JP5685189B2 - 熱硬化性組成物 - Google Patents
熱硬化性組成物 Download PDFInfo
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- JP5685189B2 JP5685189B2 JP2011522444A JP2011522444A JP5685189B2 JP 5685189 B2 JP5685189 B2 JP 5685189B2 JP 2011522444 A JP2011522444 A JP 2011522444A JP 2011522444 A JP2011522444 A JP 2011522444A JP 5685189 B2 JP5685189 B2 JP 5685189B2
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- JP
- Japan
- Prior art keywords
- alkyl
- unsubstituted
- alkoxy
- cycloalkyl
- phenyl
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000000203 mixture Substances 0.000 title claims description 57
- 229920001187 thermosetting polymer Polymers 0.000 title claims description 50
- -1 nitro, phenyl Chemical group 0.000 claims description 88
- 125000000217 alkyl group Chemical group 0.000 claims description 47
- 238000000034 method Methods 0.000 claims description 31
- 125000004432 carbon atom Chemical group C* 0.000 claims description 29
- BGDOLELXXPTPFX-UHFFFAOYSA-N 3,4-dihydro-2h-1,2-benzoxazine Chemical compound C1=CC=C2ONCCC2=C1 BGDOLELXXPTPFX-UHFFFAOYSA-N 0.000 claims description 23
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 21
- RWSOTUBLDIXVET-UHFFFAOYSA-N Dihydrogen sulfide Chemical class S RWSOTUBLDIXVET-UHFFFAOYSA-N 0.000 claims description 20
- 125000003545 alkoxy group Chemical group 0.000 claims description 19
- 125000000753 cycloalkyl group Chemical group 0.000 claims description 18
- 125000003118 aryl group Chemical group 0.000 claims description 15
- GJVFBWCTGUSGDD-UHFFFAOYSA-L pentamethonium bromide Chemical compound [Br-].[Br-].C[N+](C)(C)CCCCC[N+](C)(C)C GJVFBWCTGUSGDD-UHFFFAOYSA-L 0.000 claims description 15
- 230000008569 process Effects 0.000 claims description 15
- 125000002947 alkylene group Chemical group 0.000 claims description 14
- 229910052736 halogen Inorganic materials 0.000 claims description 14
- 150000002367 halogens Chemical class 0.000 claims description 14
- 125000002252 acyl group Chemical group 0.000 claims description 13
- 125000000951 phenoxy group Chemical group [H]C1=C([H])C([H])=C(O*)C([H])=C1[H] 0.000 claims description 13
- 239000004593 Epoxy Substances 0.000 claims description 12
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical class C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 11
- 150000001875 compounds Chemical class 0.000 claims description 11
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 11
- 125000004453 alkoxycarbonyl group Chemical group 0.000 claims description 10
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 claims description 10
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 claims description 9
- 238000004519 manufacturing process Methods 0.000 claims description 9
- 229930185605 Bisphenol Natural products 0.000 claims description 7
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 claims description 7
- 239000004744 fabric Substances 0.000 claims description 7
- 125000004191 (C1-C6) alkoxy group Chemical group 0.000 claims description 6
- 125000004169 (C1-C6) alkyl group Chemical group 0.000 claims description 6
- 229910018287 SbF 5 Inorganic materials 0.000 claims description 6
- 150000001925 cycloalkenes Chemical class 0.000 claims description 6
- 229910052739 hydrogen Inorganic materials 0.000 claims description 6
