JP5680773B1 - Ｃｕ核ボール、はんだ継手、フォームはんだおよびはんだペースト - Google Patents

Ｃｕ核ボール、はんだ継手、フォームはんだおよびはんだペースト Download PDF

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Publication number
JP5680773B1
JP5680773B1 JP2014014702A JP2014014702A JP5680773B1 JP 5680773 B1 JP5680773 B1 JP 5680773B1 JP 2014014702 A JP2014014702 A JP 2014014702A JP 2014014702 A JP2014014702 A JP 2014014702A JP 5680773 B1 JP5680773 B1 JP 5680773B1
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Japan
Prior art keywords
ball
core
solder
core ball
less
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JP2014014702A
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English (en)
Japanese (ja)
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JP2015140466A (ja
Inventor
浩由 川▲崎▼
浩由 川▲崎▼
友朗 西野
友朗 西野
六本木　貴弘
貴弘 六本木
相馬　大輔
大輔 相馬
佐藤　勇
勇 佐藤
勇司 川又
勇司 川又
浩彦 平尾
浩彦 平尾
淳 田阪
淳 田阪
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shikoku Chemicals Corp
Senju Metal Industry Co Ltd
Original Assignee
Shikoku Chemicals Corp
Senju Metal Industry Co Ltd
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Publication date
Application filed by Shikoku Chemicals Corp, Senju Metal Industry Co Ltd filed Critical Shikoku Chemicals Corp
Priority to JP2014014702A priority Critical patent/JP5680773B1/ja
Priority to KR1020150014259A priority patent/KR101550560B1/ko
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Publication of JP5680773B1 publication Critical patent/JP5680773B1/ja
Publication of JP2015140466A publication Critical patent/JP2015140466A/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/532—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body characterised by the materials
    • H01L23/53204—Conductive materials
    • H01L23/53209—Conductive materials based on metals, e.g. alloys, metal silicides
    • H01L23/53228—Conductive materials based on metals, e.g. alloys, metal silicides the principal metal being copper
    • H01L23/53233—Copper alloys
JP2014014702A 2014-01-29 2014-01-29 Ｃｕ核ボール、はんだ継手、フォームはんだおよびはんだペースト Active JP5680773B1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2014014702A JP5680773B1 (ja) 2014-01-29 2014-01-29 Ｃｕ核ボール、はんだ継手、フォームはんだおよびはんだペースト
KR1020150014259A KR101550560B1 (ko) 2014-01-29 2015-01-29 Cu 코어 볼, 땜납 이음, 폼 땜납 및 땜납 페이스트

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014014702A JP5680773B1 (ja) 2014-01-29 2014-01-29 Ｃｕ核ボール、はんだ継手、フォームはんだおよびはんだペースト

Publications (2)

Publication Number Publication Date
JP5680773B1 true JP5680773B1 (ja) 2015-03-04
JP2015140466A JP2015140466A (ja) 2015-08-03

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ID=52684809

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JP2014014702A Active JP5680773B1 (ja) 2014-01-29 2014-01-29 Ｃｕ核ボール、はんだ継手、フォームはんだおよびはんだペースト

Country Status (2)

Country Link
JP (1) JP5680773B1 (ko)
KR (1) KR101550560B1 (ko)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5935938B1 (ja) * 2015-12-28 2016-06-15 千住金属工業株式会社 導電接合シートおよび導電接合シートの製造方法。
KR20170125557A (ko) * 2016-05-04 2017-11-15 덕산하이메탈(주) 솔더볼, 이의 제조방법 및 이를 이용한 전자부품

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6199646A (ja) * 1984-10-20 1986-05-17 Tanaka Denshi Kogyo Kk 半導体素子のボンデイング用銅線
WO1995024113A1 (fr) * 1994-03-01 1995-09-08 Sumitomo Special Metals Company Limited Boule en cuivre et procede de production de cette derniere
JP2007115857A (ja) * 2005-10-20 2007-05-10 Nippon Steel Chem Co Ltd マイクロボール
JP2010282832A (ja) * 2009-06-04 2010-12-16 Hitachi Metals Ltd 接合材料及びその製造方法、並びにそれを用いた実装方法
WO2011118009A1 (ja) * 2010-03-25 2011-09-29 田中電子工業株式会社 高純度Ｃｕボンディングワイヤ
JP2011206815A (ja) * 2010-03-30 2011-10-20 Hitachi Metals Ltd 電子部品用複合ボールの製造方法
WO2012120982A1 (ja) * 2011-03-07 2012-09-13 Jx日鉱日石金属株式会社 α線量が少ない銅又は銅合金及び銅又は銅合金を原料とするボンディングワイヤ
JP5408401B1 (ja) * 2013-06-19 2014-02-05 千住金属工業株式会社 Ｃｕ核ボール
JP5435182B1 (ja) * 2012-12-06 2014-03-05 千住金属工業株式会社 Ｃｕボール

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6199646A (ja) * 1984-10-20 1986-05-17 Tanaka Denshi Kogyo Kk 半導体素子のボンデイング用銅線
WO1995024113A1 (fr) * 1994-03-01 1995-09-08 Sumitomo Special Metals Company Limited Boule en cuivre et procede de production de cette derniere
JP2007115857A (ja) * 2005-10-20 2007-05-10 Nippon Steel Chem Co Ltd マイクロボール
JP2010282832A (ja) * 2009-06-04 2010-12-16 Hitachi Metals Ltd 接合材料及びその製造方法、並びにそれを用いた実装方法
WO2011118009A1 (ja) * 2010-03-25 2011-09-29 田中電子工業株式会社 高純度Ｃｕボンディングワイヤ
JP2011206815A (ja) * 2010-03-30 2011-10-20 Hitachi Metals Ltd 電子部品用複合ボールの製造方法
WO2012120982A1 (ja) * 2011-03-07 2012-09-13 Jx日鉱日石金属株式会社 α線量が少ない銅又は銅合金及び銅又は銅合金を原料とするボンディングワイヤ
JP5435182B1 (ja) * 2012-12-06 2014-03-05 千住金属工業株式会社 Ｃｕボール
JP5408401B1 (ja) * 2013-06-19 2014-02-05 千住金属工業株式会社 Ｃｕ核ボール

Also Published As

Publication number Publication date
JP2015140466A (ja) 2015-08-03
KR20150090858A (ko) 2015-08-06
KR101550560B1 (ko) 2015-09-04

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