JP5650166B2 - 粘着シート、電子機器部材積層体及び光学部材積層体 - Google Patents

粘着シート、電子機器部材積層体及び光学部材積層体 Download PDF

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Publication number
JP5650166B2
JP5650166B2 JP2012160179A JP2012160179A JP5650166B2 JP 5650166 B2 JP5650166 B2 JP 5650166B2 JP 2012160179 A JP2012160179 A JP 2012160179A JP 2012160179 A JP2012160179 A JP 2012160179A JP 5650166 B2 JP5650166 B2 JP 5650166B2
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JP
Japan
Prior art keywords
sensitive adhesive
pressure
meth
adhesive sheet
separator
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2012160179A
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English (en)
Japanese (ja)
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JP2014019799A5 (OSRAM
JP2014019799A (ja
Inventor
佐藤　正明
正明 佐藤
副田　義和
義和 副田
和田　博
博 和田
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Nitto Denko Corp
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Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Priority to JP2012160179A priority Critical patent/JP5650166B2/ja
Priority to US13/945,030 priority patent/US20140023861A1/en
Priority to TW102125977A priority patent/TW201406917A/zh
Priority to CN201310306403.4A priority patent/CN103571354B/zh
Priority to KR1020130085177A priority patent/KR102122876B1/ko
Priority to EP13177167.7A priority patent/EP2687570A3/en
Publication of JP2014019799A publication Critical patent/JP2014019799A/ja
Publication of JP2014019799A5 publication Critical patent/JP2014019799A5/ja
Application granted granted Critical
Publication of JP5650166B2 publication Critical patent/JP5650166B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/385—Acrylic polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/40—Adhesives in the form of films or foils characterised by release liners
    • C09J7/401—Adhesives in the form of films or foils characterised by release liners characterised by the release coating composition
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/318—Applications of adhesives in processes or use of adhesives in the form of films or foils for the production of liquid crystal displays
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
    • C09J2301/124—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present on both sides of the carrier, e.g. double-sided adhesive tape
    • C09J2301/1242—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present on both sides of the carrier, e.g. double-sided adhesive tape the opposite adhesive layers being different
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/302—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being pressure-sensitive, i.e. tacky at temperatures inferior to 30°C
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2421/00—Presence of unspecified rubber
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00—Presence of (meth)acrylic polymer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2453/00—Presence of block copolymer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
    • Y10T428/266—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension of base or substrate

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)
JP2012160179A 2012-07-19 2012-07-19 粘着シート、電子機器部材積層体及び光学部材積層体 Expired - Fee Related JP5650166B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2012160179A JP5650166B2 (ja) 2012-07-19 2012-07-19 粘着シート、電子機器部材積層体及び光学部材積層体
US13/945,030 US20140023861A1 (en) 2012-07-19 2013-07-18 Pressure-sensitive adhesive sheet, electric or electronic device member laminate and optical member laminate
CN201310306403.4A CN103571354B (zh) 2012-07-19 2013-07-19 压敏胶粘片、电气或电子装置构件层压物和光学构件层压物
KR1020130085177A KR102122876B1 (ko) 2012-07-19 2013-07-19 점착 시트, 전기 또는 전자 기기 부재 적층체 및 광학 부재 적층체
TW102125977A TW201406917A (zh) 2012-07-19 2013-07-19 感壓黏著片、電器或電子裝置構件積層體及光學構件積層體
EP13177167.7A EP2687570A3 (en) 2012-07-19 2013-07-19 Pressure-Sensitive Adhesive Sheet, Electric or Electronic Device Member Laminate and Optical Member Laminate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012160179A JP5650166B2 (ja) 2012-07-19 2012-07-19 粘着シート、電子機器部材積層体及び光学部材積層体

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2014229392A Division JP6282215B2 (ja) 2014-11-12 2014-11-12 粘着シート、電子機器部材積層体及び光学部材積層体

Publications (3)

Publication Number Publication Date
JP2014019799A JP2014019799A (ja) 2014-02-03
JP2014019799A5 JP2014019799A5 (OSRAM) 2014-10-02
JP5650166B2 true JP5650166B2 (ja) 2015-01-07

Family

ID=48917340

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012160179A Expired - Fee Related JP5650166B2 (ja) 2012-07-19 2012-07-19 粘着シート、電子機器部材積層体及び光学部材積層体

Country Status (6)

