JP5636962B2 - 樹脂組成物 - Google Patents
樹脂組成物 Download PDFInfo
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- JP5636962B2 JP5636962B2 JP2010546670A JP2010546670A JP5636962B2 JP 5636962 B2 JP5636962 B2 JP 5636962B2 JP 2010546670 A JP2010546670 A JP 2010546670A JP 2010546670 A JP2010546670 A JP 2010546670A JP 5636962 B2 JP5636962 B2 JP 5636962B2
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- 229910003475 inorganic filler Inorganic materials 0.000 claims description 21
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 13
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- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 claims description 2
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- 229910052698 phosphorus Inorganic materials 0.000 description 10
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- WSFQLUVWDKCYSW-UHFFFAOYSA-M sodium;2-hydroxy-3-morpholin-4-ylpropane-1-sulfonate Chemical compound [Na+].[O-]S(=O)(=O)CC(O)CN1CCOCC1 WSFQLUVWDKCYSW-UHFFFAOYSA-M 0.000 description 9
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- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 7
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- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 6
- NIHNNTQXNPWCJQ-UHFFFAOYSA-N o-biphenylenemethane Natural products C1=CC=C2CC3=CC=CC=C3C2=C1 NIHNNTQXNPWCJQ-UHFFFAOYSA-N 0.000 description 6
- 230000001681 protective effect Effects 0.000 description 6
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- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical compound C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 5
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- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 4
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- KAKZBPTYRLMSJV-UHFFFAOYSA-N butadiene group Chemical group C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 4
- FCEOGYWNOSBEPV-FDGPNNRMSA-N cobalt;(z)-4-hydroxypent-3-en-2-one Chemical compound [Co].C\C(O)=C\C(C)=O.C\C(O)=C\C(C)=O FCEOGYWNOSBEPV-FDGPNNRMSA-N 0.000 description 4
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- INZDTEICWPZYJM-UHFFFAOYSA-N 1-(chloromethyl)-4-[4-(chloromethyl)phenyl]benzene Chemical group C1=CC(CCl)=CC=C1C1=CC=C(CCl)C=C1 INZDTEICWPZYJM-UHFFFAOYSA-N 0.000 description 3
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- 238000002156 mixing Methods 0.000 description 1
- GEMHFKXPOCTAIP-UHFFFAOYSA-N n,n-dimethyl-n'-phenylcarbamimidoyl chloride Chemical compound CN(C)C(Cl)=NC1=CC=CC=C1 GEMHFKXPOCTAIP-UHFFFAOYSA-N 0.000 description 1
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- 239000010452 phosphate Substances 0.000 description 1
- IEQIEDJGQAUEQZ-UHFFFAOYSA-N phthalocyanine Chemical compound N1C(N=C2C3=CC=CC=C3C(N=C3C4=CC=CC=C4C(=N4)N3)=N2)=C(C=CC=C2)C2=C1N=C1C2=CC=CC=C2C4=N1 IEQIEDJGQAUEQZ-UHFFFAOYSA-N 0.000 description 1
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- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 1
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- NTTOTNSKUYCDAV-UHFFFAOYSA-N potassium hydride Chemical compound [KH] NTTOTNSKUYCDAV-UHFFFAOYSA-N 0.000 description 1
- 229910000105 potassium hydride Inorganic materials 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 description 1
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 1
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- VEALVRVVWBQVSL-UHFFFAOYSA-N strontium titanate Chemical compound [Sr+2].[O-][Ti]([O-])=O VEALVRVVWBQVSL-UHFFFAOYSA-N 0.000 description 1
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- 125000002298 terpene group Chemical group 0.000 description 1
