JP5665158B1 - ボンディングステージ及びその製造方法 - Google Patents
ボンディングステージ及びその製造方法 Download PDFInfo
- Publication number
- JP5665158B1 JP5665158B1 JP2014545014A JP2014545014A JP5665158B1 JP 5665158 B1 JP5665158 B1 JP 5665158B1 JP 2014545014 A JP2014545014 A JP 2014545014A JP 2014545014 A JP2014545014 A JP 2014545014A JP 5665158 B1 JP5665158 B1 JP 5665158B1
- Authority
- JP
- Japan
- Prior art keywords
- flat plate
- heater
- base portion
- plate
- bonding stage
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 6
- 238000000034 method Methods 0.000 claims description 9
- 239000000919 ceramic Substances 0.000 abstract description 13
- 238000003825 pressing Methods 0.000 description 12
- 239000004065 semiconductor Substances 0.000 description 12
- 239000000758 substrate Substances 0.000 description 9
- 238000010438 heat treatment Methods 0.000 description 6
- 238000003754 machining Methods 0.000 description 6
- 229910000679 solder Inorganic materials 0.000 description 6
- 239000010408 film Substances 0.000 description 5
- 239000010445 mica Substances 0.000 description 5
- 229910052618 mica group Inorganic materials 0.000 description 5
- 238000010586 diagram Methods 0.000 description 3
- 238000001179 sorption measurement Methods 0.000 description 3
- 239000002184 metal Substances 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000012447 hatching Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67103—Apparatus for thermal treatment mainly by conduction
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/27—Manufacturing methods
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/7525—Means for applying energy, e.g. heating means
- H01L2224/75251—Means for applying energy, e.g. heating means in the lower part of the bonding apparatus, e.g. in the apparatus chuck
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/757—Means for aligning
- H01L2224/75743—Suction holding means
- H01L2224/75744—Suction holding means in the lower part of the bonding apparatus, e.g. in the apparatus chuck
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/75981—Apparatus chuck
- H01L2224/75982—Shape
- H01L2224/75983—Shape of the mounting surface
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Wire Bonding (AREA)
- Resistance Heating (AREA)
- Die Bonding (AREA)
Abstract
Description
Claims (3)
- 上面が平坦な複数の突起がその表面に設けられた基体部と、
前記突起の上面に固定された平板と、
前記平板の上に吸着固定された表面板と、
前記平板の前記基体部側に配置された板状のヒータと、
前記ヒータと前記基体部との間に設けられ、前記ヒータを前記平板の前記基体部側の面に密着させる弾性部材と、
を備えるボンディングステージ。 - 請求項1に記載のボンディングステージであって、
前記基体部は、複数の有底穴を備え、
前記弾性部材は、前記有底穴の中に配置され、その初期高さは、前記有底穴の深さよりも高く、
前記ヒータは前記突起が貫通する複数の孔を備え、前記突起に沿って基体部の厚さ方向に移動可能であり、
前記弾性部材は、前記平板を前記基体部の突起の上面に固定した際に圧縮され、前記ヒータを前記平板に押し付け、密着させるボンディングステージ。 - ボンディングステージの製造方法であって、
上面が平坦な複数の突起がその表面に設けられた基体部と、前記突起の上面に固定される平板とを準備する工程と、
前記突起の上面に平板を固定する平板固定工程と、
前記基体部と前記平板とを一体として前記平板の表面を平面加工する平面加工工程と、
平面加工工程の後、前記平板を前記基体部から取り外す平板取り外し工程と、
前記ヒータと前記基体部との間に板状のヒータと弾性部材とを配置するヒータ配置工程と、
