JP5639910B2 - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
- Publication number
- JP5639910B2 JP5639910B2 JP2011017534A JP2011017534A JP5639910B2 JP 5639910 B2 JP5639910 B2 JP 5639910B2 JP 2011017534 A JP2011017534 A JP 2011017534A JP 2011017534 A JP2011017534 A JP 2011017534A JP 5639910 B2 JP5639910 B2 JP 5639910B2
- Authority
- JP
- Japan
- Prior art keywords
- wiring
- film
- functional circuit
- layer
- portions
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
- G02F1/13454—Drivers integrated on the active matrix substrate
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
- H10D86/441—Interconnections, e.g. scanning lines
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
- H10D86/60—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs wherein the TFTs are in active matrices
Landscapes
- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Optics & Photonics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- General Physics & Mathematics (AREA)
- Mathematical Physics (AREA)
- Thin Film Transistor (AREA)
- Liquid Crystal (AREA)
- Electroluminescent Light Sources (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Semiconductor Integrated Circuits (AREA)
- Design And Manufacture Of Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011017534A JP5639910B2 (ja) | 2002-12-25 | 2011-01-31 | 半導体装置 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002373491 | 2002-12-25 | ||
| JP2002373491 | 2002-12-25 | ||
| JP2011017534A JP5639910B2 (ja) | 2002-12-25 | 2011-01-31 | 半導体装置 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2005254996A Division JP5084120B2 (ja) | 2002-12-25 | 2005-09-02 | 表示装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2011159974A JP2011159974A (ja) | 2011-08-18 |
| JP2011159974A5 JP2011159974A5 (enExample) | 2012-03-15 |
| JP5639910B2 true JP5639910B2 (ja) | 2014-12-10 |
Family
ID=32708228
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011017534A Expired - Fee Related JP5639910B2 (ja) | 2002-12-25 | 2011-01-31 | 半導体装置 |
Country Status (2)
| Country | Link |
|---|---|
| US (4) | US7408196B2 (enExample) |
| JP (1) | JP5639910B2 (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107405975A (zh) * | 2015-03-23 | 2017-11-28 | 日本发条株式会社 | 稳定杆及其制造方法 |
Families Citing this family (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7408196B2 (en) * | 2002-12-25 | 2008-08-05 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and display device |
| US7557779B2 (en) | 2003-06-13 | 2009-07-07 | Semiconductor Energy Laboratory Co., Ltd. | Display device |
| WO2005004096A1 (ja) * | 2003-07-08 | 2005-01-13 | Semiconductor Energy Laboratory Co., Ltd. | 表示装置およびその駆動方法 |
| US7132751B2 (en) * | 2004-06-22 | 2006-11-07 | Intel Corporation | Memory cell using silicon carbide |
| WO2006028195A1 (en) * | 2004-09-09 | 2006-03-16 | Semiconductor Energy Laboratory Co., Ltd. | Wireless chip |
| TWI267014B (en) * | 2005-02-21 | 2006-11-21 | Au Optronics Corp | Organic light emitting diode display |
| WO2007043602A1 (en) * | 2005-10-14 | 2007-04-19 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and communication system using the semiconductor device |
| JP4144892B2 (ja) * | 2006-08-28 | 2008-09-03 | キヤノン株式会社 | 光電変換装置及び撮像装置 |
| WO2009057444A1 (ja) * | 2007-11-02 | 2009-05-07 | Sharp Kabushiki Kaisha | 回路基板及び表示装置 |
| US7977678B2 (en) | 2007-12-21 | 2011-07-12 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor display device |
| KR101125567B1 (ko) * | 2009-12-24 | 2012-03-22 | 삼성모바일디스플레이주식회사 | 고분자 기판 및 그 제조 방법과 상기 고분자 기판을 포함하는 표시 장치 및 그 제조 방법 |
| JP2011165858A (ja) * | 2010-02-09 | 2011-08-25 | Renesas Electronics Corp | 半導体パッケージ |
| US8779488B2 (en) | 2011-04-15 | 2014-07-15 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor memory device |
| JP6045176B2 (ja) | 2011-04-15 | 2016-12-14 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| JP2016025147A (ja) * | 2014-07-17 | 2016-02-08 | ソニー株式会社 | 電子デバイスおよびその製造方法、並びに電子機器 |
| KR102278334B1 (ko) * | 2014-10-01 | 2021-07-19 | 삼성디스플레이 주식회사 | 유기 발광 표시 장치 |