Country Link
US (1) US20140023861A1 (OSRAM)
EP (1) EP2687570A3 (OSRAM)
JP (1) JP5650166B2 (OSRAM)
KR (1) KR102122876B1 (OSRAM)
CN (1) CN103571354B (OSRAM)
TW (1) TW201406917A (OSRAM)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106133088B (zh) * 2014-03-31 2022-05-17 琳得科株式会社 双面粘合片及双面粘合片的制造方法
JP6325313B2 (ja) * 2014-03-31 2018-05-16 リンテック株式会社 シート状粘着剤および粘着シート
KR101530591B1 (ko) * 2014-04-07 2015-06-22 율촌화학 주식회사 전사 인쇄를 위한 무 기재 점착 테이프 및 그의 제조방법
CN104085152A (zh) * 2014-07-25 2014-10-08 常熟璟杰进出口有限公司 一种覆铝无纺布
JP2016097562A (ja) * 2014-11-20 2016-05-30 日立化成株式会社 樹脂層付き基板の製造方法、導電層付き基板の製造方法、樹脂層付き基板、導電層付き基板及びタッチパネル。
WO2016084946A1 (ja) * 2014-11-28 2016-06-02 日東電工株式会社 携帯電子機器用粘着シート
JP6679239B2 (ja) * 2014-11-28 2020-04-15 日東電工株式会社 粘着シート
JP6480793B2 (ja) * 2015-04-15 2019-03-13 積水化学工業株式会社 両面粘着テープ
WO2017078026A1 (ja) * 2015-11-06 2017-05-11 リンテック株式会社 剥離剤組成物、剥離シート及び粘着体
CN106908988A (zh) * 2016-01-04 2017-06-30 宁波长阳科技股份有限公司 一种液晶显示器的背光组件
JP6745238B2 (ja) * 2017-03-22 2020-08-26 日本カーバイド工業株式会社 加飾フィルム用粘着剤組成物、加飾フィルム及び加飾成形品
JP6850182B2 (ja) * 2017-04-07 2021-03-31 綜研化学株式会社 粘着剤組成物および粘着シート
US10647102B2 (en) * 2017-07-06 2020-05-12 General Electric Company System and method for removal of a layer
JP7166052B2 (ja) * 2017-11-30 2022-11-07 日東電工株式会社 粘着シート
JP7069066B2 (ja) * 2019-02-27 2022-05-17 リンテック株式会社 繰り返し屈曲ディスプレイ
CN111087524B (zh) * 2019-12-17 2022-11-18 苏州赛伍应用技术股份有限公司 一种聚丙烯酸酯、压敏胶黏剂、压敏胶带、软磁屏蔽片及其制备方法
KR102880443B1 (ko) * 2022-02-09 2025-11-04 주식회사 엘지화학 적층체
CN116254081B (zh) * 2023-01-09 2024-12-17 恩平市盈嘉丰胶粘制品有限公司 一种高导热型电子压敏胶黏剂及其制备方法和使用方法

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5049426B2 (ja) 2000-08-31 2012-10-17 日東電工株式会社 アクリル系粘着剤の製造法
JP4646508B2 (ja) * 2003-10-01 2011-03-09 日東電工株式会社 両面接着テープ又はシートおよびその製造方法
JP3822213B2 (ja) * 2004-06-03 2006-09-13 日東電工株式会社 剥離力調整方法、光学部材用粘着剤層およびその製造方法、ならびに粘着剤付光学部材
JP5265845B2 (ja) * 2005-04-15 2013-08-14 スリーエム イノベイティブ プロパティズ カンパニー 両面粘着テープ
DE102007019131A1 (de) * 2007-04-20 2008-10-23 Tesa Ag Doppelseitiges Haftklebeband
JP5171332B2 (ja) * 2008-03-18 2013-03-27 リンテック株式会社 剥離シート、剥離シート付き偏光板、及び基材レス両面粘着シート
US20110139347A1 (en) * 2008-05-14 2011-06-16 Lg Chem Ltd. Adhesive composition, adhesive sheet, and back grinding method for semiconductor wafer
JP2010155974A (ja) * 2008-12-01 2010-07-15 Nitto Denko Corp アクリル系感圧性接着シート、アクリル系感圧性接着シートの製造方法、及び積層構成
JP5820619B2 (ja) * 2011-01-20 2015-11-24 日東電工株式会社 粘着テープ

Also Published As

Publication number Publication date
KR102122876B1 (ko) 2020-06-15
EP2687570A2 (en) 2014-01-22
KR20140011981A (ko) 2014-01-29
JP2014019799A (ja) 2014-02-03
US20140023861A1 (en) 2014-01-23
CN103571354B (zh) 2018-05-04
TW201406917A (zh) 2014-02-16
EP2687570A3 (en) 2014-04-23
CN103571354A (zh) 2014-02-12

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