JP5654753B2 - スペクトルを使用した研磨終了点の決定 - Google Patents

スペクトルを使用した研磨終了点の決定 Download PDF

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Publication number
JP5654753B2
JP5654753B2 JP2009551052A JP2009551052A JP5654753B2 JP 5654753 B2 JP5654753 B2 JP 5654753B2 JP 2009551052 A JP2009551052 A JP 2009551052A JP 2009551052 A JP2009551052 A JP 2009551052A JP 5654753 B2 JP5654753 B2 JP 5654753B2
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spectrum
spectra
squares
rotation
substrate
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Japanese (ja)
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JP2010519771A5 (enExample
JP2010519771A (ja
Inventor
ハリー キュー． リー，
ハリー キュー． リー，
ボグスロー エー． スウェデク，
ボグスロー エー． スウェデク，
ドミニク ジェイ． ベンヴェニュ，
ドミニク ジェイ． ベンヴェニュ，
ジェフリー ドゥルー デーヴィッド，
ジェフリー ドゥルー デーヴィッド，
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Applied Materials Inc
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Applied Materials Inc
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Publication of JP2010519771A5 publication Critical patent/JP2010519771A5/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
    • H10P74/203—Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
    • G—PHYSICS
    • G16—INFORMATION AND COMMUNICATION TECHNOLOGY [ICT] SPECIALLY ADAPTED FOR SPECIFIC APPLICATION FIELDS
    • G16Z—INFORMATION AND COMMUNICATION TECHNOLOGY [ICT] SPECIALLY ADAPTED FOR SPECIFIC APPLICATION FIELDS, NOT OTHERWISE PROVIDED FOR
    • G16Z99/00—Subject matter not provided for in other main groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H10P52/40—Chemomechanical polishing [CMP]
    • H10P52/402—Chemomechanical polishing [CMP] of semiconductor materials

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
JP2009551052A 2007-02-23 2008-02-22 スペクトルを使用した研磨終了点の決定 Active JP5654753B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US89148707P 2007-02-23 2007-02-23
US60/891,487 2007-02-23
PCT/US2008/054807 WO2008103964A2 (en) 2007-02-23 2008-02-22 Using spectra to determine polishing endpoints

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2013127106A Division JP5774059B2 (ja) 2007-02-23 2013-06-18 スペクトルを使用した研磨終了点の決定

Publications (3)

Publication Number Publication Date
JP2010519771A JP2010519771A (ja) 2010-06-03
JP2010519771A5 JP2010519771A5 (enExample) 2014-05-29
JP5654753B2 true JP5654753B2 (ja) 2015-01-14

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JP2009551052A Active JP5654753B2 (ja) 2007-02-23 2008-02-22 スペクトルを使用した研磨終了点の決定
JP2013127106A Active JP5774059B2 (ja) 2007-02-23 2013-06-18 スペクトルを使用した研磨終了点の決定

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JP2013127106A Active JP5774059B2 (ja) 2007-02-23 2013-06-18 スペクトルを使用した研磨終了点の決定

Country Status (6)

Country Link
US (2) US8569174B2 (enExample)
EP (1) EP2125291A4 (enExample)
JP (2) JP5654753B2 (enExample)
KR (3) KR101504508B1 (enExample)
TW (1) TWI445098B (enExample)
WO (1) WO2008103964A2 (enExample)

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Also Published As

Publication number Publication date
EP2125291A2 (en) 2009-12-02
TW200849416A (en) 2008-12-16
US20080206993A1 (en) 2008-08-28
KR101678082B1 (ko) 2016-11-21
WO2008103964A2 (en) 2008-08-28
US8569174B2 (en) 2013-10-29
KR20090112765A (ko) 2009-10-28
EP2125291A4 (en) 2013-08-07
JP5774059B2 (ja) 2015-09-02
WO2008103964A3 (en) 2008-11-27
JP2013232660A (ja) 2013-11-14
JP2010519771A (ja) 2010-06-03
KR20140147146A (ko) 2014-12-29
KR20150140400A (ko) 2015-12-15
TWI445098B (zh) 2014-07-11
US20140045282A1 (en) 2014-02-13
KR101504508B1 (ko) 2015-03-20
US9142466B2 (en) 2015-09-22
KR101643992B1 (ko) 2016-07-29

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