JP5696825B2 - 積層体、導電性パターン、電気回路及び積層体の製造方法 - Google Patents
積層体、導電性パターン、電気回路及び積層体の製造方法 Download PDFInfo
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- JP5696825B2 JP5696825B2 JP2014556850A JP2014556850A JP5696825B2 JP 5696825 B2 JP5696825 B2 JP 5696825B2 JP 2014556850 A JP2014556850 A JP 2014556850A JP 2014556850 A JP2014556850 A JP 2014556850A JP 5696825 B2 JP5696825 B2 JP 5696825B2
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Images
Classifications
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- C08J7/04—Coating
- C08J7/043—Improving the adhesiveness of the coatings per se, e.g. forming primers
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/04—Coating
- C08J7/042—Coating with two or more layers, where at least one layer of a composition contains a polymer binder
- C08J7/0423—Coating with two or more layers, where at least one layer of a composition contains a polymer binder with at least one layer of inorganic material and at least one layer of a composition containing a polymer binder
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
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- C08J7/04—Coating
- C08J7/044—Forming conductive coatings; Forming coatings having anti-static properties
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/04—Coating
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Description
前記ポリエーテルポリオールとしては、例えば活性水素原子を2個以上有する化合物の1種または2種以上を開始剤として、アルキレンオキサイドを付加重合させたものを使用することができる。
温度計、窒素ガス導入管、攪拌器を備えた窒素置換された容器中で、ポリエステルポリオール100質量部(1,4−シクロヘキサンジメタノールとネオペンチルグリコールとアジピン酸とを反応させて得られたポリエステルポリオール、水酸基当量1000g/当量)と2,2―ジメチロールプロピオン酸17.4質量部と1,4−シクロヘキサンジメタノール21.7質量部とジシクロヘキシルメタンジイソシアネート106.2質量部とを、メチルエチルケトン178質量部中で混合し反応させることによって、末端にイソシアネート基を有するウレタンプレポリマーの有機溶剤溶液を得た。
撹拌機、還流冷却管、窒素導入管、温度計、滴下漏斗を備えた反応容器に、脱イオン水115質量部、ラテムルE−118B(花王株式会社製、有効成分25質量%)4質量部を入れ、窒素を吹き込みながら75℃まで昇温した。
攪拌機、還流冷却管、窒素導入管、温度計、単量体混合物滴下用滴下漏斗、重合触媒滴下用滴下漏斗を備えた反応容器に脱イオン水280質量部、合成例1で得たウレタン樹脂(Y−1)の水分散体333質量部を入れ、窒素を吹き込みながら80℃まで昇温した。
攪拌機、還流冷却管、窒素導入管、温度計、単量体混合物滴下用滴下漏斗、重合触媒滴下用滴下漏斗を備えた反応容器に脱イオン水280質量部、合成例1で得たウレタン樹脂(Y−1)の水分散体333質量部を入れ、窒素を吹き込みながら80℃まで昇温した。
