JP5695637B2 - 超小型回路試験器の導電ケルビン接点 - Google Patents

超小型回路試験器の導電ケルビン接点 Download PDF

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Publication number
JP5695637B2
JP5695637B2 JP2012507350A JP2012507350A JP5695637B2 JP 5695637 B2 JP5695637 B2 JP 5695637B2 JP 2012507350 A JP2012507350 A JP 2012507350A JP 2012507350 A JP2012507350 A JP 2012507350A JP 5695637 B2 JP5695637 B2 JP 5695637B2
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Japan
Prior art keywords
contact
conductive
contacts
push
test
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Active
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JP2012507350A
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English (en)
Japanese (ja)
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JP2012524905A5 (https=
JP2012524905A (ja
Inventor
エヌ． エアドマン，ジョエル
エヌ． エアドマン，ジョエル
シー． シェリー，ジェフリー
シー． シェリー，ジェフリー
ダブリュー． ミチャルコ，ガリー
ダブリュー． ミチャルコ，ガリー
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Johnstech International Corp
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Johnstech International Corp
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Publication of JP2012524905A5 publication Critical patent/JP2012524905A5/ja
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0441—Details
    • G01R1/0466—Details concerning contact pieces or mechanical details, e.g. hinges or cams; Shielding
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G01R1/07378—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate adapter, e.g. space transformers

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Measuring Leads Or Probes (AREA)
JP2012507350A 2009-04-21 2010-04-21 超小型回路試験器の導電ケルビン接点 Active JP5695637B2 (ja)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
US17114109P 2009-04-21 2009-04-21
US61/171,141 2009-04-21
US25723609P 2009-11-02 2009-11-02
US61/257,236 2009-11-02
US30750110P 2010-02-24 2010-02-24
US61/307,501 2010-02-24
PCT/US2010/031896 WO2010123991A2 (en) 2009-04-21 2010-04-21 Electrically conductive kelvin contacts for microcircuit tester

Publications (3)

Publication Number Publication Date
JP2012524905A JP2012524905A (ja) 2012-10-18
JP2012524905A5 JP2012524905A5 (https=) 2014-05-29
JP5695637B2 true JP5695637B2 (ja) 2015-04-08

Family

ID=42980534

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012507350A Active JP5695637B2 (ja) 2009-04-21 2010-04-21 超小型回路試験器の導電ケルビン接点

Country Status (9)

Country Link
US (2) US8558554B2 (https=)
EP (1) EP2422205B1 (https=)
JP (1) JP5695637B2 (https=)
KR (1) KR101399071B1 (https=)
CN (1) CN102483435B (https=)
CA (1) CA2759189C (https=)
MY (1) MY179297A (https=)
SG (1) SG175302A1 (https=)
WO (1) WO2010123991A2 (https=)

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LT3788B (en) 1990-11-15 1996-03-25 Juergen Kulle Excavator

