JP5681710B2 - 冷却装置およびその製造方法 - Google Patents
冷却装置およびその製造方法 Download PDFInfo
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- JP5681710B2 JP5681710B2 JP2012516638A JP2012516638A JP5681710B2 JP 5681710 B2 JP5681710 B2 JP 5681710B2 JP 2012516638 A JP2012516638 A JP 2012516638A JP 2012516638 A JP2012516638 A JP 2012516638A JP 5681710 B2 JP5681710 B2 JP 5681710B2
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- 238000001816 cooling Methods 0.000 title claims description 116
- 238000004519 manufacturing process Methods 0.000 title description 2
- 239000012530 fluid Substances 0.000 claims description 164
- 238000007654 immersion Methods 0.000 claims description 33
- 239000003990 capacitor Substances 0.000 claims description 32
- 238000009835 boiling Methods 0.000 claims description 31
- 238000012546 transfer Methods 0.000 claims description 12
- 238000005086 pumping Methods 0.000 claims description 10
- 230000000630 rising effect Effects 0.000 claims description 6
- 238000001704 evaporation Methods 0.000 claims description 5
- 230000008020 evaporation Effects 0.000 claims description 4
- 239000002826 coolant Substances 0.000 description 76
- 239000007788 liquid Substances 0.000 description 55
- 239000000758 substrate Substances 0.000 description 19
- 238000000034 method Methods 0.000 description 15
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 10
- 238000010438 heat treatment Methods 0.000 description 8
- 230000008878 coupling Effects 0.000 description 7
- 238000010168 coupling process Methods 0.000 description 7
- 238000005859 coupling reaction Methods 0.000 description 7
- 238000009826 distribution Methods 0.000 description 7
- 230000008569 process Effects 0.000 description 7
- 230000008901 benefit Effects 0.000 description 5
- 239000012071 phase Substances 0.000 description 5
- 239000000498 cooling water Substances 0.000 description 4
- 238000007789 sealing Methods 0.000 description 4
- 230000008859 change Effects 0.000 description 3
- 238000004891 communication Methods 0.000 description 3
- 238000009833 condensation Methods 0.000 description 3
- 230000005494 condensation Effects 0.000 description 3
- 239000000110 cooling liquid Substances 0.000 description 3
- 230000009977 dual effect Effects 0.000 description 3
- 230000006870 function Effects 0.000 description 3
- 238000007373 indentation Methods 0.000 description 3
- 238000007726 management method Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 238000004378 air conditioning Methods 0.000 description 2
- 230000001143 conditioned effect Effects 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- NBVXSUQYWXRMNV-UHFFFAOYSA-N fluoromethane Chemical compound FC NBVXSUQYWXRMNV-UHFFFAOYSA-N 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 239000007791 liquid phase Substances 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 238000009834 vaporization Methods 0.000 description 2
- 230000008016 vaporization Effects 0.000 description 2
- NOPJRYAFUXTDLX-UHFFFAOYSA-N 1,1,1,2,2,3,3-heptafluoro-3-methoxypropane Chemical compound COC(F)(F)C(F)(F)C(F)(F)F NOPJRYAFUXTDLX-UHFFFAOYSA-N 0.000 description 1
- DFUYAWQUODQGFF-UHFFFAOYSA-N 1-ethoxy-1,1,2,2,3,3,4,4,4-nonafluorobutane Chemical compound CCOC(F)(F)C(F)(F)C(F)(F)C(F)(F)F DFUYAWQUODQGFF-UHFFFAOYSA-N 0.000 description 1
- 230000003044 adaptive effect Effects 0.000 description 1
- 238000007792 addition Methods 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 239000012267 brine Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 229910001338 liquidmetal Inorganic materials 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- HPALAKNZSZLMCH-UHFFFAOYSA-M sodium;chloride;hydrate Chemical compound O.[Na+].[Cl-] HPALAKNZSZLMCH-UHFFFAOYSA-M 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/208—Liquid cooling with phase change
- H05K7/20809—Liquid cooling with phase change within server blades for removing heat from heat source
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/203—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures by immersion
