CN102483435B - 用于微电路测试器的导电开尔文接触件 - Google Patents
用于微电路测试器的导电开尔文接触件 Download PDFInfo
- Publication number
- CN102483435B CN102483435B CN201080027549.XA CN201080027549A CN102483435B CN 102483435 B CN102483435 B CN 102483435B CN 201080027549 A CN201080027549 A CN 201080027549A CN 102483435 B CN102483435 B CN 102483435B
- Authority
- CN
- China
- Prior art keywords
- contact
- force
- contacts
- sense
- under test
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0433—Sockets for IC's or transistors
- G01R1/0441—Details
- G01R1/0466—Details concerning contact pieces or mechanical details, e.g. hinges or cams; Shielding
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
- G01R1/07378—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate adapter, e.g. space transformers
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Measuring Leads Or Probes (AREA)
Applications Claiming Priority (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US17114109P | 2009-04-21 | 2009-04-21 | |
| US61/171,141 | 2009-04-21 | ||
| US25723609P | 2009-11-02 | 2009-11-02 | |
| US61/257,236 | 2009-11-02 | ||
| US30750110P | 2010-02-24 | 2010-02-24 | |
| US61/307,501 | 2010-02-24 | ||
| PCT/US2010/031896 WO2010123991A2 (en) | 2009-04-21 | 2010-04-21 | Electrically conductive kelvin contacts for microcircuit tester |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102483435A CN102483435A (zh) | 2012-05-30 |
| CN102483435B true CN102483435B (zh) | 2016-06-08 |
Family
ID=42980534
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201080027549.XA Active CN102483435B (zh) | 2009-04-21 | 2010-04-21 | 用于微电路测试器的导电开尔文接触件 |
Country Status (9)
| Country | Link |
|---|---|
| US (2) | US8558554B2 (https=) |
| EP (1) | EP2422205B1 (https=) |
| JP (1) | JP5695637B2 (https=) |
| KR (1) | KR101399071B1 (https=) |
| CN (1) | CN102483435B (https=) |
| CA (1) | CA2759189C (https=) |
| MY (1) | MY179297A (https=) |
| SG (1) | SG175302A1 (https=) |
| WO (1) | WO2010123991A2 (https=) |
Families Citing this family (47)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4133505A1 (de) | 1990-11-15 | 1992-05-21 | Juergen Kulle | Vorrichtung zur fuehrung wenigstens eines werkzeugs |
| GB0724736D0 (en) | 2007-12-19 | 2008-01-30 | Oxford Nanolabs Ltd | Formation of layers of amphiphilic molecules |
| US8988090B2 (en) * | 2009-04-21 | 2015-03-24 | Johnstech International Corporation | Electrically conductive kelvin contacts for microcircuit tester |
| US9329204B2 (en) | 2009-04-21 | 2016-05-03 | Johnstech International Corporation | Electrically conductive Kelvin contacts for microcircuit tester |
| US9069011B2 (en) * | 2009-09-11 | 2015-06-30 | Exelon Generation Company, Llc | Electrical terminal test point and methods of use |
| US8912810B2 (en) * | 2011-09-09 | 2014-12-16 | Texas Instruments Incorporated | Contactor with multi-pin device contacts |
| TWI453425B (zh) * | 2012-09-07 | 2014-09-21 | Mjc Probe Inc | 晶片電性偵測裝置及其形成方法 |
| CN102565468B (zh) * | 2011-12-26 | 2013-10-16 | 天津中环半导体股份有限公司 | 开尔文测试载片台 |
