 (ja) 2011-03-01 2012-02-21 変速機制御装置及び電子回路装置
DE112012001049.3T DE112012001049B4 (de) 2011-03-01 2012-02-21 Getriebesteuervorrichtung und elektronische Schaltungsvorrichtung
US13/985,235 US20130329384A1 (en) 2011-03-01 2012-02-21 Transmission Control Device and Electronic Circuit Device

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Application Number Priority Date Filing Date Title
JP2011043464A JP5699006B2 (ja) 2011-03-01 2011-03-01 変速機制御装置及び電子回路装置

Publications (3)

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JP2012182267A JP2012182267A (ja) 2012-09-20
JP2012182267A5 JP2012182267A5 (enExample) 2013-03-21
JP5699006B2 true JP5699006B2 (ja) 2015-04-08

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JP2011043464A Expired - Fee Related JP5699006B2 (ja) 2011-03-01 2011-03-01 変速機制御装置及び電子回路装置

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US (1) US20130329384A1 (enExample)
JP (1) JP5699006B2 (enExample)
DE (1) DE112012001049B4 (enExample)
WO (1) WO2012117899A1 (enExample)

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US8207607B2 (en) * 2007-12-14 2012-06-26 Denso Corporation Semiconductor device with resin mold
KR20230023834A (ko) * 2020-12-09 2023-02-20 주식회사 솔루엠 에어포켓 방지 기판, 에어포켓 방지 기판 모듈, 이를 포함하는 전기기기 및 이를 포함하는 전기기기의 제조 방법
USD984397S1 (en) * 2021-03-16 2023-04-25 Yidong Cai Circuit board
DE102022210525A1 (de) 2022-10-05 2024-04-11 Vitesco Technologies Germany Gmbh Elektronische Baugruppe, sowie Verfahren zu deren Herstellung

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