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16135—Disposition the bump connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/16145—Disposition the bump connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S165/00—Heat exchange
- Y10S165/908—Fluid jets
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Computer Hardware Design (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Description
Claims (10)
- 冷却すべき電子デバイスを少なくとも部分的に取り囲み、前記電子デバイスの回りに密閉コンパートメントを形成するように構成されたハウジングと、
前記密閉コンパートメント内に配置された誘電流体であって、前記冷却すべき電子デバイスが少なくとも部分的に前記誘電流体内に浸漬される誘電流体と、
前記密閉コンパートメント内に配置された誘電流体を前記冷却すべき電子デバイスに向かって活発に汲み出すために前記密閉コンパートメント内に配置された少なくとも1つのポンプと、
を含み、
前記少なくとも1つのポンプは、前記密閉コンパートメント内で前記ハウジングの側壁付近に配置された衝突冷却型浸漬ポンプであり、当該衝突冷却型浸漬ポンプは、前記密閉コンパートメントの下部部分から吸入口を介して抜き取られた誘電流体を前記冷却すべき電子デバイスに向かって活発に汲み出し、
誘電流体蒸気を前記密閉コンパートメントの上部部分に向けることを容易にするために、前記冷却すべき電子デバイスの少なくとも一方の側に隣接して前記衝突冷却型浸漬ポンプと前記冷却すべき電子デバイスとの間に配置された、少なくとも部分的に浸漬したバッフルをさらに含み、当該バッフルは、前記冷却すべき電子デバイスに向かって排出口を介して活発に汲み出すために、前記衝突冷却型浸漬ポンプへ引き込まれている前記密閉コンパートメントの下部部分内の誘電流体から離れて配置され、
前記衝突冷却型浸漬ポンプの前記吸入口は、前記少なくとも部分的に浸漬したバッフルの前記衝突冷却型浸漬ポンプ側に配置され、前記衝突冷却型浸漬ポンプの前記排出口は、前記少なくとも部分的に浸漬したバッフルの前記冷却すべき電子デバイス側に配置される、
冷却装置。 - 前記密閉コンパートメントの上部部分内で前記密閉コンパートメント内に延びる複数のコンデンサ・フィンをさらに含み、前記複数のコンデンサ・フィンが前記密閉コンパートメントの前記上部部分まで上昇する誘電流体蒸気の冷却を容易にする、請求項1記載の冷却装置。
- 前記複数のコンデンサ・フィンが前記ハウジングの最上部壁から前記密閉コンパートメント内に下向きに延び、前記ハウジングの前記最上部壁が前記複数のコンデンサ・フィンを冷却するために液冷コールド・プレートまたは空冷ヒート・シンクのうちの一方に結合される、請求項2記載の冷却装置。
- 誘電流体を前記冷却すべき電子デバイスに向かって活発に汲み出すために前記衝突冷却型浸漬ポンプを2つ含む、請求項1ないし3のいずれかに記載の冷却装置。
- 前記冷却すべき電子デバイスの上の前記密閉コンパートメント内に配置されたマニホルド構造体をさらに含み、前記マニホルド構造体が前記冷却すべき電子デバイスに向かって誘電流体のジェットを向けるためのジェット・オリフィスを備えた浸漬ジェット衝突プレナムを含み、前記衝突冷却型浸漬ポンプが、前記冷却すべき電子デバイスに向かって向けられた誘電流体ジェットとして前記ジェット・オリフィスを通って送出するために前記浸漬ジェット衝突プレナム内に圧力を受けて誘電流体を活発に汲み出す、請求項1ないし4のいずれかに記載の冷却装置。
- 前記密閉コンパートメント内に配置され、前記冷却すべき電子デバイスに熱によって結合された流体沸騰ヒート・シンクをさらに含み、前記流体沸騰ヒート・シンクが、前記浸漬ジェット衝突プレナムから向けられた誘電流体ジェットが前記流体沸騰ヒート・シンクに衝突するように配置され、前記流体沸騰ヒート・シンクが前記冷却すべき電子デバイスから延びる複数のピン・フィンを含み、前記ピン・フィンが部分的に前記誘電流体の蒸発を介して前記冷却すべき電子デバイスから前記誘電流体への熱伝達を容易にする、請求項5記載の冷却装置。
- 前記冷却すべき電子デバイスが集積回路チップのスタックを含み、前記2つの衝突冷却型浸漬ポンプのうち、第1のポンプが前記集積回路チップのスタックの最上部に向かって誘電流体を活発に汲み出すように構成され、第2のポンプが前記集積回路チップのスタックのうちの集積回路チップ間の間隙空間内に誘電流体を活発に汲み出すように構成される、請求項4に記載の冷却装置。
- 前記集積回路チップのスタックの前記最上部に結合された流体沸騰ヒート・シンクをさらに含み、前記第1のポンプが前記集積回路チップのスタックの前記最上部に結合された前記流体沸騰ヒート・シンクに向かって誘電流体を活発に汲み出し、前記流体沸騰ヒート・シンクが前記集積回路チップのスタックから延びる複数のピン・フィンを含み、前記ピン・フィンが部分的に前記誘電流体の蒸発を介して前記集積回路チップのスタックから前記誘電流体への熱伝達を容易にする、請求項7記載の冷却装置。
- 前記第2のポンプが前記集積回路チップのスタックのうちの集積回路チップ間の前記間隙空間内に誘電流体を活発に汲み出すのを容易にするために、前記集積回路チップのスタックの1つまたは複数の側に隣接して配置されたマニホルド構造体をさらに含む、請求項7記載の冷却装置。
- 前記集積回路チップのスタック内の少なくとも1つの集積回路チップの裏面が、前記集積回路チップのスタックのうちの前記集積回路チップの冷却を容易にするために誘電流体流路として機能するように構成されたチャネルを含み、前記冷却装置が、前記集積回路チップのスタック内の間隙空間内に誘電流体を直接送出するために、前記第2のポンプのポンプ排出管に結合され、前記集積回路チップ間の間隙空間内に延びる少なくとも1つのノズルをさらに含む、請求項7記載の冷却装置。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/491,281 US8014150B2 (en) | 2009-06-25 | 2009-06-25 | Cooled electronic module with pump-enhanced, dielectric fluid immersion-cooling |
US12/491,281 | 2009-06-25 | ||
PCT/EP2010/058369 WO2010149536A1 (en) | 2009-06-25 | 2010-06-15 | Electronic module with pump-enhanced, dielectric fluid immersion-cooling |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2012531056A JP2012531056A (ja) | 2012-12-06 |
JP5681710B2 true JP5681710B2 (ja) | 2015-03-11 |
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Application Number | Title | Priority Date | Filing Date |
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JP2012516638A Active JP5681710B2 (ja) | 2009-06-25 | 2010-06-15 | 冷却装置およびその製造方法 |
Country Status (6)
Country | Link |
---|---|
US (1) | US8014150B2 (ja) |
EP (1) | EP2359670B1 (ja) |
JP (1) | JP5681710B2 (ja) |
CN (1) | CN102342191B (ja) |
TW (1) | TW201115102A (ja) |
WO (1) | WO2010149536A1 (ja) |
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-
2009
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EP2359670B1 (en) | 2017-09-13 |
EP2359670A1 (en) | 2011-08-24 |
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TW201115102A (en) | 2011-05-01 |
JP2012531056A (ja) | 2012-12-06 |
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CN102342191A (zh) | 2012-02-01 |
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