JP5695656B2 - 自己整列グラフェン・トランジスタ - Google Patents
自己整列グラフェン・トランジスタ Download PDFInfo
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- JP5695656B2 JP5695656B2 JP2012538249A JP2012538249A JP5695656B2 JP 5695656 B2 JP5695656 B2 JP 5695656B2 JP 2012538249 A JP2012538249 A JP 2012538249A JP 2012538249 A JP2012538249 A JP 2012538249A JP 5695656 B2 JP5695656 B2 JP 5695656B2
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- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 title claims description 83
- 229910021389 graphene Inorganic materials 0.000 title claims description 82
- 125000006850 spacer group Chemical group 0.000 claims description 25
- 238000000034 method Methods 0.000 claims description 24
- 230000005669 field effect Effects 0.000 claims description 15
- 229910052751 metal Inorganic materials 0.000 claims description 11
- 239000002184 metal Substances 0.000 claims description 11
- 239000003989 dielectric material Substances 0.000 claims description 3
- 229920000642 polymer Polymers 0.000 claims description 3
- 230000008021 deposition Effects 0.000 claims description 2
- 229910044991 metal oxide Inorganic materials 0.000 claims 2
- 150000004706 metal oxides Chemical class 0.000 claims 2
- 239000010410 layer Substances 0.000 description 92
- 238000000231 atomic layer deposition Methods 0.000 description 11
- 239000000463 material Substances 0.000 description 8
- 230000008901 benefit Effects 0.000 description 5
- 230000003071 parasitic effect Effects 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- 125000004429 atom Chemical group 0.000 description 4
- 238000005530 etching Methods 0.000 description 4
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 3
- 238000000151 deposition Methods 0.000 description 3
- 238000001459 lithography Methods 0.000 description 3
- 238000005240 physical vapour deposition Methods 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 125000004432 carbon atom Chemical group C* 0.000 description 2
- 239000007772 electrode material Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000011282 treatment Methods 0.000 description 2
- 241000270666 Testudines Species 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 239000012777 electrically insulating material Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000007306 functionalization reaction Methods 0.000 description 1
- CJNBYAVZURUTKZ-UHFFFAOYSA-N hafnium(iv) oxide Chemical compound O=[Hf]=O CJNBYAVZURUTKZ-UHFFFAOYSA-N 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 229910001928 zirconium oxide Inorganic materials 0.000 description 1
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
- H01L29/78684—Thin film transistors, i.e. transistors with a channel being at least partly a thin film having a semiconductor body comprising semiconductor materials of Group IV not being silicon, or alloys including an element of the group IV, e.g. Ge, SiN alloys, SiC alloys
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Thin Film Transistor (AREA)
- Carbon And Carbon Compounds (AREA)
- Electrodes Of Semiconductors (AREA)
- Formation Of Insulating Films (AREA)
Description
Claims (15)
- ゲート・スタックであって、シード層、前記シード層の上に形成されたゲート酸化物および前記ゲート酸化物の上に形成されたゲート金属を含む、前記ゲート・スタックと、
絶縁層と、
前記シード層と前記絶縁層との間に設けられたグラフェン・シートと、