- 239000001257 hydrogen Substances 0.000 claims description 6
- 125000001624 naphthyl group Chemical group 0.000 claims description 6
- 125000006552 (C3-C8) cycloalkyl group Chemical group 0.000 claims description 5
- 229910018286 SbF 6 Inorganic materials 0.000 claims description 5
- 238000006243 chemical reaction Methods 0.000 claims description 5
- 125000002723 alicyclic group Chemical group 0.000 claims description 4
- 125000000732 arylene group Chemical group 0.000 claims description 4
- 125000002993 cycloalkylene group Chemical group 0.000 claims description 4
- 125000003700 epoxy group Chemical group 0.000 claims description 4
- 229910017008 AsF 6 Inorganic materials 0.000 claims description 3
- 125000003342 alkenyl group Chemical group 0.000 claims description 3
- 125000004390 alkyl sulfonyl group Chemical group 0.000 claims description 3
- 125000004414 alkyl thio group Chemical group 0.000 claims description 3
- 125000004663 dialkyl amino group Chemical group 0.000 claims description 3
- 125000004957 naphthylene group Chemical group 0.000 claims description 3
- 125000002924 primary amino group Chemical class [H]N([H])* 0.000 claims description 3
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 claims description 2
- 229910015892 BF 4 Inorganic materials 0.000 claims description 2
- 229910021115 PF 6 Inorganic materials 0.000 claims description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 2
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims description 2
- 125000004435 hydrogen atom Chemical class [H]* 0.000 claims 1
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- 239000011347 resin Substances 0.000 description 32
- 230000000052 comparative effect Effects 0.000 description 11
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- 239000003054 catalyst Substances 0.000 description 9
- 238000001721 transfer moulding Methods 0.000 description 8
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 7
- 238000000576 coating method Methods 0.000 description 7
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 6
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 6
- 239000002131 composite material Substances 0.000 description 6
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- 239000011248 coating agent Substances 0.000 description 5
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical class C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 5
- 230000009477 glass transition Effects 0.000 description 5
- 238000010030 laminating Methods 0.000 description 5
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- 229920003986 novolac Polymers 0.000 description 5
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical class C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 4
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- KJFMBFZCATUALV-UHFFFAOYSA-N phenolphthalein Chemical compound C1=CC(O)=CC=C1C1(C=2C=CC(O)=CC=2)C2=CC=CC=C2C(=O)O1 KJFMBFZCATUALV-UHFFFAOYSA-N 0.000 description 4
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- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 3
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 3
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- 238000005266 casting Methods 0.000 description 3
