JP5667012B2 - リング状シールド部材、その構成部品及びリング状シールド部材を備えた基板載置台 - Google Patents

リング状シールド部材、その構成部品及びリング状シールド部材を備えた基板載置台 Download PDF

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Publication number
JP5667012B2
JP5667012B2 JP2011184510A JP2011184510A JP5667012B2 JP 5667012 B2 JP5667012 B2 JP 5667012B2 JP 2011184510 A JP2011184510 A JP 2011184510A JP 2011184510 A JP2011184510 A JP 2011184510A JP 5667012 B2 JP5667012 B2 JP 5667012B2
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Japan
Prior art keywords
ring
component
longitudinal direction
collar
substrate
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JP2011184510A
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English (en)
Japanese (ja)
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JP2013046002A (ja
Inventor
芳彦 佐々木
芳彦 佐々木
雅人 南
雅人 南
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Tokyo Electron Ltd
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Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Priority to JP2011184510A priority Critical patent/JP5667012B2/ja
Priority to TW101130426A priority patent/TWI544544B/zh
Priority to KR1020120092281A priority patent/KR101414308B1/ko
Priority to CN201210306041.4A priority patent/CN102956431B/zh
Priority to CN201510523186.3A priority patent/CN105206497B/zh
Publication of JP2013046002A publication Critical patent/JP2013046002A/ja
Priority to KR1020130152992A priority patent/KR101563789B1/ko
Application granted granted Critical
Publication of JP5667012B2 publication Critical patent/JP5667012B2/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32623—Mechanical discharge control means
    • H01J37/32642—Focus rings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32623—Mechanical discharge control means
    • H01J37/32651—Shields, e.g. dark space shields, Faraday shields
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32715—Workpiece holder
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67196—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the transfer chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67201—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the load-lock chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Drying Of Semiconductors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Chemical Vapour Deposition (AREA)
  • Plasma Technology (AREA)
JP2011184510A 2011-08-26 2011-08-26 リング状シールド部材、その構成部品及びリング状シールド部材を備えた基板載置台 Active JP5667012B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2011184510A JP5667012B2 (ja) 2011-08-26 2011-08-26 リング状シールド部材、その構成部品及びリング状シールド部材を備えた基板載置台
TW101130426A TWI544544B (zh) 2011-08-26 2012-08-22 A ring-shaped shield member and a constituent member thereof, and a substrate mounting table provided with an annular shield member
KR1020120092281A KR101414308B1 (ko) 2011-08-26 2012-08-23 링 형상 실드 부재, 그 구성부품 및 링 형상 실드 부재를 구비한 기판 탑재대
CN201210306041.4A CN102956431B (zh) 2011-08-26 2012-08-24 环状屏蔽部件、其构成零件和基板载置台
CN201510523186.3A CN105206497B (zh) 2011-08-26 2012-08-24 环状屏蔽部件、其构成零件和基板载置台
KR1020130152992A KR101563789B1 (ko) 2011-08-26 2013-12-10 링 형상 실드 부재, 그 구성부품 및 링 형상 실드 부재를 구비한 기판 탑재대

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011184510A JP5667012B2 (ja) 2011-08-26 2011-08-26 リング状シールド部材、その構成部品及びリング状シールド部材を備えた基板載置台

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2014249800A Division JP5941971B2 (ja) 2014-12-10 2014-12-10 リング状シールド部材及びリング状シールド部材を備えた基板載置台

Publications (2)

Publication Number Publication Date
JP2013046002A JP2013046002A (ja) 2013-03-04
JP5667012B2 true JP5667012B2 (ja) 2015-02-12

Family

ID=47765109

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011184510A Active JP5667012B2 (ja) 2011-08-26 2011-08-26 リング状シールド部材、その構成部品及びリング状シールド部材を備えた基板載置台

Country Status (4)

Country Link
JP (1) JP5667012B2 (ko)
KR (2) KR101414308B1 (ko)
CN (2) CN102956431B (ko)
TW (1) TWI544544B (ko)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6321172B2 (ja) * 2013-11-25 2018-05-09 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 熱エネルギー伝達低減のための基板キャリア
JP6380094B2 (ja) * 2014-12-26 2018-08-29 東京エレクトロン株式会社 載置台及びプラズマ処理装置
JP2016127185A (ja) * 2015-01-06 2016-07-11 東京エレクトロン株式会社 シールドリングおよび基板載置台
KR101686564B1 (ko) * 2015-06-17 2016-12-15 세메스 주식회사 체결 어셈블리 및 이를 가지는 기판 처리 장치
JP6545613B2 (ja) * 2015-12-28 2019-07-17 クアーズテック株式会社 フォーカスリング
KR102604790B1 (ko) * 2021-05-03 2023-11-21 세메스 주식회사 기판 처리 장치

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06295866A (ja) * 1993-04-08 1994-10-21 Canon Inc プラズマ反応装置
JP2001525997A (ja) * 1997-05-20 2001-12-11 東京エレクトロン株式会社 処理装置
JP3924721B2 (ja) * 1999-12-22 2007-06-06 東京エレクトロン株式会社 シールドリングの分割部材、シールドリング及びプラズマ処理装置
JP4367959B2 (ja) * 1999-12-22 2009-11-18 東京エレクトロン株式会社 プラズマ処理装置
JP2002014310A (ja) * 2000-06-30 2002-01-18 Minolta Co Ltd フイルム基板搬送保持具及びフイルム基板
US7501161B2 (en) * 2004-06-01 2009-03-10 Applied Materials, Inc. Methods and apparatus for reducing arcing during plasma processing
JP4795842B2 (ja) 2006-04-26 2011-10-19 日本冶金工業株式会社 蒸着用治具
JP5248038B2 (ja) * 2007-05-22 2013-07-31 東京エレクトロン株式会社 載置台およびそれを用いたプラズマ処理装置
JP4782733B2 (ja) * 2007-06-12 2011-09-28 東京エレクトロン株式会社 載置台およびそれを用いたプラズマ処理装置
KR20100128579A (ko) * 2009-05-28 2010-12-08 김종성 건축마감재 설치용 고정장치
WO2011146571A2 (en) * 2010-05-21 2011-11-24 Applied Materials, Inc. Tightly-fitted ceramic insulator on large-area electrode
KR101282554B1 (ko) * 2010-07-20 2013-07-04 도쿄엘렉트론가부시키가이샤 실드 부재, 그 구성 부품 및 실드 부재를 구비한 기판 탑재대

Also Published As

Publication number Publication date
KR20130023116A (ko) 2013-03-07
CN102956431A (zh) 2013-03-06
KR20130141418A (ko) 2013-12-26
CN102956431B (zh) 2015-09-30
CN105206497A (zh) 2015-12-30
TWI544544B (zh) 2016-08-01
JP2013046002A (ja) 2013-03-04
KR101563789B1 (ko) 2015-10-27
CN105206497B (zh) 2017-07-28
KR101414308B1 (ko) 2014-07-02
TW201327667A (zh) 2013-07-01

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