前記ゲート・スタックの上面および両側面に形成され、前記グラフェン・シート上に堆積されていない酸化物スペーサと、
を含むグラフェン電界効果トランジスタ。 - 前記グラフェン・シート上に形成され、前記酸化物スペーサによって前記ゲート・スタックから隔てられたソース・コンタクトと、
前記グラフェン・シート上に形成され、前記酸化物スペーサによって前記ゲート・スタックから隔てられたドレイン・コンタクトと、
をさらに含む、請求項1に記載のグラフェン電界効果トランジスタ。 - 前記グラフェン・シートは前記絶縁層の上に堆積される、請求項1に記載のグラフェン電界効果トランジスタ。
- 前記グラフェン・シートは前記絶縁層上で成長される、請求項1に記載のグラフェン電界効果トランジスタ。
- 前記シード層は、ポリマーおよび酸化金属膜の一つを含む、請求項1に記載のグラフェン電界効果トランジスタ。
- 前記ゲート酸化物は誘電体である、請求項1に記載のグラフェン電界効果トランジスタ。
- 前記誘電体はhigh−k誘電体である、請求項6に記載のグラフェン電界効果トランジスタ。
- 前記酸化物スペーサは、前記ゲート金属の一部を露出させるため除去された部分を有する、請求項1に記載のグラフェン電界効果トランジスタ。
- グラフェン電界効果トランジスタを形成する方法であって、
絶縁層を用意するステップと、
前記絶縁層上にグラフェン・シートを形成するステップと、
前記グラフェン・シート上にシード層を形成するステップと、
前記シード層の上にゲート誘電体層を形成するステップと、
前記ゲート誘電体層の上面にゲートを形成するステップと、
前記シード層、前記ゲート誘電体層および前記ゲートで構成されるゲート・スタックおよび前記グラフェン・シート上に酸化物のALD堆積を行うことによって前記グラフェン・シートに付着しない酸化物スペーサを形成し、該酸化物スペーサ中に前記シード層、前記ゲート誘電体層、および前記ゲートをカプセル化してカプセル化ゲート・スタックを形成するステップと、
前記グラフェン・シート上の、前記カプセル化ゲート・スタックの第一側にソース・コンタクトを形成するステップと、
前記グラフェン・シート上の、前記カプセル化ゲート・スタックの第二側にドレイン・コンタクトを形成するステップと、
を含む、方法。 - 前記グラフェン・シートが前記絶縁層上で成長される、請求項9に記載の方法。
- 前記シード層は前記グラフェン・シートを機能化させる、請求項9に記載の方法。
- 前記シード層は、ポリマーおよび酸化金属膜の一つを含む、請求項9に記載の方法。
- 前記ゲート誘電体層はhigh−k誘電体材料で形成される、請求項9に記載の方法。
- チャネルの長さは前記ゲートの長さおよび前記酸化物スペーサの厚さで規定される、請求項9に記載の方法。
- 前記ソース・コンタクトは、前記酸化物スペーサによって前記ゲート・スタックから隔てられる、請求項9に記載の方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/617,770 | 2009-11-13 | ||
US12/617,770 US8106383B2 (en) | 2009-11-13 | 2009-11-13 | Self-aligned graphene transistor |
PCT/EP2010/062703 WO2011057833A1 (en) | 2009-11-13 | 2010-08-31 | Self-aligned graphene transistor |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2013511139A JP2013511139A (ja) | 2013-03-28 |
JP5695656B2 true JP5695656B2 (ja) | 2015-04-08 |
Family
ID=42829592
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012538249A Expired - Fee Related JP5695656B2 (ja) | 2009-11-13 | 2010-08-31 | 自己整列グラフェン・トランジスタ |
Country Status (7)
Country | Link |
---|---|
US (1) | US8106383B2 (ja) |
JP (1) | JP5695656B2 (ja) |
CN (1) | CN102612751B (ja) |
DE (1) | DE112010004367B4 (ja) |
GB (1) | GB2487308B (ja) |
TW (1) | TWI515896B (ja) |
WO (1) | WO2011057833A1 (ja) |
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-
2009
- 2009-11-13 US US12/617,770 patent/US8106383B2/en active Active
-
2010
- 2010-08-31 GB GB1201184.7A patent/GB2487308B/en not_active Expired - Fee Related
- 2010-08-31 DE DE112010004367.1T patent/DE112010004367B4/de active Active
- 2010-08-31 JP JP2012538249A patent/JP5695656B2/ja not_active Expired - Fee Related
- 2010-08-31 CN CN201080051125.7A patent/CN102612751B/zh not_active Expired - Fee Related
- 2010-08-31 WO PCT/EP2010/062703 patent/WO2011057833A1/en active Application Filing
- 2010-09-10 TW TW099130617A patent/TWI515896B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
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GB201201184D0 (en) | 2012-03-07 |
GB2487308B (en) | 2014-03-05 |
DE112010004367B4 (de) | 2014-08-07 |
JP2013511139A (ja) | 2013-03-28 |
CN102612751B (zh) | 2015-02-25 |
GB2487308A (en) | 2012-07-18 |
CN102612751A (zh) | 2012-07-25 |
TWI515896B (zh) | 2016-01-01 |
US8106383B2 (en) | 2012-01-31 |
US20110114919A1 (en) | 2011-05-19 |
TW201126716A (en) | 2011-08-01 |
WO2011057833A1 (en) | 2011-05-19 |
DE112010004367T5 (de) | 2012-11-22 |
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