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 3
- 125000001511 cyclopentyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C1([H])[H] 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 3
- 239000004615 ingredient Substances 0.000 description 3
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 239000003973 paint Substances 0.000 description 3
- 125000000843 phenylene group Chemical group C1(=C(C=CC=C1)*)* 0.000 description 3
- 229910052698 phosphorus Inorganic materials 0.000 description 3
- 239000011574 phosphorus Substances 0.000 description 3
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 description 2
- 125000004203 4-hydroxyphenyl group Chemical group [H]OC1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 2
- 229920000049 Carbon (fiber) Polymers 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 description 2
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 2
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- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 2
- AMQJEAYHLZJPGS-UHFFFAOYSA-N N-Pentanol Chemical compound CCCCCO AMQJEAYHLZJPGS-UHFFFAOYSA-N 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
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- 238000004132 cross linking Methods 0.000 description 2
- HGCIXCUEYOPUTN-UHFFFAOYSA-N cyclohexene Chemical compound C1CCC=CC1 HGCIXCUEYOPUTN-UHFFFAOYSA-N 0.000 description 2
- 125000000640 cyclooctyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C([H])([H])C1([H])[H] 0.000 description 2
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 2
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- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 229910052593 corundum Inorganic materials 0.000 description 1
- 239000010431 corundum Substances 0.000 description 1
- 238000001723 curing Methods 0.000 description 1
- 125000000582 cycloheptyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- IFDVQVHZEKPUSC-UHFFFAOYSA-N cyclohex-3-ene-1,2-dicarboxylic acid Chemical compound OC(=O)C1CCC=CC1C(O)=O IFDVQVHZEKPUSC-UHFFFAOYSA-N 0.000 description 1
- QSAWQNUELGIYBC-UHFFFAOYSA-N cyclohexane-1,2-dicarboxylic acid Chemical compound OC(=O)C1CCCCC1C(O)=O QSAWQNUELGIYBC-UHFFFAOYSA-N 0.000 description 1
- URYYVOIYTNXXBN-UPHRSURJSA-N cyclooctene Chemical compound C1CCC\C=C/CC1 URYYVOIYTNXXBN-UPHRSURJSA-N 0.000 description 1
- 239000004913 cyclooctene Substances 0.000 description 1
- 125000001559 cyclopropyl group Chemical group [H]C1([H])C([H])([H])C1([H])* 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 125000002704 decyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000006612 decyloxy group Chemical class 0.000 description 1
- 230000032798 delamination Effects 0.000 description 1
- 235000014113 dietary fatty acids Nutrition 0.000 description 1
- 239000003085 diluting agent Substances 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 229910000514 dolomite Inorganic materials 0.000 description 1
- 239000010459 dolomite Substances 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
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- 230000008020 evaporation Effects 0.000 description 1
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- 238000001879 gelation Methods 0.000 description 1