| US9040986B2 (en) * | 2012-01-23 | 2015-05-26 | Taiwan Semiconductor Manufacturing Company, Ltd. | Three dimensional integrated circuit having a resistance measurement structure and method of use |
| US8933720B2 (en) * | 2012-02-10 | 2015-01-13 | Asm Technology Singapore Pte Ltd | Apparatus for conducting automated maintenance of a test contactor module |
| GB201202519D0 (en) | 2012-02-13 | 2012-03-28 | Oxford Nanopore Tech Ltd | Apparatus for supporting an array of layers of amphiphilic molecules and method of forming an array of layers of amphiphilic molecules |
| JP6009544B2 (ja) * | 2012-04-17 | 2016-10-19 | ユニテクノ株式会社 | ケルビンコンタクトプローブおよびそれを備えたケルビン検査治具 |
| US20140070831A1 (en) * | 2012-08-27 | 2014-03-13 | Advantest Corporation | System and method of protecting probes by using an intelligent current sensing switch |
| GB201313121D0 (en) | 2013-07-23 | 2013-09-04 | Oxford Nanopore Tech Ltd | Array of volumes of polar medium |
| US9274141B1 (en) * | 2013-01-22 | 2016-03-01 | Johnstech International Corporation | Low resistance low wear test pin for test contactor |
| DE102013100700B3 (de) * | 2013-01-24 | 2014-05-15 | Infineon Technologies Ag | Verfahren zur herstellung einer halbleitermodulanordnung |
| DE102013100701B4 (de) | 2013-01-24 | 2022-07-21 | Infineon Technologies Ag | Halbleitermodulanordnung und verfahren zur herstellung einer halbleitermodulanordnung |
| US10006942B2 (en) * | 2013-05-13 | 2018-06-26 | Intel IP Corporation | Board, integrated circuit testing arrangement, and method for operating an integrated circuit |
| JP6407672B2 (ja) * | 2014-11-18 | 2018-10-17 | ルネサスエレクトロニクス株式会社 | 半導体装置の製造方法 |
| US11385277B2 (en) | 2019-08-05 | 2022-07-12 | Modus Test, Llc | Modular electronic testing system with flexible test PCB format |
| US10156586B2 (en) * | 2015-01-16 | 2018-12-18 | Modus Test, Llc | Force deflection and resistance testing system and method of use |
| US12571833B2 (en) | 2015-01-16 | 2026-03-10 | Modus Test, Llc | Force, deflection, resistance, and temperature testing system and method of use |
| US10151774B2 (en) * | 2015-06-10 | 2018-12-11 | Asm Technology Singapore Pte Ltd | Electrical contact having electrical isolated members for contacting an electrical component |
| KR101728399B1 (ko) | 2015-10-08 | 2017-04-20 | 주식회사 이노글로벌 | 켈빈 테스트용 프로브, 켈빈 테스트용 프로브 모듈 및 그 제조방법 |
| MY179228A (en) * | 2016-02-22 | 2020-11-02 | Jf Microtechnology Sdn Bhd | Kelvin contact assembly and method of installation thereof |
| US10495688B1 (en) | 2016-04-26 | 2019-12-03 | Johnstech International Corporation | Manual test socket and method of adjustment |
| IT201700019437A1 (it) * | 2017-02-21 | 2018-08-21 | St Microelectronics Srl | Scheda di test per un dispositivo attuabile magneticamente, e sistema di test includente la scheda di test |
| KR101780476B1 (ko) | 2017-03-03 | 2017-09-21 | (주)티에스이 | 검사용 소켓 |
| MY185304A (en) * | 2017-05-18 | 2021-04-30 | Jf Microtechnology Sdn Bhd | High precision vertical motion kelvin contact assembly |
| TWI623996B (zh) * | 2017-07-24 | 2018-05-11 | 中華精測科技股份有限公司 | 整合信號及電源完整性模組之積體電路測試座 |
| CN107545246A (zh) * | 2017-08-17 | 2018-01-05 | 华天科技(西安)有限公司 | 一种指纹识别芯片的封装结构及其封装方法 |
