JP5691657B2 - 感光性樹脂組成物およびその用途 - Google Patents

感光性樹脂組成物およびその用途 Download PDF

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JP5691657B2
JP5691657B2 JP2011047818A JP2011047818A JP5691657B2 JP 5691657 B2 JP5691657 B2 JP 5691657B2 JP 2011047818 A JP2011047818 A JP 2011047818A JP 2011047818 A JP2011047818 A JP 2011047818A JP 5691657 B2 JP5691657 B2 JP 5691657B2
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JP2012185291A (ja
JP2012185291A5 (enExample
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吉徳 二戸
吉徳 二戸
寛之 田口
寛之 田口
高橋　修一
修一 高橋
加藤　行浩
行浩 加藤
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NOF Corp
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JP2011047818A 2011-03-04 2011-03-04 感光性樹脂組成物およびその用途 Active JP5691657B2 (ja)

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JP2011047818A JP5691657B2 (ja) 2011-03-04 2011-03-04 感光性樹脂組成物およびその用途

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JP2011047818A JP5691657B2 (ja) 2011-03-04 2011-03-04 感光性樹脂組成物およびその用途

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JP2012185291A JP2012185291A (ja) 2012-09-27
JP2012185291A5 JP2012185291A5 (enExample) 2014-03-06
JP5691657B2 true JP5691657B2 (ja) 2015-04-01

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Families Citing this family (6)

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Publication number Priority date Publication date Assignee Title
JP2013130816A (ja) * 2011-12-22 2013-07-04 Nippon Zeon Co Ltd 永久膜用樹脂組成物及び電子部品
JP6143369B2 (ja) * 2014-09-29 2017-06-07 富士フイルム株式会社 樹脂組成物、フィルム、偏光板保護フィルム、偏光板及び液晶表示装置、ビス型脂環カルドフェノール化合物
KR101669341B1 (ko) * 2014-12-10 2016-10-26 삼성에스디아이 주식회사 반도체 소자 밀봉용 에폭시 수지 조성물 및 이를 사용하여 밀봉된 반도체 소자
JP6607109B2 (ja) * 2016-03-22 2019-11-20 Ｊｓｒ株式会社 硬化膜、表示素子、硬化膜形成用材料及び硬化膜の形成方法
CN115698854B (zh) * 2020-08-17 2025-08-22 东丽株式会社 感光性树脂组合物、硬化物、有机电致发光显示装置、半导体装置及硬化物的制造方法
WO2025121035A1 (ja) * 2023-12-06 2025-06-12 本州化学工業株式会社 ２，２－ビス－（４，４－ビス－（３，５－ジメチル－４－ヒドロキシフェニル）シクロヘキシル）プロパンの結晶及びその製造方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
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JP2003345016A (ja) * 2002-05-23 2003-12-03 Fuji Photo Film Co Ltd 樹脂組成物
CN100535747C (zh) * 2003-07-16 2009-09-02 Az电子材料（日本）株式会社 光敏树脂组合物
JP4753237B2 (ja) * 2005-07-25 2011-08-24 Ａｚエレクトロニックマテリアルズ株式会社 感光性樹脂組成物
JP5417323B2 (ja) * 2008-05-09 2014-02-12 旭化成イーマテリアルズ株式会社 感光性ポリイミド前駆体組成物、感光性ドライフィルム及びフレキシブルプリント配線基板
JP5338352B2 (ja) * 2009-02-09 2013-11-13 日油株式会社 ポジ型感光性樹脂組成物
JP5526693B2 (ja) * 2009-10-09 2014-06-18 日油株式会社 感光性樹脂組成物およびその用途

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