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- 125000005446 heptyloxy group Chemical class [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])O* 0.000 description 1
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000003707 hexyloxy group Chemical class [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])O* 0.000 description 1
- 239000008240 homogeneous mixture Substances 0.000 description 1
- 239000012943 hotmelt Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 229910052500 inorganic mineral Inorganic materials 0.000 description 1
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 239000004761 kevlar Substances 0.000 description 1
- 125000002960 margaryl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 150000001247 metal acetylides Chemical class 0.000 description 1
- 229910001092 metal group alloy Inorganic materials 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 description 1
- 125000000325 methylidene group Chemical group [H]C([H])=* 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 239000011707 mineral Substances 0.000 description 1
- 239000012778 molding material Substances 0.000 description 1
- DNIAPMSPPWPWGF-UHFFFAOYSA-N monopropylene glycol Natural products CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 1
- 238000003541 multi-stage reaction Methods 0.000 description 1
- 125000001421 myristyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000000740 n-pentyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000004123 n-propyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 239000004763 nomex Substances 0.000 description 1
- 125000001400 nonyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000006611 nonyloxy group Chemical class 0.000 description 1
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000005447 octyloxy group Chemical class [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])O* 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 125000003854 p-chlorophenyl group Chemical group [H]C1=C([H])C(*)=C([H])C([H])=C1Cl 0.000 description 1
- 125000001037 p-tolyl group Chemical group [H]C1=C([H])C(=C([H])C([H])=C1*)C([H])([H])[H] 0.000 description 1
- 125000000913 palmityl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000000123 paper Substances 0.000 description 1
- 125000002958 pentadecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000004115 pentoxy group Chemical class [*]OC([H])([H])C([H])([H])C([H])([H])C(C([H])([H])[H])([H])[H] 0.000 description 1
- 125000001147 pentyl group Chemical group C(CCCC)* 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 150000003018 phosphorus compounds Chemical class 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
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- 239000004014 plasticizer Substances 0.000 description 1
- 229920000768 polyamine Polymers 0.000 description 1
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- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
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- 238000003825 pressing Methods 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 235000013772 propylene glycol Nutrition 0.000 description 1
- WQGWDDDVZFFDIG-UHFFFAOYSA-N pyrogallol Chemical compound OC1=CC=CC(O)=C1O WQGWDDDVZFFDIG-UHFFFAOYSA-N 0.000 description 1