前記平板を前記突起の上面に固定し、前記ヒータが前記平板の前記基体部側の面に密着するように、前記基体部に平板を再固定する平板再固定工程と、
を含むボンディングステージの製造方法。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014545014A JP5665158B1 (ja) | 2013-07-10 | 2014-03-19 | ボンディングステージ及びその製造方法 |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013144704 | 2013-07-10 | ||
JP2013144704 | 2013-07-10 | ||
PCT/JP2014/057560 WO2015004950A1 (ja) | 2013-07-10 | 2014-03-19 | ボンディングステージ及びその製造方法 |
JP2014545014A JP5665158B1 (ja) | 2013-07-10 | 2014-03-19 | ボンディングステージ及びその製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP5665158B1 true JP5665158B1 (ja) | 2015-02-04 |
JPWO2015004950A1 JPWO2015004950A1 (ja) | 2017-03-02 |
Family
ID=52279649
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014545014A Active JP5665158B1 (ja) | 2013-07-10 | 2014-03-19 | ボンディングステージ及びその製造方法 |
Country Status (7)
Country | Link |
---|---|
US (1) | US9679866B2 (ja) |
JP (1) | JP5665158B1 (ja) |
KR (1) | KR101579094B1 (ja) |
CN (1) | CN105612609B (ja) |
SG (1) | SG11201600124PA (ja) |
TW (1) | TWI512856B (ja) |
WO (1) | WO2015004950A1 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9576928B2 (en) * | 2015-02-27 | 2017-02-21 | Kulicke And Soffa Industries, Inc. | Bond head assemblies, thermocompression bonding systems and methods of assembling and operating the same |
US20240213080A1 (en) * | 2022-06-29 | 2024-06-27 | Shenyang Kingsemi Co., Ltd. | Semiconductor substrate heating device, semiconductor device and temperature control method |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0637149A (ja) * | 1992-07-17 | 1994-02-10 | Sumitomo Electric Ind Ltd | 半導体装置の実装装置 |
JP2000260825A (ja) * | 1999-03-05 | 2000-09-22 | Kyocera Corp | 接触加熱用ヒータ及びこれを用いた接触加熱装置 |
JP2006324581A (ja) * | 2005-05-20 | 2006-11-30 | Athlete Fa Kk | 電子部品の接合装置 |
JP2007005353A (ja) * | 2005-06-21 | 2007-01-11 | Future Vision:Kk | 載置台 |
JP2007150294A (ja) * | 2006-11-09 | 2007-06-14 | Sumitomo Electric Ind Ltd | 半導体製造装置用保持体 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0637149B2 (ja) * | 1985-10-21 | 1994-05-18 | 日本電装株式会社 | 車両用座席調整装置 |
EP1205451A1 (en) * | 2000-03-07 | 2002-05-15 | Ibiden Co., Ltd. | Ceramic substrate for manufacture/inspection of semiconductor |
US7071551B2 (en) | 2000-05-26 | 2006-07-04 | Ibiden Co., Ltd. | Device used to produce or examine semiconductors |
US20070249098A1 (en) * | 2006-04-21 | 2007-10-25 | Raymond Charles Cady | Bonding plate mechanism for use in anodic bonding |
WO2008001626A1 (en) * | 2006-06-29 | 2008-01-03 | Nikon Corporation | Wafer bonding apparatus |
DE102008028353A1 (de) * | 2008-06-13 | 2009-12-17 | Dr. Ing. H.C. F. Porsche Aktiengesellschaft | Fahrzeugsitz |
JP5167071B2 (ja) * | 2008-11-04 | 2013-03-21 | アルファーデザイン株式会社 | フリップチップボンダ装置の作業台板の水平化調整方法及びプログラム |
JP5167072B2 (ja) | 2008-11-04 | 2013-03-21 | アルファーデザイン株式会社 | フリップチップボンダ装置 |
JP5423632B2 (ja) * | 2010-01-29 | 2014-02-19 | 住友大阪セメント株式会社 | 静電チャック装置 |
