JP5663126B2 - ワーク搬送方法及びワーク受渡し機構を有する装置 - Google Patents
ワーク搬送方法及びワーク受渡し機構を有する装置 Download PDFInfo
- Publication number
- JP5663126B2 JP5663126B2 JP2007208263A JP2007208263A JP5663126B2 JP 5663126 B2 JP5663126 B2 JP 5663126B2 JP 2007208263 A JP2007208263 A JP 2007208263A JP 2007208263 A JP2007208263 A JP 2007208263A JP 5663126 B2 JP5663126 B2 JP 5663126B2
- Authority
- JP
- Japan
- Prior art keywords
- jig
- fixing jig
- fixing
- workpiece
- wafer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J11/00—Manipulators not otherwise provided for
- B25J11/0095—Manipulators transporting wafers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J9/00—Programme-controlled manipulators
- B25J9/02—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type
- B25J9/04—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type by rotating at least one arm, excluding the head movement itself, e.g. cylindrical coordinate type or polar coordinate type
- B25J9/041—Cylindrical coordinate type
- B25J9/042—Cylindrical coordinate type comprising an articulated arm
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Description
3 固定治具、
31 治具本体
32 密着層
33 支持突起
34 側壁
35 区画空間
36 通気孔
4 搬送手段(ワーク受渡し機構)
41 フィンガー部
43 モータ(反転機構)
5 着脱部(ワーク受渡し機構)
W ウエハ
S1、S2 保護構造体収納部
S3 治具待機部
Claims (2)
- 薄板状のワークの一面に第1の固定治具を密着固定し、この第1の固定治具を密着固定した状態で当該ワークの他面に対し第1の処理装置にて所定の処理を行った後、着脱部にて当該ワークの他面に治具待機部で保管されていた第2の固定治具を密着固定する工程と、
当該ワークから第1の固定治具を脱離して第2の固定治具にワークを受け渡し、この第2の固定治具を密着固定した状態で当該ワークの一面に対し第2の処理装置にて所定の処理を行い得る状態とし、第1の固定治具を治具待機部に移送する工程と、を含むワーク搬送方法であって、
前記第1及び第2の両固定治具は、板状の治具本体と、当該治具本体の片面に設けられ当該ワークを着脱自在に密着保持する密着層とから構成され、前記治具本体は、片面に前記密着層を支持する複数の支持突起を有すると共に、片面の外周部に前記支持突起と同等高さの側壁を有し、この側壁の端面に前記密着層が接着されて、前記密着層と前記治具本体との間に前記側壁で囲われた区画空間が画成され、前記治具本体に前記区画空間に連通する通気孔が形成され、前記着脱部にてこの通気孔を介して前記区画空間内の空気を吸引することにより、前記密着層が変形されるものであり、
前記脱離を、前記第1の固定治具の密着層を変形させた後に、前記両固定治具を、相互に離間する方向に相対移動させて行うことを特徴とするワーク搬送方法。 - 一面に第1の固定治具が密着固定された薄板状のワークの他面に対し第1の処理装置にて所定の処理が行われた後に、着脱部にてこの他面に第2の固定治具を密着固定し、ワークから第1の固定治具を脱離して第2の固定治具にワークを受け渡し、この第2の固定治具が密着固定されたワークの一面に対し第2の処理装置にて所定の処理を行い得る状態とするワーク受渡し機構を有する装置であって、
前記第1及び第2の両固定治具は、板状の治具本体と、当該治具本体の片面に設けられ当該ワークを着脱自在に密着保持する密着層とから構成され、前記治具本体は、片面に前記密着層を支持する複数の支持突起を有すると共に、片面の外周部に前記支持突起と同等高さの側壁を有し、この側壁の端面に前記密着層が接着されて、前記密着層と前記治具本体との間に前記側壁で囲われた区画空間が画成され、前記治具本体に前記区画空間に連通する通気孔が形成され、この通気孔を介して前記区画空間内の空気を吸引することにより、前記密着層が変形されるものであり、
前記ワーク受渡し機構が、第1の固定治具の通気孔に連通し、吸引手段に接続する貫通孔を有する前記着脱部と、ワークまたは固定治具の支持が可能で上下反転可能に形成されたフィンガー部を有する搬送手段とを備え、
前記ワークを受け渡した後の固定治具を一時的に保管する治具待機部を設けたことを特徴とするワーク受渡し機構を有する装置。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007208263A JP5663126B2 (ja) | 2007-08-09 | 2007-08-09 | ワーク搬送方法及びワーク受渡し機構を有する装置 |
CN2008801009148A CN101772835B (zh) | 2007-08-09 | 2008-07-31 | 工件输送方法以及具有工件交接机构的装置 |
PCT/JP2008/063796 WO2009020050A1 (ja) | 2007-08-09 | 2008-07-31 | ワーク搬送方法及びワーク受渡し機構を有する装置 |
US12/452,649 US8529314B2 (en) | 2007-08-09 | 2008-07-31 | Method of transporting work and apparatus with work handover mechanism |
KR1020107002644A KR101486104B1 (ko) | 2007-08-09 | 2008-07-31 | 작업물 반송 방법 및 작업물 전달 기구를 갖는 장치 |
TW097130428A TWI446478B (zh) | 2007-08-09 | 2008-08-08 | A workpiece handling method and a device having a workpiece transfer mechanism |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007208263A JP5663126B2 (ja) | 2007-08-09 | 2007-08-09 | ワーク搬送方法及びワーク受渡し機構を有する装置 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013101142A Division JP5773372B2 (ja) | 2013-05-13 | 2013-05-13 | ワーク受渡し機構を有する装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2009043995A JP2009043995A (ja) | 2009-02-26 |