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- 238000005507 spraying Methods 0.000 description 1
- 125000004079 stearyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000012209 synthetic fiber Substances 0.000 description 1
- 229920002994 synthetic fiber Polymers 0.000 description 1
- UFDHBDMSHIXOKF-UHFFFAOYSA-N tetrahydrophthalic acid Natural products OC(=O)C1=C(C(O)=O)CCCC1 UFDHBDMSHIXOKF-UHFFFAOYSA-N 0.000 description 1
- 235000019303 thiodipropionic acid Nutrition 0.000 description 1
- 125000002889 tridecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000002948 undecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 125000005023 xylyl group Chemical group 0.000 description 1
Classifications
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
- C08G59/4014—Nitrogen containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
- C08G59/687—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing sulfur
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/34—Heterocyclic compounds having nitrogen in the ring
- C08K5/35—Heterocyclic compounds having nitrogen in the ring having also oxygen in the ring
- C08K5/357—Six-membered rings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
- H01L23/295—Organic, e.g. plastic containing a filler
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31678—Of metal
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31971—Of carbohydrate
- Y10T428/31989—Of wood
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Organic Chemistry (AREA)
- Polymers & Plastics (AREA)
- Medicinal Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
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- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Epoxy Resins (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Reinforced Plastic Materials (AREA)
Description
成分(a)
本発明の熱硬化性組成物の必須成分は、1つの以上のジヒドロベンゾオキサジン基を含むリン非含有成分(a)である。成分(a)はビス(ジヒドロベンゾオキサジン)(すなわち2つのジヒドロベンゾオキサジン基を含む化合物)であるのが好ましい。成分(A)は、式(I)
式(I)の成分中のR2は水素であるのが好ましい。
R3は、H;C1−C12アルキル;C5もしくはC6シクロアルキル;メチル、エチル、もしくはフェニルで置換されたC5もしくはC6シクロアルキル;ベンジル;またはフェニル−2−エチル;であるのが好ましい。
本発明の好ましい実施態様によれば、成分(a)は、各ヒドロキシル基に対してオルト位に1つ以上の非置換位置を有する非置換もしくは置換ビスフェノールと、ホルムアルデヒドおよび第一アミンとの反応によって製造されるビス(ジヒドロベンゾオキサジン)である。
非置換もしくは置換ビスフェノールは、ヒドロキノン、レゾルシノール、カテコール、または式(II)
式(II)中のR4は独立して、式(I)中のR2と同じ好ましい意味を有してよい。R4は、具体的には水素またはC1−C4アルキル(例えば、メチルやエチル)である。
ビス(ジヒドロベンゾオキサジン)を製造するのに使用されるビスフェノールの幾つかの好ましい例としては、4,4’−ジヒドロキシビフェニル、(4−ヒドロキシフェニル)2(O)(DHBP)、ビス(4−ヒドロキシフェニル)エーテル、ビス(4−ヒドロキシフェニル)チオエーテル、ビスフェノールA、ビスフェノールAP、ビスフェノールE、ビスフェノールH、ビスフェノールF、ビスフェノールS、ビスフェノールZ、フェノールフタレイン、およびビス(4−ヒドロキシフェニル)トリシクロ−[2,1,0]−デカンがある。
本発明の熱硬化性組成物のさらなる必須成分は、スルホニウム塩である成分(b)である。スルホニウム塩は、EP−A1−379464とEP−A1−580552に開示されている方法によって得ることができる。スルホニウム塩(b)は、式(XIII)〜(XVIII)
Ar、Ar1、およびAr2は互いに独立して、非置換であるか又はC1−C8アルキル、C1−C4アルコキシ、Cl、もしくはBrでモノ置換もしくは多置換された各フェニルであり;Qは、SbF6またはSbF5OHである(例えば、ジベンジルエチルスルホニウムヘキサフルオロアンチモネート)。
適切なシクロアルキル−アルキレンの例としては、シクロヘキシル−メチレンとシクロヘキシル−エチレンがある。
本発明の熱硬化性組成物は、1つ以上のエポキシ基を含む化合物である成分(c)をさらに含んでよい。
本発明の好ましい実施態様によれば、熱硬化性組成物は、25℃で液体であるエポキシ成分(成分(c))を含む。液体エポキシ成分は、反応性希釈剤として使用することができ、熱硬化性組成物の加工性を向上させることができる。熱硬化性組成物は、ISO12058−1:1997に従った25℃での動的粘度としての測定にて、最大で2500mPa・sの粘度を有する1種以上のエポキシ成分を含むのが好ましく、最大で1000mPa・sの粘度を有する1種以上のエポキシ成分を含むのがさらに好ましく、50〜1000mPa・sの粘度(例えば、150〜500mPa・sの粘度)を有する1種以上のエポキシ成分を含むのが特に好ましい。
プレプレグもしくはB段階樹脂とRTM(樹脂トランスファー成形)システムから複合材料を製造するために、本発明の熱硬化性組成物を使用することが特に好ましい。
