TWI544544B - A ring-shaped shield member and a constituent member thereof, and a substrate mounting table provided with an annular shield member - Google Patents

A ring-shaped shield member and a constituent member thereof, and a substrate mounting table provided with an annular shield member Download PDF

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Publication number
TWI544544B
TWI544544B TW101130426A TW101130426A TWI544544B TW I544544 B TWI544544 B TW I544544B TW 101130426 A TW101130426 A TW 101130426A TW 101130426 A TW101130426 A TW 101130426A TW I544544 B TWI544544 B TW I544544B
Authority
TW
Taiwan
Prior art keywords
ring
collar
longitudinal direction
substrate
component
Prior art date
Application number
TW101130426A
Other languages
English (en)
Chinese (zh)
Other versions
TW201327667A (zh
Inventor
Yoshihiko Sasaki
Masato Minami
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of TW201327667A publication Critical patent/TW201327667A/zh
Application granted granted Critical
Publication of TWI544544B publication Critical patent/TWI544544B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32623—Mechanical discharge control means
    • H01J37/32642—Focus rings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32623—Mechanical discharge control means
    • H01J37/32651—Shields, e.g. dark space shields, Faraday shields
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32715—Workpiece holder
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67196—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the transfer chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67201—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the load-lock chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Drying Of Semiconductors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Chemical Vapour Deposition (AREA)
  • Plasma Technology (AREA)
TW101130426A 2011-08-26 2012-08-22 A ring-shaped shield member and a constituent member thereof, and a substrate mounting table provided with an annular shield member TWI544544B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011184510A JP5667012B2 (ja) 2011-08-26 2011-08-26 リング状シールド部材、その構成部品及びリング状シールド部材を備えた基板載置台

Publications (2)

Publication Number Publication Date
TW201327667A TW201327667A (zh) 2013-07-01
TWI544544B true TWI544544B (zh) 2016-08-01

Family

ID=47765109

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101130426A TWI544544B (zh) 2011-08-26 2012-08-22 A ring-shaped shield member and a constituent member thereof, and a substrate mounting table provided with an annular shield member

Country Status (4)

Country Link
JP (1) JP5667012B2 (ko)
KR (2) KR101414308B1 (ko)
CN (2) CN102956431B (ko)
TW (1) TWI544544B (ko)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6321172B2 (ja) * 2013-11-25 2018-05-09 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 熱エネルギー伝達低減のための基板キャリア
JP6380094B2 (ja) * 2014-12-26 2018-08-29 東京エレクトロン株式会社 載置台及びプラズマ処理装置
JP2016127185A (ja) 2015-01-06 2016-07-11 東京エレクトロン株式会社 シールドリングおよび基板載置台
KR101686564B1 (ko) * 2015-06-17 2016-12-15 세메스 주식회사 체결 어셈블리 및 이를 가지는 기판 처리 장치
JP6545613B2 (ja) * 2015-12-28 2019-07-17 クアーズテック株式会社 フォーカスリング
KR102604790B1 (ko) * 2021-05-03 2023-11-21 세메스 주식회사 기판 처리 장치
KR102675833B1 (ko) * 2023-09-15 2024-06-17 (주)디바이스이엔지 발열부가 장착된 기판 처리장치

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06295866A (ja) * 1993-04-08 1994-10-21 Canon Inc プラズマ反応装置
KR100434790B1 (ko) * 1997-05-20 2004-06-07 동경 엘렉트론 주식회사 처리 장치
JP4367959B2 (ja) * 1999-12-22 2009-11-18 東京エレクトロン株式会社 プラズマ処理装置
JP3924721B2 (ja) * 1999-12-22 2007-06-06 東京エレクトロン株式会社 シールドリングの分割部材、シールドリング及びプラズマ処理装置
JP2002014310A (ja) * 2000-06-30 2002-01-18 Minolta Co Ltd フイルム基板搬送保持具及びフイルム基板
US7501161B2 (en) * 2004-06-01 2009-03-10 Applied Materials, Inc. Methods and apparatus for reducing arcing during plasma processing
JP4795842B2 (ja) 2006-04-26 2011-10-19 日本冶金工業株式会社 蒸着用治具
JP5248038B2 (ja) * 2007-05-22 2013-07-31 東京エレクトロン株式会社 載置台およびそれを用いたプラズマ処理装置
JP4782733B2 (ja) * 2007-06-12 2011-09-28 東京エレクトロン株式会社 載置台およびそれを用いたプラズマ処理装置
KR20100128579A (ko) * 2009-05-28 2010-12-08 김종성 건축마감재 설치용 고정장치
JP6104157B2 (ja) * 2010-05-21 2017-03-29 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 大面積電極にぴったりと嵌合されたセラミックス絶縁体
CN102337511B (zh) * 2010-07-20 2014-02-26 东京毅力科创株式会社 屏蔽部件、其构成零件以及具有屏蔽部件的基板载置台

Also Published As

Publication number Publication date
CN105206497B (zh) 2017-07-28
CN105206497A (zh) 2015-12-30
TW201327667A (zh) 2013-07-01
KR101414308B1 (ko) 2014-07-02
CN102956431B (zh) 2015-09-30
JP5667012B2 (ja) 2015-02-12
KR20130141418A (ko) 2013-12-26
KR20130023116A (ko) 2013-03-07
KR101563789B1 (ko) 2015-10-27
JP2013046002A (ja) 2013-03-04
CN102956431A (zh) 2013-03-06

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