合成例3で得たウレタン−アクリル複合樹脂(Y−3)の水分散体をプライマーとして使用し、それをプライマー層の膜厚が1μmになるように、コロナ処理したポリイミドフィルム(東レ・デュポン株式会社製Kapton150EN−C,厚さ37.5μm)からなる支持体の表面に、スピンコーターを用いてそれぞれ塗工し、熱風乾燥機を用いて80℃で3分間乾燥することによって、前記支持体上に、架橋構造を形成していないプライマー層を備えた積層体を得た。
窒素雰囲気下、メトキシポリエチレングリコール(数平均分子量2,000)20g、ピリジン8.0g及びクロロホルム20mlを含む混合物に、p−トルエンスルホン酸クロライド9.6gを含むクロロホルム(30ml)溶液を、氷冷撹拌しながら30分間滴下した後、浴槽温度40℃で4時間攪拌し、クロロホルム50mlを混合した。
プライマー層を形成するプライマーとして、合成例3で得たウレタン−アクリル複合樹脂(Y−3)の水分散体の代わりに、合成例4で得たウレタン−アクリル複合樹脂(Y−4)の水分散体を使用すること以外は、実施例1と同様の方法で、支持体からなる層と架橋構造を形成したプライマー層と第一の導電層と架橋構造を形成した絶縁層と第二の導電層とが積層した積層体を得た。
絶縁層を形成する樹脂組成物として、合成例4で得たウレタン−アクリル複合樹脂(Y−4)の水分散体の代わりに、合成例1で得たウレタン樹脂(Y−1)の水分散体を使用すること以外は、実施例2と同様の方法で、支持体からなる層と架橋構造を形成したプライマー層と第一の導電層と架橋構造を形成した絶縁層と第二の導電層とが積層した積層体を得た。
プライマー層を形成するプライマーとして、ウレタン−アクリル複合樹脂(Y−3)の水分散体の代わりに、合成例2で得たビニル重合体(Y−2)の水分散体を使用し、かつ、絶縁層を形成する樹脂組成物として、合成例4で得たウレタン−アクリル複合樹脂(Y−4)の水分散体の代わりに、合成例3で得たウレタン−アクリル複合樹脂(Y−3)の水分散体を使用すること以外は、実施例1と同様の方法で、支持体からなる層と架橋構造を形成したプライマー層と第一の導電層と架橋構造を形成した絶縁層と第二の導電層とが積層した積層体を得た。
プライマー層を設けないこと以外は、実施例4と同様の方法で積層体を製造することを試みたが、第一の導電層の導通が不十分であった。また、前記第一の導電層の導通が不十分であったため、前記第一のめっき核層の表面に第一のめっき層を形成することができなかった。
絶縁層として、予めフィルム化されている、カバーレイ用フィルム(ニッカン工業株式会社製 CISA 2535(DB)、ポリイミドフィルム25μm、接着剤層の厚さ35μm)をそれぞれ使用すること以外は、実施例1記載の方法と同様の方法で、積層体の製造を試みたが、第二の導電層の導通が不十分であるため、第二のめっき層を形成することができず、積層体を作製することができなかった。
積層体の厚さは、支持体からなる層とプライマー層と第一の導電層と絶縁層と第二の導電層とが重なった部分の断面をレーザー顕微鏡(キーエンス社製VK−9700)で測定した。前記厚さが100μm以下であれば、プライマー層と第一の導電層と絶縁層と第二の導電層との厚さの合計も100μm以下であると判断し、導電性パターン等の積層体の薄型化を図るうえで有利であると判断した。
前記積層体を構成する第二の導電層の表面にセロハン粘着テープ(ニチバン(株)製,CT405AP−24,24mm)を指で圧着した後、前記セロハン粘着テープを、前記積層体の表面に対して90度方向に剥離した。剥離したセロハン粘着テープの粘着面を目視で観察し、その付着物の有無に基づいて前記密着性を評価した。
実施例及び比較例で得た積層体を、温度85℃及び相対湿度85%の環境下に1000時間放置した。
ロレスタGP MCP T610型(三菱化学アナリティック社製の抵抗率計)を用い、前記積層体を構成する第一の導電層に接続した2つのタブにBSPプローブを接触させ、導通があるかを確認した。導通があったものを「○」、導通がなかったもの、または、導通せずめっき層を形成できなかったものを「×」と評価した。
実施例及び比較例で得た積層体を、温度85℃及び相対湿度85%の環境下に1000時間放置した。
ロレスタGP MCP T610型(三菱化学アナリティック社製の抵抗率計)を用い、前記積層体を構成するの第二の導電層に接続した2つのタブにBSPプローブを接触させ、導通があるかを確認した。導通があったものを「○」、導通がなかったもの、または、導通せずめっき層を形成できなかったものを「×」と評価した。
実施例及び比較例で得た積層体を、温度85℃及び相対湿度85%の環境下に1000時間放置した。
ロレスタGP MCP T610型(三菱化学アナリティック社製の抵抗率計)を用い、第一の導電層に接続した1つのタブにBSPプローブの一方を接触させ、他方のBSPプローブを第二の導電層に接続した1つのタブに接触させ、導通の有無を確認した。導通がなく、第一の導電層と第二の導電層との絶縁性が維持できていたものを「○」、導通があったものを「×」と評価した。
実施例及び比較例で得た積層体を、温度85℃及び相対湿度85%の環境下に1000時間放置した。
2・・・・・第一の導電層(C)
3・・・・・タブ
4・・・・・絶縁層(D)の上面
5・・・・・支持体からなる層(A)
6・・・・・プライマー層(B)
7・・・・・第一の導電層(C)
8・・・・・絶縁層(D)
9・・・・・第二の導電層(E)
20・・・・・積層体(I)の上面図
21・・・・・積層体(IV)の上面図
22・・・・・積層体(IV)の一点破線23における断面図
Claims (13)
- 少なくとも、支持体からなる層(A)と、プライマー層(B)と、第一の導電層(C)と、絶縁層(D)と、第二の導電層(E)とが積層した積層体であって、前記絶縁層(D)が、少なくとも前記第一の導電層(C)の表面の一部または全部に、樹脂組成物(d)を塗布し乾燥することによって形成された層であり、前記第一の導電層(C)が、前記プライマー層(B)の表面の一部または全部に、遷移金属やその化合物である導電性物質を含有する流動体(c−1)を塗布することによって形成された第一のめっき核層(C−1)と、前記第一のめっき核層(C−1)の表面に設けられた第一のめっき層(C−2)とによって構成される層であり、前記第二の導電層(E)が、前記絶縁層(D)の表面の一部または全部に、遷移金属やその化合物である導電性物質を含有する流動体(e−1)を塗布することによって形成された第二のめっき核層(E−1)と、前記第二のめっき核層(E−1)の表面に設けられた第二のめっき層(E−2)とによって構成される層であることを特徴とする積層体。
- 前記絶縁層(D)が、ウレタン樹脂(d1)、ビニル樹脂(d2)、及び、ウレタン−ビニル複合樹脂(d3)からなる群より選ばれる1種以上の樹脂を含有するものである請求項1に記載の積層体。
- 前記ウレタン−ビニル複合樹脂(d3)が、ウレタン樹脂(d3−1)であるシェル層と、前記ビニル樹脂(d3−2)であるコア層とによって構成される複合樹脂である請求項2に記載の積層体。
- 前記ウレタン樹脂(d3−1)が、2,000mmol/kg〜5,500mmol/kgの脂肪族環式構造を有するものである請求項3に記載の積層体。
- 前記プライマー層(B)が、ウレタン樹脂(b1)、ビニル樹脂(b2)、及び、ウレタン−ビニル複合樹脂(b3)からなる群より選ばれる1種以上の樹脂を含有するものである請求項1に記載の積層体。
- 前記ウレタン−ビニル複合樹脂(b3)が、ウレタン樹脂(b3−1)であるシェル層と、前記ビニル樹脂(b3−2)であるコア層とによって構成される複合樹脂である請求項5に記載の積層体。
- 前記ウレタン樹脂(b3−1)が、2,000mmol/kg〜5,500mmol/kgの脂肪族環式構造を有するものである請求項6に記載の積層体。
- 前記プライマー層(B)及び絶縁層(E)を形成する樹脂が、架橋性官能基を有するものである請求項1に記載の積層体。
- 前記架橋性官能基が、メチロールアミド基及びアルコキシメチルアミド基からなる群より選ばれる1種以上の熱架橋性官能基である請求項8に記載の積層体。
- 前記流動体(c−1)及び流動体(e−1)が含有する導電性物質が銀であり、前記第一のめっき層(C−2)及び第二のめっき層(E−2)が、銅めっき層である請求項1に記載の積層体。
- 請求項1〜10のいずれか1項に記載の積層体からなる導電性パターン。
- 請求項11に記載の導電性パターンを有する電気回路。
- 支持体の表面の一部または全部に、プライマー層(B)を形成するプライマーを塗布し、その塗布面の一部または全部に、導電性物質を含有する流動体(c−1)を塗布することによって、支持体からなる層(A)とプライマー層(B)と第一のめっき核層(C−1)とを積層する工程[1]、前記第一のめっき核層(C−1)の表面の一部または全部をめっき処理することによって、前記第一のめっき核層(C−1)の表面に第一のめっき層(C−2)が積層した第一の導電層(C)を形成する工程[2]、少なくとも前記第一のめっき層(C−2)の表面の一部または全部に、絶縁層(D)を形成する樹脂組成物(d)を塗布し、その塗布面の一部または全部に、導電性物質を含有する流動体(e−1)を塗布することによって、前記第一の導電層(C)の表面に前記絶縁層(D)を積層し、前記絶縁層(D)の表面に第二のめっき核層(E−1)を積層する工程[3]、及び、前記第二のめっき核層(E−1)の表面の一部または全部をめっき処理することによって、前記第二のめっき核層(E−1)の表面に第二のめっき層(E−2)が積層した第二の導電層(E)を形成する工程[4]を経ることを特徴とする積層体の製造方法。