FR2956423B1 (fr) * | 2010-02-16 | 2014-01-10 | Soprema | Dispositif de fixation de plaques ou de panneaux sur une couverture et couverture composite resultante |
JP2014138164A (ja) * | 2013-01-18 | 2014-07-28 | Sumitomo Osaka Cement Co Ltd | 静電チャック装置 |
-
2013
- 2013-12-30 TW TW102148925A patent/TWI512856B/zh active
-
2014
- 2014-03-19 CN CN201480001162.5A patent/CN105612609B/zh active Active
- 2014-03-19 KR KR1020147033312A patent/KR101579094B1/ko active IP Right Grant
- 2014-03-19 WO PCT/JP2014/057560 patent/WO2015004950A1/ja active Application Filing
- 2014-03-19 SG SG11201600124PA patent/SG11201600124PA/en unknown
- 2014-03-19 JP JP2014545014A patent/JP5665158B1/ja active Active
-
2016
- 2016-01-07 US US14/990,199 patent/US9679866B2/en active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0637149A (ja) * | 1992-07-17 | 1994-02-10 | Sumitomo Electric Ind Ltd | 半導体装置の実装装置 |
JP2000260825A (ja) * | 1999-03-05 | 2000-09-22 | Kyocera Corp | 接触加熱用ヒータ及びこれを用いた接触加熱装置 |
JP2006324581A (ja) * | 2005-05-20 | 2006-11-30 | Athlete Fa Kk | 電子部品の接合装置 |
JP2007005353A (ja) * | 2005-06-21 | 2007-01-11 | Future Vision:Kk | 載置台 |
JP2007150294A (ja) * | 2006-11-09 | 2007-06-14 | Sumitomo Electric Ind Ltd | 半導体製造装置用保持体 |
Also Published As
Publication number | Publication date |
---|---|
TWI512856B (zh) | 2015-12-11 |
WO2015004950A1 (ja) | 2015-01-15 |
JPWO2015004950A1 (ja) | 2017-03-02 |
KR101579094B1 (ko) | 2015-12-21 |
KR20150035552A (ko) | 2015-04-06 |
TW201503270A (zh) | 2015-01-16 |
SG11201600124PA (en) | 2016-02-26 |
US20160118363A1 (en) | 2016-04-28 |
CN105612609B (zh) | 2018-05-04 |
CN105612609A (zh) | 2016-05-25 |
US9679866B2 (en) | 2017-06-13 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP2012160628A (ja) | 基板の接合方法及び基板接合装置 | |
JPWO2016157465A1 (ja) | 加圧ユニット | |
JP5665158B1 (ja) | ボンディングステージ及びその製造方法 | |
JP4509811B2 (ja) | 検査治具 | |
TWI727082B (zh) | 安裝裝置 | |
TW201349383A (zh) | 晶圓固持具 | |
JP2013191669A (ja) | 電子部品実装ツール | |
KR101360065B1 (ko) | 몰드형 웨이퍼 제조용 진공척 | |
KR20140124948A (ko) | 평탄도 유지와 치핑방지에 용이한 반도체 제조설비용 진공 척 | |
JPH07263527A (ja) | 静電吸着装置 | |
TW201707984A (zh) | 層壓材料的結合 | |
JP4397967B1 (ja) | 吸着装置 | |
TWM528994U (zh) | 基板壓平設備 | |
WO2018029983A1 (ja) | 接合装置 | |
JP5227568B2 (ja) | 静電チャック | |
JP6512182B2 (ja) | 半導体装置の製造方法 | |
TWM561324U (zh) | 壓合治具 | |
TWI850178B (zh) | 加壓裝置 | |
JP6397621B2 (ja) | 基板保持部材の洗浄方法 | |
WO2023189648A1 (ja) | 基板貼り合わせ装置及び基板貼り合わせ方法 | |
JP2024112615A (ja) | 加圧装置 | |
TW202432353A (zh) | 加壓裝置 | |
TW202401507A (zh) | 基板層疊裝置及基板層疊方法 | |
JP6044570B2 (ja) | 基板保持部材および接合装置 | |
JP6355253B2 (ja) | ワーククランプ治具及びワーク研磨方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A975 | Report on accelerated examination |
Free format text: JAPANESE INTERMEDIATE CODE: A971005 Effective date: 20141127 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20141204 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20141204 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 5665158 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |