JP5669472B2 - セラミックス接合体の製造方法 - Google Patents
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- C04B37/003—Joining burned ceramic articles with other burned ceramic articles or other articles by heating by means of an interlayer consisting of a combination of materials selected from glass, or ceramic material with metals, metal oxides or metal salts
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- B32—LAYERED PRODUCTS
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- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/02—Aspects relating to interlayers, e.g. used to join ceramic articles with other articles by heating
- C04B2237/04—Ceramic interlayers
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- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
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- C04B2237/02—Aspects relating to interlayers, e.g. used to join ceramic articles with other articles by heating
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- C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
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- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
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- C04B2237/368—Silicon nitride
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- C04B2237/70—Forming laminates or joined articles comprising layers of a specific, unusual thickness
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- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
- C04B2237/70—Forming laminates or joined articles comprising layers of a specific, unusual thickness
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- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
- C04B2237/72—Forming laminates or joined articles comprising at least two interlayers directly next to each other
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Materials Engineering (AREA)
- Structural Engineering (AREA)
- Organic Chemistry (AREA)
- Ceramic Products (AREA)
- Laminated Bodies (AREA)
Description
該積層構造体に荷重を加えた状態で、該非金属元素の雰囲気下又は該非金属元素を含む化合物の雰囲気下に焼成を行なって該積層構造体を接合体となし、
前記接合体を、焼成時に加えた荷重と同等又はそれよりも低い荷重下に熱処理することを特徴とするセラミックス接合体の製造方法を提供するものである。
前記積層構造体に荷重を加えた状態で焼成を行なって該積層構造体を接合体となし、
前記接合体を、焼成時に加えた荷重と同等又はそれよりも低い荷重下に熱処理することを特徴とするセラミックス接合体の製造方法を提供するものである。
(イ)各被接合材の接合面に、予め金属層を固着しておく態様。
(ロ)シート状接合材の各面に、予め金属層を形成しておく態様。
(ハ)被接合材及びシート接合材とは別に、独立した部材としての金属元素単体又は非金属元素単体からなる箔や、金属元素単体又は非金属元素単体の粉末を原料としたシート(以下、これらを総称して「金属箔」とも言う。)を、被接合材とシート状接合材との間に配置しておく態様。
被接合材として、市販の高純度アルミナセラミックス(Al2O3純度 99.5%以上、気孔率1%以下)を用いた。この被接合材は、長さ35mm、幅35mm、厚さ2.5mmの板状のものであった。この被接合材の一面に、真空蒸着によって、金属アルミニウムからなる層を固着した。層の厚みは3μmとした。接合材として、市販の低温焼結性高純度αアルミナ粉体(一次粒子径0.1μm)を、ドクターブレード法により成形し、厚さ50μmにしたシート状の接合材を用いた。この接合材の寸法は、長さ35mm、幅35mmであった。
被接合材として、市販の窒化ケイ素セラミックス(助剤としてY2O3及びAl2O3を含有する。)を用いた。この被接合材は、長さ20mm、幅20mm、厚さ20mmのブロック状のものであった。
実施例1において、被接合材の接合面に、金属アルミニウムからなる層を固着させなかった。これ以外は実施例1と同様の操作を行った。しかし、被接合材であるアルミナセラミックスどうしを接合させることはできなかった。
実施例2において、窒化ケイ素粉末にイットリアとアルミナの各粉末を添加した混合粉末からなるシート状の成形体の各面に、金属シリコン粉末からなる層を形成しなかった。これ以外は実施例2と同様の操作を行った。しかし、被接合材である窒化ケイ素セラミックスどうしを接合させることはできなかった。
10A,10B 被接合材
11A,11B金属元素単体又は半金属元素単体からなる層
12 接合材
20 積層構造体
Claims (11)
- 金属元素又は半金属元素と非金属元素との化合物のセラミックスからなる被接合材間に、該化合物と同組成の化合物の微粒子を含むシート状の成形体からなる接合材を配置し、かつ該被接合材と該接合材との間に、該金属元素と同一の元素の単体又は半金属元素と同一の元素の単体からなる層を配置して積層構造体を形成し、
該積層構造体に荷重を加えた状態で、該非金属元素の雰囲気下又は該非金属元素を含む化合物の雰囲気下に焼成を行なって該積層構造体を接合体となし、
前記接合体を、焼成時に加えた荷重と同等又はそれよりも低い荷重下に熱処理することを特徴とするセラミックス接合体の製造方法。 - 金属元素又は半金属元素と非金属元素との化合物のセラミックスからなる被接合材間に、該化合物と同組成の化合物の微粒子を含むシート状の成形体からなる接合材を配置し、かつ該被接合材と該接合材との間に、該金属元素と同一の元素の単体又は該半金属元素と同一の元素の単体と、該非金属元素と同一の元素の単体とを含む層を配置して積層構造体を形成し、