- AYEKOFBPNLCAJY-UHFFFAOYSA-O thiamine pyrophosphate Chemical compound CC1=C(CCOP(O)(=O)OP(O)(O)=O)SC=[N+]1CC1=CN=C(C)N=C1N AYEKOFBPNLCAJY-UHFFFAOYSA-O 0.000 description 1
- 239000002562 thickening agent Substances 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
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- 150000003751 zinc Chemical class 0.000 description 1
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
- C08J5/249—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs characterised by the additives used in the prepolymer mixture
-
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
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| JP5672694B2 (ja) * | 2009-12-16 | 2015-02-18 | 住友ベークライト株式会社 | 樹脂シート、プリント配線板、および半導体装置 |
| CN102942684B (zh) * | 2012-11-08 | 2015-06-17 | 广东生益科技股份有限公司 | 一种热固性氰酸酯及其应用 |
| JP6307236B2 (ja) * | 2013-09-30 | 2018-04-04 | 新日鉄住金化学株式会社 | 硬化性樹脂組成物、硬化物、電気・電子部品及び回路基板材料 |
| EP3077449B1 (en) * | 2013-12-04 | 2017-10-18 | Lonza Ltd | Method for preparing fiber-reinforced parts based on cyanate ester/epoxy blends |
| CN104804185B (zh) * | 2015-04-24 | 2017-05-17 | 黑龙江省科学院石油化学研究院 | 用于制备胶膜的氰酸酯预聚体的制备方法 |
| JP7427455B2 (ja) * | 2015-09-18 | 2024-02-05 | 味の素株式会社 | 接着フィルム、プリント配線板及び半導体装置 |
| JP6651760B2 (ja) * | 2015-09-18 | 2020-02-19 | 味の素株式会社 | プリント配線板の製造方法 |
| KR102257926B1 (ko) | 2018-09-20 | 2021-05-28 | 주식회사 엘지화학 | 다층인쇄회로기판, 이의 제조방법 및 이를 이용한 반도체 장치 |
| DE102019204344A1 (de) * | 2019-03-28 | 2020-10-01 | Tesa Se | Wiederablösbarer Haftklebestreifen |
| JP7115445B2 (ja) * | 2019-09-03 | 2022-08-09 | 信越化学工業株式会社 | マレイミド樹脂フィルム及びマレイミド樹脂フィルム用組成物 |
| JP7452560B2 (ja) * | 2020-01-22 | 2024-03-19 | 味の素株式会社 | プリント配線板の製造方法 |
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| JPS62223230A (ja) * | 1986-02-11 | 1987-10-01 | ザ ダウ ケミカル カンパニ− | エチレン性不飽和単量体およびポリアリ−ルシアネ−トエステル成分を含む硬化性組成物 |
| JPH01503783A (ja) * | 1986-08-15 | 1989-12-21 | ザ ダウ ケミカル カンパニー | 多価ハロゲン化フェノール化合物のビニルベンジルエーテル |
| JPH0299515A (ja) * | 1988-10-06 | 1990-04-11 | Nippon Oil Co Ltd | 熱硬化性樹脂組成物 |
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| JP2005244150A (ja) * | 2004-01-28 | 2005-09-08 | Ajinomoto Co Inc | 樹脂組成物、それを用いた接着フィルム及び多層プリント配線板 |
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| JP3231814B2 (ja) * | 1991-07-12 | 2001-11-26 | ミネソタ マイニング アンド マニュファクチャリング カンパニー | 異方性導電膜 |
| AU2003241778A1 (en) | 2002-05-27 | 2003-12-12 | Ajinomoto Co., Inc. | Adhesive film and prepreg |
| TW200628536A (en) | 2004-11-30 | 2006-08-16 | Ajinomoto Kk | Curable resin composition |
| JP2007051226A (ja) * | 2005-08-18 | 2007-03-01 | Ajinomoto Co Inc | 低誘電率樹脂組成物 |
| TWI455988B (zh) * | 2006-10-13 | 2014-10-11 | Ajinomoto Kk | 樹脂組成物 |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62223230A (ja) * | 1986-02-11 | 1987-10-01 | ザ ダウ ケミカル カンパニ− | エチレン性不飽和単量体およびポリアリ−ルシアネ−トエステル成分を含む硬化性組成物 |
| JPH01503783A (ja) * | 1986-08-15 | 1989-12-21 | ザ ダウ ケミカル カンパニー | 多価ハロゲン化フェノール化合物のビニルベンジルエーテル |
| JPH0299515A (ja) * | 1988-10-06 | 1990-04-11 | Nippon Oil Co Ltd | 熱硬化性樹脂組成物 |
| JPH11263940A (ja) * | 1998-03-17 | 1999-09-28 | Hitachi Chem Co Ltd | 印刷配線板用変性シアネートエステル樹脂ワニス及びその製造方法 |
| JP2005244150A (ja) * | 2004-01-28 | 2005-09-08 | Ajinomoto Co Inc | 樹脂組成物、それを用いた接着フィルム及び多層プリント配線板 |
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| WO2010082658A1 (ja) | 2010-07-22 |
| TW201038647A (en) | 2010-11-01 |
| KR20110117158A (ko) | 2011-10-26 |
| KR101694138B1 (ko) | 2017-01-09 |
| JPWO2010082658A1 (ja) | 2012-07-05 |
| TWI471369B (zh) | 2015-02-01 |
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