JP5663126B2 true JP5663126B2 (ja) | 2015-02-04 |
Family
ID=40341284
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007208263A Expired - Fee Related JP5663126B2 (ja) | 2007-08-09 | 2007-08-09 | ワーク搬送方法及びワーク受渡し機構を有する装置 |
Country Status (6)
Country | Link |
---|---|
US (1) | US8529314B2 (ja) |
JP (1) | JP5663126B2 (ja) |
KR (1) | KR101486104B1 (ja) |
CN (1) | CN101772835B (ja) |
TW (1) | TWI446478B (ja) |
WO (1) | WO2009020050A1 (ja) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8489222B2 (en) * | 2010-05-20 | 2013-07-16 | Korea Nuclear Fuel Co., Ltd. | Machine and method for grinding spacer grid of nuclear fuel assembly |
JP2012243335A (ja) * | 2011-05-17 | 2012-12-10 | Sony Corp | ディスク搬送装置及びディスクストレージシステム |
JP5547147B2 (ja) * | 2011-09-13 | 2014-07-09 | 東京エレクトロン株式会社 | 接合装置、接合システム、接合方法、プログラム及びコンピュータ記憶媒体 |
KR102127883B1 (ko) * | 2012-11-02 | 2020-06-29 | 엔테그리스, 아이엔씨. | 포토패터닝-가능 연성 돌기 접촉면을 갖는 정전 척 |
US9597766B2 (en) | 2013-02-05 | 2017-03-21 | Sintokogio, Ltd. | Brush unit, a device for brush-polishing that uses the brush unit, a system for brush-polishing, and a method for brush-polishing |
US9987747B2 (en) * | 2016-05-24 | 2018-06-05 | Semes Co., Ltd. | Stocker for receiving cassettes and method of teaching a stocker robot disposed therein |
US20190207170A1 (en) * | 2016-09-05 | 2019-07-04 | Sharp Kabushiki Kaisha | Transport tool and method for manufacturing organic electroluminescent display device using said transport tool |
JP6866171B2 (ja) * | 2017-01-30 | 2021-04-28 | コマツ産機株式会社 | ワーク搬送装置 |
CN110892519B (zh) * | 2017-07-12 | 2024-08-06 | 东京毅力科创株式会社 | 输送装置、基板处理系统、输送方法以及基板处理方法 |
EP3948939B1 (en) | 2019-03-27 | 2024-02-21 | Yaskawa Europe Technology Ltd. | Semiconductor flipper |
CN112103227A (zh) * | 2019-06-18 | 2020-12-18 | 上海微电子装备(集团)股份有限公司 | 一种交接装置、半导体设备、半导体生产线以及交接方法 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6413145B1 (en) * | 2000-04-05 | 2002-07-02 | Applied Materials, Inc. | System for polishing and cleaning substrates |
JP4641781B2 (ja) * | 2003-11-04 | 2011-03-02 | 三星電子株式会社 | 不均一強度を有する研磨面を使用した化学的機械的研磨装置および方法 |
WO2005109489A1 (ja) * | 2004-05-07 | 2005-11-17 | Shin-Etsu Engineering Co., Ltd. | ワーク除電方法及びその装置 |
JP2006027795A (ja) * | 2004-07-14 | 2006-02-02 | Toshiba Corp | 吸着装置、ならびに板状部材の搬送方法、液晶表示装置の製造方法 |
JP4587828B2 (ja) | 2005-02-03 | 2010-11-24 | 信越ポリマー株式会社 | 精密基板用の固定治具 |
JP4484760B2 (ja) * | 2005-05-10 | 2010-06-16 | 信越ポリマー株式会社 | 固定キャリア及びその製造方法 |
JP2007096085A (ja) * | 2005-09-29 | 2007-04-12 | Shin Etsu Polymer Co Ltd | 固定キャリア及びその使用方法 |
JP4573763B2 (ja) * | 2005-12-01 | 2010-11-04 | 信越ポリマー株式会社 | 吸着装置 |
-
2007
- 2007-08-09 JP JP2007208263A patent/JP5663126B2/ja not_active Expired - Fee Related
-
2008
- 2008-07-31 US US12/452,649 patent/US8529314B2/en not_active Expired - Fee Related
- 2008-07-31 WO PCT/JP2008/063796 patent/WO2009020050A1/ja active Application Filing
- 2008-07-31 CN CN2008801009148A patent/CN101772835B/zh not_active Expired - Fee Related
- 2008-07-31 KR KR1020107002644A patent/KR101486104B1/ko active IP Right Grant
- 2008-08-08 TW TW097130428A patent/TWI446478B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
US8529314B2 (en) | 2013-09-10 |
TWI446478B (zh) | 2014-07-21 |
KR101486104B1 (ko) | 2015-01-23 |
CN101772835A (zh) | 2010-07-07 |
KR20100052471A (ko) | 2010-05-19 |
TW200929422A (en) | 2009-07-01 |
US20100189533A1 (en) | 2010-07-29 |
WO2009020050A1 (ja) | 2009-02-12 |
CN101772835B (zh) | 2011-12-07 |
JP2009043995A (ja) | 2009-02-26 |
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