JP5650902B2 - ナノインプリント用モールドの露光装置及びナノインプリント用モールドの製造方法 - Google Patents

ナノインプリント用モールドの露光装置及びナノインプリント用モールドの製造方法 Download PDF

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JP5650902B2
JP5650902B2 JP2009273679A JP2009273679A JP5650902B2 JP 5650902 B2 JP5650902 B2 JP 5650902B2 JP 2009273679 A JP2009273679 A JP 2009273679A JP 2009273679 A JP2009273679 A JP 2009273679A JP 5650902 B2 JP5650902 B2 JP 5650902B2
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exposure
roll
pulse
mold
resist layer
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Japanese (ja)
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JP2011118049A5 (https=
JP2011118049A (ja
Inventor
一之 古谷
一之 古谷
鈴木　勝
勝 鈴木
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Asahi Kasei Corp
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Asahi Kasei E Materials Corp
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  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
JP2009273679A 2009-12-01 2009-12-01 ナノインプリント用モールドの露光装置及びナノインプリント用モールドの製造方法 Expired - Fee Related JP5650902B2 (ja)

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JP2009273679A JP5650902B2 (ja) 2009-12-01 2009-12-01 ナノインプリント用モールドの露光装置及びナノインプリント用モールドの製造方法

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JP2009273679A JP5650902B2 (ja) 2009-12-01 2009-12-01 ナノインプリント用モールドの露光装置及びナノインプリント用モールドの製造方法

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JP2011118049A JP2011118049A (ja) 2011-06-16
JP2011118049A5 JP2011118049A5 (https=) 2012-12-20
JP5650902B2 true JP5650902B2 (ja) 2015-01-07

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Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2583813B1 (en) 2010-06-16 2020-07-01 Asahi Kasei Kabushiki Kaisha Roller mold manufacturing device and manufacturing method
JP5968601B2 (ja) * 2011-06-30 2016-08-10 株式会社ホロン ロールモールド製作装置およびロールモールド作製方法
US9391236B2 (en) 2011-08-31 2016-07-12 Asahi Kasei E-Materials Corporation Substrate for optics having a plurality of dot lines, semiconductor light emitting device. and exposure apparatus
CN102566260A (zh) * 2011-12-30 2012-07-11 西安交通大学 超长光栅尺辊压模具表面图形化的快速加工方法
KR101705958B1 (ko) * 2012-05-14 2017-02-10 아사히 가세이 가부시키가이샤 롤러 몰드의 제작 장치 및 제작 방법
JP6047051B2 (ja) * 2013-03-28 2016-12-21 日立マクセル株式会社 光学素子および光学装置
JP6818479B2 (ja) 2016-09-16 2021-01-20 デクセリアルズ株式会社 原盤の製造方法
US12243832B2 (en) * 2022-04-08 2025-03-04 Nanya Technology Corporation Method for manufacturing semiconductor device structure with overlay marks

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3668600B2 (ja) * 1997-11-07 2005-07-06 大日本スクリーン製造株式会社 画像出力装置
JPH11149642A (ja) * 1997-11-14 1999-06-02 Canon Inc 光記録媒体およびその製造方法
JP4258013B2 (ja) * 2001-08-08 2009-04-30 株式会社オーク製作所 多重露光描画装置および多重露光描画方法
EP1710094B1 (en) * 2004-01-27 2011-10-05 Asahi Kasei Chemicals Corporation Process for producing laser engravable printing substrate
JP2007144995A (ja) * 2005-10-25 2007-06-14 Dainippon Printing Co Ltd 光硬化ナノインプリント用モールド及びその製造方法
JP4559997B2 (ja) * 2006-03-31 2010-10-13 財団法人光産業技術振興協会 偏光板
JP4367442B2 (ja) * 2006-06-23 2009-11-18 ヤマハ株式会社 光ディスク描画方法および光ディスク描画装置
JP2008004243A (ja) * 2006-06-26 2008-01-10 Yamaha Corp 光ディスク描画方法および光ディスク装置並びに光ディスク記録媒体
JP5028892B2 (ja) * 2006-07-18 2012-09-19 コニカミノルタビジネステクノロジーズ株式会社 画像形成装置及びプリントヘッド
KR101220641B1 (ko) * 2008-01-25 2013-01-10 아사히 가세이 가부시키가이샤 심리스 몰드의 제조 방법

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