前記積層構造体に荷重を加えた状態で焼成を行なって該積層構造体を接合体となし、
前記接合体を、焼成時に加えた荷重と同等又はそれよりも低い荷重下に熱処理することを特徴とするセラミックス接合体の製造方法。 - 前記非金属元素がO又はNであり、含酸素雰囲気又は含窒素雰囲気下に焼成を行なう請求項1記載の製造方法。
- 金属元素単体又は半金属元素単体からなる前記層を、前記被接合材における接合面に固着しておく請求項1又は3記載の製造方法。
- 金属元素単体又は半金属元素単体からなる前記層を、蒸着によって前記接合面に固着しておく請求項4記載の製造方法。
- 前記非金属元素がCであり、前記層が炭素単体を含むものである請求項2記載の製造方法。
- 前記金属元素がAl、Ti、Zr、Cr、Ta又はNbであり、
前記半金属元素がSi又はBである請求項1ないし6のいずれか一項に記載の製造方法。 - 前記積層構造体に0.01〜0.5MPaの荷重を加えた状態下に焼成を行なう請求項1ないし7のいずれか一項に記載の製造方法。
- 前記接合体の熱処理温度を、前記積層構造体の焼成温度よりも高く設定する請求項1ないし8のいずれか一項に記載の製造方法。
- 金属元素又は半金属元素と非金属元素との化合物の微粒子を含むシート状の成形体からなる接合材の各面に、該金属元素と同一の元素の単体又は該半金属元素と同一の元素の単体からなる層が配置されてなり、該化合物と同組成の化合物のセラミックスからなる被接合材どうしの接合に用いられることを特徴とする接合用部材。
- 金属元素又は半金属元素と非金属元素との化合物の微粒子を含むシート状の成形体からなる接合材の各面に、該金属元素と同一の元素の単体又は該半金属元素と同一の元素の単体と、該非金属元素と同一の元素の単体とを含む層が配置されてなり、該化合物と同組成の化合物のセラミックスからなる被接合材どうしの接合に用いられることを特徴とする接合用部材。
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010167662A JP5669472B2 (ja) | 2010-07-27 | 2010-07-27 | セラミックス接合体の製造方法 |
| PCT/JP2011/066912 WO2012014867A1 (ja) | 2010-07-27 | 2011-07-26 | セラミックス接合体の製造方法 |
| KR1020127031511A KR20130097085A (ko) | 2010-07-27 | 2011-07-26 | 세라믹스 접합체의 제조방법 |
| CN201180028084.4A CN102933521B (zh) | 2010-07-27 | 2011-07-26 | 陶瓷接合体的制造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010167662A JP5669472B2 (ja) | 2010-07-27 | 2010-07-27 | セラミックス接合体の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2012025639A JP2012025639A (ja) | 2012-02-09 |
| JP5669472B2 true JP5669472B2 (ja) | 2015-02-12 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010167662A Expired - Fee Related JP5669472B2 (ja) | 2010-07-27 | 2010-07-27 | セラミックス接合体の製造方法 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP5669472B2 (ja) |
| KR (1) | KR20130097085A (ja) |
| CN (1) | CN102933521B (ja) |
| WO (1) | WO2012014867A1 (ja) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6528559B2 (ja) * | 2014-06-30 | 2019-06-12 | 三菱マテリアル株式会社 | セラミックス/アルミニウム接合体の製造方法、パワーモジュール用基板の製造方法、及び、セラミックス/アルミニウム接合体、パワーモジュール用基板 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61141679A (ja) * | 1984-12-13 | 1986-06-28 | 有限会社 宮田技研 | セラミツク部材の接合体 |
| US4884737A (en) * | 1987-05-21 | 1989-12-05 | Lanxide Technology Company, Lp | Method for surface bonding of ceramic bodies |
| JP3057932B2 (ja) * | 1992-10-01 | 2000-07-04 | 三菱マテリアル株式会社 | セラミックス焼結体の接合方法 |
| JP3504716B2 (ja) * | 1994-03-14 | 2004-03-08 | 日本特殊陶業株式会社 | 応力緩衝金属層を有するセラミックス接合体 |
| CN1090195C (zh) * | 1994-03-14 | 2002-09-04 | 三井化学株式会社 | 乙烯不饱和共聚物及其制备方法 |
| JP3866320B2 (ja) * | 1995-02-09 | 2007-01-10 | 日本碍子株式会社 | 接合体、および接合体の製造方法 |
| KR100716100B1 (ko) * | 2003-06-13 | 2007-05-09 | 가부시끼가이샤 도꾸야마 | 질화알루미늄 접합체 및 그의 제조 방법 |
| JP2005082431A (ja) * | 2003-09-08 | 2005-03-31 | Sadao Akishita | セラミック接合方法及びこれによって接合されたセラミック接合部材 |
-
2010
- 2010-07-27 JP JP2010167662A patent/JP5669472B2/ja not_active Expired - Fee Related
-
2011
- 2011-07-26 KR KR1020127031511A patent/KR20130097085A/ko not_active Withdrawn
- 2011-07-26 CN CN201180028084.4A patent/CN102933521B/zh not_active Expired - Fee Related
- 2011-07-26 WO PCT/JP2011/066912 patent/WO2012014867A1/ja not_active Ceased
Also Published As
| Publication number | Publication date |
|---|---|
| CN102933521B (zh) | 2014-12-24 |
| JP2012025639A (ja) | 2012-02-09 |
| KR20130097085A (ko) | 2013-09-02 |
| WO2012014867A1 (ja) | 2012-02-02 |
| CN102933521A (zh) | 2013-02-13 |
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