| MX2020007325A (es) * | 2017-09-25 | 2021-01-29 | Johnstech Int Corp | Contactor de alto grado de aislamiento con clavija de prueba y carcasa para probar circuitos integrados. |
| US10367279B2 (en) * | 2017-10-26 | 2019-07-30 | Xilinx, Inc. | Pusher pin having a non-electrically conductive portion |
| GB2568895B (en) | 2017-11-29 | 2021-10-27 | Oxford Nanopore Tech Ltd | Microfluidic device |
| GB2574048B (en) | 2018-05-24 | 2021-06-16 | Oxford Nanopore Tech Ltd | Nanopore sensor component with electrostatic discharge protection |
| CN110376511A (zh) * | 2019-08-17 | 2019-10-25 | 深圳斯普瑞溙科技有限公司 | 测试极小间距及触点芯片的金手指 |
| TWI737199B (zh) * | 2020-02-27 | 2021-08-21 | 黃文斌 | 電子元件測試夾具 |
| WO2022013551A1 (en) | 2020-07-17 | 2022-01-20 | Oxford Nanopore Technologies Limited | Nanopore sensing device |
| CN112083315A (zh) * | 2020-09-15 | 2020-12-15 | 苏州韬盛电子科技有限公司 | 一种针对qfn的开尔文测试插座 |
| WO2022072858A1 (en) * | 2020-10-02 | 2022-04-07 | Johnstech International Corporation | Housing with anti-dislodge capability |
| TWI755919B (zh) * | 2020-11-03 | 2022-02-21 | 中華精測科技股份有限公司 | 板狀連接器與其雙環式串接件、及晶圓測試組件 |
| US11906576B1 (en) | 2021-05-04 | 2024-02-20 | Johnstech International Corporation | Contact assembly array and testing system having contact assembly array |
| US11867752B1 (en) * | 2021-05-13 | 2024-01-09 | Johnstech International Corporation | Contact assembly and kelvin testing system having contact assembly |
| EP4119958B1 (en) * | 2021-07-16 | 2023-09-27 | Cohu GmbH | Contact socket module and method of testing electronic components using a contact socket module |
| USD1015282S1 (en) | 2022-02-01 | 2024-02-20 | Johnstech International Corporation | Spring pin tip |
| WO2023150615A2 (en) | 2022-02-07 | 2023-08-10 | Johnstech International Corporation | Spring probe assembly for a kelvin testing system |
| CN115184754B (zh) * | 2022-09-09 | 2022-12-06 | 江苏通强电气设备有限公司 | 一种用于配电柜的绝缘检测设备 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4308498A (en) * | 1979-07-19 | 1981-12-29 | Rca Corporation | Kelvin test fixture for electrically contacting miniature, two terminal, leadless, electrical components |
| US6069480A (en) * | 1997-12-31 | 2000-05-30 | Aetrium-Fsa, Lp | Kelvin contact-type testing device |
| US20070023823A1 (en) * | 2005-07-27 | 2007-02-01 | Seung-Jun Lee | Nonvolatile semiconductor memory device and related method |
| CN101067642A (zh) * | 2006-02-24 | 2007-11-07 | 丹尼斯·B·歇尔 | 电子器件测试装置及其所使用的触头 |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02271263A (ja) * | 1989-04-12 | 1990-11-06 | Nec Corp | コンタクトピン |
| JPH0743408B2 (ja) * | 1990-05-24 | 1995-05-15 | 積水化学工業株式会社 | 表示装置用導電性透明体の導通検出装置 |
| JPH0451675U (https=) * | 1990-09-05 | 1992-04-30 | ||
| JP3054003B2 (ja) * | 1993-09-01 | 2000-06-19 | 株式会社東芝 | Icコンタクタ |
| US6888362B2 (en) * | 2000-11-09 | 2005-05-03 | Formfactor, Inc. | Test head assembly for electronic components with plurality of contoured microelectronic spring contacts |
| US20020149388A1 (en) * | 2001-04-11 | 2002-10-17 | Cleston Messick | Method for the accurate electrical testing of semiconductor devices |