(1)本発明の熱硬化性組成物を、圧延、浸漬、噴霧、他の公知の手法、および/またはこれらの組み合わせによって、基材に施すか又は基材中に含浸させる。基材は通常、例えば、ガラス繊維、炭素繊維、鉱物繊維、または紙を含有する織った繊維マットまたは不織繊維マットである。
本発明のさらなる実施態様は、a)布帛を供給する工程;b)布帛に本発明の熱硬化性組成物を含浸させる工程;およびc)含浸布帛を硬化させる工程;を含む、物品の製造方法である。
A)熱硬化性組成物の製造
実施例A1〜A8と比較用実施例C1〜C7:
成分(a)ジヒドロベンゾオキサジン、成分(b)スルホニウム塩、および必要に応じてエポキシ化合物(c)(いずれも重量部)を130〜140℃で溶融し(必要な場合)、充分な撹拌を行って混合した。この均一混合物のゲル化時間を、ホットプレート上にて190℃で測定した。混合物を、オーブン中にて190℃で120分キュアーし、引き続き220℃でさらに120分キュアーした(実施例A1〜A6と比較用実施例C1〜C3を参照)。実施例C4、C5、C7、A7、およびA9は、オーブン中にて220℃で3時間キュアーしたが、モノジヒドロベンゾオキサジン(5)をベースとする実施例C6とA8は、それぞれの組成物の蒸発/分解を防ぐために180℃で3時間キュアーした。
表1は、本発明の実施例A1〜A6を示す。A1〜A6は、加熱したときのゲル化時間が比較的短く、これは反応性が高いためである。特に、エポキシ化合物がさらに使用されたときには、ガラス転移温度がかなり高くなる。さらに、DSCにおいて発熱硬化を観察することができる温度(オンセットT)と、最大反応速度を観察することができる温度との間の差は、比較的小さい。こうした挙動により、本発明の熱硬化性組成物は、所望する形状の物品を製造するために特定の液化状態が要求され、そして後続する硬化プロセス時には速やかな硬化が要求される〔これにより、高いガラス転移温度(硬化後のTg)を有する硬化樹脂がもたらされる〕、という樹脂トランスファー成形法に対して特に有用となる。
Claims (8)
- (1)布帛を供給する工程;
(2)熱硬化性組成物を該布帛に含浸させる工程;および、
(3)含浸布帛を硬化させる工程;
を含む物品の製造方法であって、該熱硬化性組成物が、
(a)1種以上のリン非含有のビス(ジヒドロベンゾオキサジン);
(b)1種以上のスルホニウム塩;
(c)1種以上のエポキシ基含有成分;
を含み、スルホニウム塩(b)が、式(XIII)〜(XVIII)
の化合物およびこれらの任意の混合物からなる群より選ばれる、上記方法。 - 成分(a)が、各ヒドロキシル基に対して非置換のオルト位を1つ以上有する非置換もしくは置換ビスフェノールと、ホルムアルデヒドおよび第一アミンとの反応によって製造されるビス(ジヒドロベンゾオキサジン)である、請求項1に記載の方法。
- 成分(a)が、式(I)
のビス(ジヒドロベンゾオキサジン)である、請求項1または2に記載の方法。 - 成分(a)が、式(III)〜(XII):
の成分およびこれら成分の任意の混合物からなる群より選ばれる、請求項1〜3のいずれかに記載の方法。 - 成分(b)と成分(a)および(c)の合計との重量比が、1:1000〜1:10である、請求項1〜4のいずれかに記載の方法。
- 成分(c)が脂環式エポキシ成分である、請求項1〜5のいずれかに記載の方法。
- 成分(a)とエポキシ基含有成分(c)との重量比が、95:5〜10:90である、請求項1〜6のいずれかに記載の方法。
- 成分(a)とスルホニウム塩(b)との重量比が、100:1〜10:1である、請求項1〜7のいずれかに記載の方法。
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PCT/EP2009/054976 WO2010018008A1 (en) | 2008-08-12 | 2009-04-24 | Thermosetting composition |
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Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2491070B1 (en) * | 2009-10-21 | 2015-01-14 | Huntsman Advanced Materials (Switzerland) GmbH | Thermosetting composition |
KR20170097233A (ko) * | 2010-03-05 | 2017-08-25 | 헌츠만 어드밴스드 머티리얼스 아메리카스 엘엘씨 | 전기 부품에 사용하기 위한, 고주파에서 낮은 유전 손실을 갖는 열경화성 수지 시스템 |
JP5636726B2 (ja) * | 2010-04-26 | 2014-12-10 | 横浜ゴム株式会社 | ジスルフィド結合を有するベンゾオキサジン化合物 |
EP2609136B1 (en) | 2010-08-25 | 2014-11-26 | Huntsman Advanced Materials Americas LLC | Formulated benzoxazine based system for transportation applications |
JP6186108B2 (ja) * | 2011-09-14 | 2017-08-23 | 住友精化株式会社 | フェノール系樹脂組成物 |
CN104371273B (zh) * | 2014-11-11 | 2017-05-24 | 广东生益科技股份有限公司 | 一种无卤树脂组合物及用其制作的预浸料与层压板 |
CN104448702B (zh) * | 2014-11-11 | 2017-05-24 | 广东生益科技股份有限公司 | 一种无卤树脂组合物及用其制作的预浸料与层压板 |
JP6147886B2 (ja) * | 2016-04-04 | 2017-06-14 | 住友精化株式会社 | フェノール系樹脂組成物 |
JP6953749B2 (ja) * | 2017-03-06 | 2021-10-27 | 凸版印刷株式会社 | フィルム及び画像表示装置 |
US20200056056A1 (en) * | 2018-08-17 | 2020-02-20 | Sk Innovation Co., Ltd. | Hard Coating Film and Preparation Method Thereof |
JP2020055973A (ja) * | 2018-10-03 | 2020-04-09 | 株式会社ダイセル | 熱硬化性エポキシ樹脂組成物 |
WO2023038043A1 (ja) * | 2021-09-08 | 2023-03-16 | 株式会社カネカ | ベンゾオキサジン組成物およびその利用 |
Family Cites Families (28)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5152993A (en) * | 1988-01-20 | 1992-10-06 | Ellem Bioteknik Ab | Method of preparing an implant body for implantation |