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JP2014556850A JP5696825B2 (ja) | 2013-01-23 | 2014-01-21 | 積層体、導電性パターン、電気回路及び積層体の製造方法 |
PCT/JP2014/051077 WO2014115710A1 (ja) | 2013-01-23 | 2014-01-21 | 積層体、導電性パターン、電気回路及び積層体の製造方法 |
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JP (1) | JP5696825B2 (ja) |
KR (1) | KR101562494B1 (ja) |
CN (1) | CN104936774B (ja) |
DE (1) | DE112014000530T5 (ja) |
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DE102013104577B3 (de) * | 2013-05-03 | 2014-07-24 | Heraeus Noblelight Gmbh | Vorrichtung zum Trocknen und Sintern metallhaltiger Tinte auf einem Substrat |
US9613915B2 (en) | 2014-12-02 | 2017-04-04 | International Business Machines Corporation | Reduced-warpage laminate structure |
JP6439973B2 (ja) * | 2014-12-24 | 2018-12-19 | Dic株式会社 | 積層体、導電性パターン及び電子回路 |
US10057981B2 (en) * | 2015-06-10 | 2018-08-21 | Industry Foundation Of Chonnam National University | Stretchable circuit board and method of manufacturing the same |
EP3466925A4 (en) * | 2016-06-03 | 2019-11-13 | DIC Corporation | SUBSTITUTED OR UNSUBSTITUTED ALLYL GROUP CONTAINING MALEIMIDE COMPOUND, MANUFACTURING METHOD, AND COMPOSITION AND CURED PRODUCT USING THE SAID COMPOUND |
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- 2014-01-21 KR KR1020157012419A patent/KR101562494B1/ko active IP Right Grant
- 2014-01-21 TW TW103102164A patent/TWI513588B/zh active
- 2014-01-21 CN CN201480005817.6A patent/CN104936774B/zh active Active
- 2014-01-21 DE DE112014000530.4T patent/DE112014000530T5/de not_active Ceased
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TW201438916A (zh) | 2014-10-16 |
JPWO2014115710A1 (ja) | 2017-01-26 |
KR101562494B1 (ko) | 2015-10-21 |
WO2014115710A1 (ja) | 2014-07-31 |
KR20150063160A (ko) | 2015-06-08 |
CN104936774B (zh) | 2017-11-14 |
CN104936774A (zh) | 2015-09-23 |
US20150359095A1 (en) | 2015-12-10 |
US9374895B2 (en) | 2016-06-21 |
DE112014000530T5 (de) | 2015-10-22 |
TWI513588B (zh) | 2015-12-21 |
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