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US8912810B2 (en) * 2011-09-09 2014-12-16 Texas Instruments Incorporated Contactor with multi-pin device contacts
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US9040986B2 (en) * 2012-01-23 2015-05-26 Taiwan Semiconductor Manufacturing Company, Ltd. Three dimensional integrated circuit having a resistance measurement structure and method of use
US8933720B2 (en) * 2012-02-10 2015-01-13 Asm Technology Singapore Pte Ltd Apparatus for conducting automated maintenance of a test contactor module
GB201202519D0 (en) 2012-02-13 2012-03-28 Oxford Nanopore Tech Ltd Apparatus for supporting an array of layers of amphiphilic molecules and method of forming an array of layers of amphiphilic molecules
JP6009544B2 (ja) * 2012-04-17 2016-10-19 ユニテクノ株式会社 ケルビンコンタクトプローブおよびそれを備えたケルビン検査治具
US20140070831A1 (en) * 2012-08-27 2014-03-13 Advantest Corporation System and method of protecting probes by using an intelligent current sensing switch
GB201313121D0 (en) 2013-07-23 2013-09-04 Oxford Nanopore Tech Ltd Array of volumes of polar medium
US9274141B1 (en) * 2013-01-22 2016-03-01 Johnstech International Corporation Low resistance low wear test pin for test contactor
DE102013100700B3 (de) * 2013-01-24 2014-05-15 Infineon Technologies Ag Verfahren zur herstellung einer halbleitermodulanordnung
DE102013100701B4 (de) 2013-01-24 2022-07-21 Infineon Technologies Ag Halbleitermodulanordnung und verfahren zur herstellung einer halbleitermodulanordnung
US10006942B2 (en) * 2013-05-13 2018-06-26 Intel IP Corporation Board, integrated circuit testing arrangement, and method for operating an integrated circuit
JP6407672B2 (ja) * 2014-11-18 2018-10-17 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
US11385277B2 (en) 2019-08-05 2022-07-12 Modus Test, Llc Modular electronic testing system with flexible test PCB format
US10156586B2 (en) * 2015-01-16 2018-12-18 Modus Test, Llc Force deflection and resistance testing system and method of use
US12571833B2 (en) 2015-01-16 2026-03-10 Modus Test, Llc Force, deflection, resistance, and temperature testing system and method of use
US10151774B2 (en) * 2015-06-10 2018-12-11 Asm Technology Singapore Pte Ltd Electrical contact having electrical isolated members for contacting an electrical component
KR101728399B1 (ko) 2015-10-08 2017-04-20 주식회사 이노글로벌 켈빈 테스트용 프로브, 켈빈 테스트용 프로브 모듈 및 그 제조방법
MY179228A (en) * 2016-02-22 2020-11-02 Jf Microtechnology Sdn Bhd Kelvin contact assembly and method of installation thereof
US10495688B1 (en) 2016-04-26 2019-12-03 Johnstech International Corporation Manual test socket and method of adjustment
IT201700019437A1 (it) * 2017-02-21 2018-08-21 St Microelectronics Srl Scheda di test per un dispositivo attuabile magneticamente, e sistema di test includente la scheda di test
KR101780476B1 (ko) 2017-03-03 2017-09-21 (주)티에스이 검사용 소켓
MY185304A (en) * 2017-05-18 2021-04-30 Jf Microtechnology Sdn Bhd High precision vertical motion kelvin contact assembly
TWI623996B (zh) * 2017-07-24 2018-05-11 中華精測科技股份有限公司 整合信號及電源完整性模組之積體電路測試座
CN107545246A (zh) * 2017-08-17 2018-01-05 华天科技（西安）有限公司 一种指纹识别芯片的封装结构及其封装方法
MX2020007325A (es) * 2017-09-25 2021-01-29 Johnstech Int Corp Contactor de alto grado de aislamiento con clavija de prueba y carcasa para probar circuitos integrados.
US10367279B2 (en) * 2017-10-26 2019-07-30 Xilinx, Inc. Pusher pin having a non-electrically conductive portion
GB2568895B (en) 2017-11-29 2021-10-27 Oxford Nanopore Tech Ltd Microfluidic device
GB2574048B (en) 2018-05-24 2021-06-16 Oxford Nanopore Tech Ltd Nanopore sensor component with electrostatic discharge protection
CN110376511A (zh) * 2019-08-17 2019-10-25 深圳斯普瑞溙科技有限公司 测试极小间距及触点芯片的金手指
TWI737199B (zh) * 2020-02-27 2021-08-21 黃文斌 電子元件測試夾具
WO2022013551A1 (en) 2020-07-17 2022-01-20 Oxford Nanopore Technologies Limited Nanopore sensing device
CN112083315A (zh) * 2020-09-15 2020-12-15 苏州韬盛电子科技有限公司 一种针对qfn的开尔文测试插座
WO2022072858A1 (en) * 2020-10-02 2022-04-07 Johnstech International Corporation Housing with anti-dislodge capability
TWI755919B (zh) * 2020-11-03 2022-02-21 中華精測科技股份有限公司 板狀連接器與其雙環式串接件、及晶圓測試組件
US11906576B1 (en) 2021-05-04 2024-02-20 Johnstech International Corporation Contact assembly array and testing system having contact assembly array
US11867752B1 (en) * 2021-05-13 2024-01-09 Johnstech International Corporation Contact assembly and kelvin testing system having contact assembly
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* Cited by examiner, † Cited by third party
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LT3788B (en) 1990-11-15 1996-03-25 Juergen Kulle Excavator

Also Published As

Publication number Publication date
EP2422205B1 (en) 2019-09-18
US8558554B2 (en) 2013-10-15
US20100264935A1 (en) 2010-10-21
KR20120013397A (ko) 2012-02-14
WO2010123991A3 (en) 2012-02-02
CA2759189C (en) 2019-05-21
MY179297A (en) 2020-11-04
KR101399071B1 (ko) 2014-05-27
EP2422205A4 (en) 2017-08-30
EP2422205A2 (en) 2012-02-29
US20140103949A1 (en) 2014-04-17
US9500673B2 (en) 2016-11-22
JP2012524905A (ja) 2012-10-18
CN102483435A (zh) 2012-05-30
SG175302A1 (en) 2011-11-28
WO2010123991A2 (en) 2010-10-28
CA2759189A1 (en) 2010-10-28
CN102483435B (zh) 2016-06-08
HK1171264A1 (zh) 2013-03-22

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