EP0379464B1 (de) * | 1989-01-16 | 1993-02-10 | Ciba-Geigy Ag | Araliphatische Sulfoniumsalze und deren Verwendung |
US5247113A (en) * | 1989-01-16 | 1993-09-21 | Ciba-Geigy Corporation | Araliphatic sulfonium and their use |
US5266695A (en) * | 1991-03-12 | 1993-11-30 | Edison Polymer Innovation Corporation | Composite densification with benzoxazines |
DE59205890D1 (de) * | 1991-04-08 | 1996-05-09 | Ciba Geigy Ag | Epoxidharz-Stoffgemische, insbesondere zur Herstellung lagerfähiger Prepregs |
EP0508951B1 (de) * | 1991-04-08 | 1996-08-21 | Ciba-Geigy Ag | Thermisch härtbare Zusammensetzungen |
US5943516A (en) * | 1994-01-31 | 1999-08-24 | Fuji Photo Film Co., Ltd. | Camera with a warning system of inappropriate camera holding |
US5543516A (en) * | 1994-05-18 | 1996-08-06 | Edison Polymer Innovation Corporation | Process for preparation of benzoxazine compounds in solventless systems |
JP3487083B2 (ja) * | 1996-02-09 | 2004-01-13 | 日立化成工業株式会社 | 熱硬化性樹脂組成物及びその硬化物 |
US6489042B2 (en) * | 1998-12-23 | 2002-12-03 | 3M Innovative Properties Company | Photoimageable dielectric material for circuit protection |
TWI228639B (en) * | 2000-11-15 | 2005-03-01 | Vantico Ag | Positive type photosensitive epoxy resin composition and printed circuit board using the same |
CA2431426C (en) * | 2001-01-22 | 2010-08-24 | Vantico Ag | Flame-proofing agents |
JP2003147165A (ja) * | 2001-08-29 | 2003-05-21 | Osaka City | 熱硬化性樹脂組成物 |
US6899960B2 (en) * | 2002-03-22 | 2005-05-31 | Intel Corporation | Microelectronic or optoelectronic package having a polybenzoxazine-based film as an underfill material |
AU2003276729A1 (en) * | 2002-06-17 | 2003-12-31 | Henkel Corporation | Interlayer dielectric and pre-applied die attach adhesive materials |
AU2003301550A1 (en) * | 2002-10-22 | 2004-05-13 | Henkel Corporation | Co-curable compositions |
TW576854B (en) * | 2002-10-25 | 2004-02-21 | Chang Chun Plastics Co Ltd | Halogen-free resin composition |
TW200413467A (en) * | 2003-01-16 | 2004-08-01 | Chang Chun Plastics Co Ltd | Resin composition without containing halogen |
US20070191555A1 (en) * | 2004-03-30 | 2007-08-16 | Hatsuo Ishida | Thermosetting resin composition and its article |
JP4570419B2 (ja) * | 2004-08-20 | 2010-10-27 | ナミックス株式会社 | 液状の封止用樹脂組成物 |
EP1647576A1 (en) * | 2005-04-01 | 2006-04-19 | Huntsman Advanced Materials (Switzerland) GmbH | Composition comprising benzoxazine and epoxy resin |
JP4694385B2 (ja) * | 2006-02-21 | 2011-06-08 | Thk株式会社 | 運動案内装置の軌道レール取付け方法及び運動案内装置 |
US7759435B2 (en) * | 2006-09-26 | 2010-07-20 | Loctite (R&D) Limited | Adducts and curable compositions using same |
JP2008094961A (ja) * | 2006-10-12 | 2008-04-24 | Toray Ind Inc | ベンゾオキサジン樹脂組成物 |
JP5382801B2 (ja) * | 2006-10-25 | 2014-01-08 | ヘンケル アイルランド リミテッド | 新規のイミニウム塩およびこれを用いる電子欠損オレフィンの製造方法 |
DE102006057142A1 (de) * | 2006-12-01 | 2008-06-05 | Henkel Kgaa | Metallverbindungen als Initiatoren |
JP2009057437A (ja) * | 2007-08-31 | 2009-03-19 | Toyohashi Univ Of Technology | ポリベンゾオキサジン系樹脂とイオン液体からなる複合材料とその製造方法 |
JP5248623B2 (ja) * | 2007-11-20 | 2013-07-31 | ヘンケル・アクチェンゲゼルシャフト・ウント・コムパニー・コマンディットゲゼルシャフト・アウフ・アクチェン | 低い硬化温度を有するレドックス誘導カチオン重合性組成物 |
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WO2010018008A1 (en) | 2010-02-18 |
EP2313452A1 (en) | 2011-04-27 |
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