JP2012182267A5 - - Google Patents

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Publication number
JP2012182267A5
JP2012182267A5 JP2011043464A JP2011043464A JP2012182267A5 JP 2012182267 A5 JP2012182267 A5 JP 2012182267A5 JP 2011043464 A JP2011043464 A JP 2011043464A JP 2011043464 A JP2011043464 A JP 2011043464A JP 2012182267 A5 JP2012182267 A5 JP 2012182267A5
Authority
JP
Japan
Prior art keywords
electronic circuit
circuit board
sealing resin
resin
base
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2011043464A
Other languages
English (en)
Japanese (ja)
Other versions
JP5699006B2 (ja
JP2012182267A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2011043464A priority Critical patent/JP5699006B2/ja
Priority claimed from JP2011043464A external-priority patent/JP5699006B2/ja
Priority to US13/985,235 priority patent/US20130329384A1/en
Priority to DE112012001049.3T priority patent/DE112012001049B4/de
Priority to PCT/JP2012/054162 priority patent/WO2012117899A1/ja
Publication of JP2012182267A publication Critical patent/JP2012182267A/ja
Publication of JP2012182267A5 publication Critical patent/JP2012182267A5/ja
Application granted granted Critical
Publication of JP5699006B2 publication Critical patent/JP5699006B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2011043464A 2011-03-01 2011-03-01 変速機制御装置及び電子回路装置 Expired - Fee Related JP5699006B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2011043464A JP5699006B2 (ja) 2011-03-01 2011-03-01 変速機制御装置及び電子回路装置
US13/985,235 US20130329384A1 (en) 2011-03-01 2012-02-21 Transmission Control Device and Electronic Circuit Device
DE112012001049.3T DE112012001049B4 (de) 2011-03-01 2012-02-21 Getriebesteuervorrichtung und elektronische Schaltungsvorrichtung
PCT/JP2012/054162 WO2012117899A1 (ja) 2011-03-01 2012-02-21 変速機制御装置及び電子回路装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011043464A JP5699006B2 (ja) 2011-03-01 2011-03-01 変速機制御装置及び電子回路装置

Publications (3)

Publication Number Publication Date
JP2012182267A JP2012182267A (ja) 2012-09-20
JP2012182267A5 true JP2012182267A5 (enExample) 2013-03-21
JP5699006B2 JP5699006B2 (ja) 2015-04-08

Family

ID=46757838

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011043464A Expired - Fee Related JP5699006B2 (ja) 2011-03-01 2011-03-01 変速機制御装置及び電子回路装置

Country Status (4)

Country Link
US (1) US20130329384A1 (enExample)
JP (1) JP5699006B2 (enExample)
DE (1) DE112012001049B4 (enExample)
WO (1) WO2012117899A1 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8207607B2 (en) * 2007-12-14 2012-06-26 Denso Corporation Semiconductor device with resin mold
KR20230023834A (ko) * 2020-12-09 2023-02-20 주식회사 솔루엠 에어포켓 방지 기판, 에어포켓 방지 기판 모듈, 이를 포함하는 전기기기 및 이를 포함하는 전기기기의 제조 방법
USD984397S1 (en) * 2021-03-16 2023-04-25 Yidong Cai Circuit board
DE102022210525A1 (de) 2022-10-05 2024-04-11 Vitesco Technologies Germany Gmbh Elektronische Baugruppe, sowie Verfahren zu deren Herstellung

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2749153B2 (ja) * 1989-10-25 1998-05-13 株式会社日立製作所 半導体デバイス
JP2000286379A (ja) * 1999-01-28 2000-10-13 Fujitsu Ltd 半導体装置及びその製造方法
US6188579B1 (en) * 1999-07-12 2001-02-13 Lucent Technologies Inc. Apparatus and methods for forming a printed wiring board assembly to reduce pallet warpage
US6400574B1 (en) * 2000-05-11 2002-06-04 Micron Technology, Inc. Molded ball grid array
JP3553513B2 (ja) 2001-03-06 2004-08-11 株式会社日立製作所 自動車用電子回路装置
DE10210041B4 (de) * 2002-03-07 2009-04-16 Continental Automotive Gmbh Wärmeableitvorrichtung zum Ableiten von Wärme, die von einem elektrischen Bauelement erzeugt wird und Verfahren zum Herstellen einer derartigen Wärmeableitvorrichtung
JP4283514B2 (ja) * 2002-09-24 2009-06-24 株式会社日立製作所 電子回路装置
JP4821537B2 (ja) * 2006-09-26 2011-11-24 株式会社デンソー 電子制御装置
JP4244235B2 (ja) * 2006-10-10 2009-03-25 株式会社日立製作所 電子回路装置

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