| US7218127B2 (en) * | 2004-02-18 | 2007-05-15 | Formfactor, Inc. | Method and apparatus for probing an electronic device in which movement of probes and/or the electronic device includes a lateral component |
| US7074049B2 (en) * | 2004-03-22 | 2006-07-11 | Johnstech International Corporation | Kelvin contact module for a microcircuit test system |
| EP1753100A4 (en) * | 2004-06-03 | 2008-05-07 | Nihon Micronics Kk | CONTACTOR AND ELECTRICAL CONNECTOR |
| JP4571640B2 (ja) * | 2004-07-05 | 2010-10-27 | 株式会社日本マイクロニクス | 接触子ブロック及び電気的接続装置 |
| US7639026B2 (en) | 2006-02-24 | 2009-12-29 | Johnstech International Corporation | Electronic device test set and contact used therein |
| US7615434B2 (en) * | 2006-03-24 | 2009-11-10 | United Microelectronics Corp. | CMOS device and fabricating method thereof |
| WO2008083404A1 (en) | 2007-01-02 | 2008-07-10 | Johnstech International Corporation | Microcircuit testing interface having kelvin and signal contacts within a single slot |
| JP2008224640A (ja) * | 2007-03-08 | 2008-09-25 | Isao Kimoto | 先端回転型プローブ組立 |
-
2010
- 2010-04-21 EP EP10767700.7A patent/EP2422205B1/en active Active
- 2010-04-21 CA CA2759189A patent/CA2759189C/en active Active
- 2010-04-21 SG SG2011077252A patent/SG175302A1/en unknown
- 2010-04-21 KR KR1020117027706A patent/KR101399071B1/ko active Active
- 2010-04-21 US US12/764,603 patent/US8558554B2/en active Active
- 2010-04-21 CN CN201080027549.XA patent/CN102483435B/zh active Active
- 2010-04-21 WO PCT/US2010/031896 patent/WO2010123991A2/en not_active Ceased
- 2010-04-21 JP JP2012507350A patent/JP5695637B2/ja active Active
- 2010-04-21 MY MYPI2011005038A patent/MY179297A/en unknown
-
2013
- 2013-10-15 US US14/053,794 patent/US9500673B2/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4308498A (en) * | 1979-07-19 | 1981-12-29 | Rca Corporation | Kelvin test fixture for electrically contacting miniature, two terminal, leadless, electrical components |
| US6069480A (en) * | 1997-12-31 | 2000-05-30 | Aetrium-Fsa, Lp | Kelvin contact-type testing device |
| US20070023823A1 (en) * | 2005-07-27 | 2007-02-01 | Seung-Jun Lee | Nonvolatile semiconductor memory device and related method |
| CN101067642A (zh) * | 2006-02-24 | 2007-11-07 | 丹尼斯·B·歇尔 | 电子器件测试装置及其所使用的触头 |
Also Published As
| Publication number | Publication date |
|---|---|
| EP2422205B1 (en) | 2019-09-18 |
| US8558554B2 (en) | 2013-10-15 |
| US20100264935A1 (en) | 2010-10-21 |
| KR20120013397A (ko) | 2012-02-14 |
| WO2010123991A3 (en) | 2012-02-02 |
| JP5695637B2 (ja) | 2015-04-08 |
| CA2759189C (en) | 2019-05-21 |
| MY179297A (en) | 2020-11-04 |
| KR101399071B1 (ko) | 2014-05-27 |
| EP2422205A4 (en) | 2017-08-30 |
| EP2422205A2 (en) | 2012-02-29 |
| US20140103949A1 (en) | 2014-04-17 |
| US9500673B2 (en) | 2016-11-22 |
| JP2012524905A (ja) | 2012-10-18 |
| CN102483435A (zh) | 2012-05-30 |
| SG175302A1 (en) | 2011-11-28 |
| WO2010123991A2 (en) | 2010-10-28 |
| CA2759189A1 (en) | 2010-10-28 |
| HK1171264A1 (zh) | 2013-03-22 |
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