| KR102377794B1 (ko) * | 2015-07-06 | 2022-03-23 | 엘지전자 주식회사 | 반도체 발광 소자를 이용한 디스플레이 장치 및 이의 제조방법 |
| CN107845663B (zh) * | 2017-10-27 | 2020-12-08 | 武汉天马微电子有限公司 | 一种显示面板及显示装置 |
| US10763323B2 (en) | 2018-06-22 | 2020-09-01 | Apple Inc. | Power and data routing structures for organic light-emitting diode displays |
| CN109309100B (zh) * | 2018-09-29 | 2020-12-29 | 京东方科技集团股份有限公司 | 薄膜晶体管、栅极驱动电路和显示面板 |
Family Cites Families (26)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6340347A (ja) | 1986-08-05 | 1988-02-20 | Mitsubishi Electric Corp | 半導体集積回路装置 |
| JPH0738414B2 (ja) | 1987-01-09 | 1995-04-26 | 株式会社東芝 | 半導体集積回路 |
| JPH01189936A (ja) | 1988-01-26 | 1989-07-31 | Fujitsu Ltd | 集積回路の自動配線方法 |
| JPH0230176A (ja) | 1988-07-19 | 1990-01-31 | Nec Corp | 半導体集積回路 |
| JPH03123076A (ja) | 1989-10-04 | 1991-05-24 | Nec Ic Microcomput Syst Ltd | 半導体集積回路装置 |
| KR940004322B1 (ko) | 1991-09-05 | 1994-05-19 | 삼성전자 주식회사 | 액정표시장치 및 그 제조방법 |
| JPH05226584A (ja) | 1992-02-12 | 1993-09-03 | Yamaha Corp | 集積回路装置 |
| JP3006739B2 (ja) | 1992-04-20 | 2000-02-07 | 松下電器産業株式会社 | 半導体集積回路装置 |
| US5446410A (en) | 1992-04-20 | 1995-08-29 | Matsushita Electric Industrial Co.,Ltd. | Semiconductor integrated circuit |
| TW329500B (en) * | 1995-11-14 | 1998-04-11 | Handotai Energy Kenkyusho Kk | Electro-optical device |
| JPH10107152A (ja) | 1996-09-30 | 1998-04-24 | Yamaha Corp | 集積回路装置とその電源配線形成法 |
| JP2001505682A (ja) * | 1996-10-09 | 2001-04-24 | ペーアーファウ カード ゲームベーハ | スマートカードの製造方法及び製造のための接続配置 |
| TW486581B (en) * | 1998-01-06 | 2002-05-11 | Seiko Epson Corp | Semiconductor device, substrate for electro-optical device, electro-optical device, electronic equipment, and projection display apparatus |
| JP4330676B2 (ja) | 1998-08-17 | 2009-09-16 | 株式会社東芝 | 半導体集積回路 |
| US6724149B2 (en) | 1999-02-24 | 2004-04-20 | Sanyo Electric Co., Ltd. | Emissive display device and electroluminescence display device with uniform luminance |
| JP2001274265A (ja) * | 2000-03-28 | 2001-10-05 | Mitsubishi Electric Corp | 半導体装置 |
| US7088322B2 (en) * | 2000-05-12 | 2006-08-08 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| TW554637B (en) | 2000-05-12 | 2003-09-21 | Semiconductor Energy Lab | Display device and light emitting device |
| US8610645B2 (en) | 2000-05-12 | 2013-12-17 | Semiconductor Energy Laboratory Co., Ltd. | Display device |
| JP2002033456A (ja) | 2000-07-18 | 2002-01-31 | Seiko Epson Corp | 半導体集積回路における容量素子及びその電源配線 |
| US6384727B1 (en) * | 2000-08-02 | 2002-05-07 | Motorola, Inc. | Capacitively powered radio frequency identification device |
| US6828584B2 (en) * | 2001-05-18 | 2004-12-07 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing the same |
| JP4647843B2 (ja) * | 2001-06-28 | 2011-03-09 | 株式会社日立製作所 | 液晶表示装置 |
| GB0130600D0 (en) * | 2001-12-21 | 2002-02-06 | Koninkl Philips Electronics Nv | Active matrix electroluminescent display device |
| JP2004103821A (ja) | 2002-09-10 | 2004-04-02 | Toshiba Corp | 半導体集積回路 |
| US7408196B2 (en) * | 2002-12-25 | 2008-08-05 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and display device |
-
2003
- 2003-12-23 US US10/742,925 patent/US7408196B2/en not_active Expired - Lifetime
-
2008
- 2008-07-16 US US12/173,836 patent/US8058672B2/en not_active Expired - Fee Related
-
2011
- 2011-01-31 JP JP2011017534A patent/JP5639910B2/ja not_active Expired - Fee Related
- 2011-10-20 US US13/277,253 patent/US8227837B2/en not_active Expired - Fee Related
-
2012
- 2012-07-13 US US13/548,481 patent/US8569802B2/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107405975A (zh) * | 2015-03-23 | 2017-11-28 | 日本发条株式会社 | 稳定杆及其制造方法 |
| CN107405975B (zh) * | 2015-03-23 | 2019-12-20 | 日本发条株式会社 | 稳定杆及其制造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| US20080303065A1 (en) | 2008-12-11 |
| US8569802B2 (en) | 2013-10-29 |
| US8058672B2 (en) | 2011-11-15 |
| US20040135175A1 (en) | 2004-07-15 |
| JP2011159974A (ja) | 2011-08-18 |
| US8227837B2 (en) | 2012-07-24 |
| US7408196B2 (en) | 2008-08-05 |
| US20120032181A1 (en) | 2012-02-09 |
| US20120306837A1 (en) | 2012-12-06 |
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