JP5623507B2 - スピントルクの切換を補助する層を有する、スピントルクの切換を持つ磁気積層体 - Google Patents

スピントルクの切換を補助する層を有する、スピントルクの切換を持つ磁気積層体 Download PDF

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Publication number
JP5623507B2
JP5623507B2 JP2012508575A JP2012508575A JP5623507B2 JP 5623507 B2 JP5623507 B2 JP 5623507B2 JP 2012508575 A JP2012508575 A JP 2012508575A JP 2012508575 A JP2012508575 A JP 2012508575A JP 5623507 B2 JP5623507 B2 JP 5623507B2
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layer
magnetic
assist
plane
free
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Japanese (ja)
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JP2012525710A (ja
JP2012525710A5 (https=
Inventor
チョン，イェンカイ
シー，ハイウェン
チョン，ウォンジュン
フォン，シュエビン
ルー，シャオファ
ガオ，チョン
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Seagate Technology LLC
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Seagate Technology LLC
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N50/00—Galvanomagnetic devices
    • H10N50/80—Constructional details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F10/00—Thin magnetic films, e.g. of one-domain structure
    • H01F10/32—Spin-exchange-coupled multilayers, e.g. nanostructured superlattices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y25/00—Nanomagnetism, e.g. magnetoimpedance, anisotropic magnetoresistance, giant magnetoresistance or tunneling magnetoresistance
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/02—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements
    • G11C11/16—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using elements in which the storage effect is based on magnetic spin effect
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/02—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements
    • G11C11/16—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using elements in which the storage effect is based on magnetic spin effect
    • G11C11/161—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using elements in which the storage effect is based on magnetic spin effect details concerning the memory cell structure, e.g. the layers of the ferromagnetic memory cell
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F10/00—Thin magnetic films, e.g. of one-domain structure
    • H01F10/32—Spin-exchange-coupled multilayers, e.g. nanostructured superlattices
    • H01F10/324—Exchange coupling of magnetic film pairs via a very thin non-magnetic spacer, e.g. by exchange with conduction electrons of the spacer
    • H01F10/3254—Exchange coupling of magnetic film pairs via a very thin non-magnetic spacer, e.g. by exchange with conduction electrons of the spacer the spacer being semiconducting or insulating, e.g. for spin tunnel junction [STJ]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F10/00—Thin magnetic films, e.g. of one-domain structure
    • H01F10/32—Spin-exchange-coupled multilayers, e.g. nanostructured superlattices
    • H01F10/324—Exchange coupling of magnetic film pairs via a very thin non-magnetic spacer, e.g. by exchange with conduction electrons of the spacer
    • H01F10/3286—Spin-exchange coupled multilayers having at least one layer with perpendicular magnetic anisotropy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F10/00—Thin magnetic films, e.g. of one-domain structure
    • H01F10/32—Spin-exchange-coupled multilayers, e.g. nanostructured superlattices
    • H01F10/324—Exchange coupling of magnetic film pairs via a very thin non-magnetic spacer, e.g. by exchange with conduction electrons of the spacer
    • H01F10/329—Spin-exchange coupled multilayers wherein the magnetisation of the free layer is switched by a spin-polarised current, e.g. spin torque effect
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F10/00—Thin magnetic films, e.g. of one-domain structure
    • H01F10/32—Spin-exchange-coupled multilayers, e.g. nanostructured superlattices
    • H01F10/324—Exchange coupling of magnetic film pairs via a very thin non-magnetic spacer, e.g. by exchange with conduction electrons of the spacer
    • H01F10/3295—Spin-exchange coupled multilayers wherein the magnetic pinned or free layers are laminated without anti-parallel coupling within the pinned and free layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N50/00—Galvanomagnetic devices
    • H10N50/10—Magnetoresistive devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F10/00—Thin magnetic films, e.g. of one-domain structure
    • H01F10/32—Spin-exchange-coupled multilayers, e.g. nanostructured superlattices
    • H01F10/324—Exchange coupling of magnetic film pairs via a very thin non-magnetic spacer, e.g. by exchange with conduction electrons of the spacer
    • H01F10/3263—Exchange coupling of magnetic film pairs via a very thin non-magnetic spacer, e.g. by exchange with conduction electrons of the spacer the exchange coupling being symmetric, e.g. for dual spin valve, e.g. NiO/Co/Cu/Co/Cu/Co/NiO

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Power Engineering (AREA)
  • Nanotechnology (AREA)
  • Computer Hardware Design (AREA)
  • Mram Or Spin Memory Techniques (AREA)
  • Hall/Mr Elements (AREA)
  • Semiconductor Memories (AREA)
JP2012508575A 2009-04-28 2010-04-27 スピントルクの切換を補助する層を有する、スピントルクの切換を持つ磁気積層体 Active JP5623507B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/431,162 US7936598B2 (en) 2009-04-28 2009-04-28 Magnetic stack having assist layer
US12/431,162 2009-04-28
PCT/US2010/032483 WO2010126854A1 (en) 2009-04-28 2010-04-27 Magnetic stack with spin torque switching having a layer assisting said switching

Publications (3)

Publication Number Publication Date
JP2012525710A JP2012525710A (ja) 2012-10-22
JP2012525710A5 JP2012525710A5 (https=) 2013-03-07
JP5623507B2 true JP5623507B2 (ja) 2014-11-12

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JP2012508575A Active JP5623507B2 (ja) 2009-04-28 2010-04-27 スピントルクの切換を補助する層を有する、スピントルクの切換を持つ磁気積層体

Country Status (5)

Country Link
US (3) US7936598B2 (https=)
JP (1) JP5623507B2 (https=)
KR (1) KR101405854B1 (https=)
CN (1) CN102414756B (https=)
WO (1) WO2010126854A1 (https=)

Families Citing this family (156)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8755222B2 (en) 2003-08-19 2014-06-17 New York University Bipolar spin-transfer switching
US7911832B2 (en) 2003-08-19 2011-03-22 New York University High speed low power magnetic devices based on current induced spin-momentum transfer
FR2924261A1 (fr) * 2007-11-26 2009-05-29 Commissariat Energie Atomique Support d'enregistrement magnetique
US8279661B2 (en) * 2007-12-19 2012-10-02 Fuji Electric Co., Ltd. Magnetic memory element, driving method for the same, and nonvolatile storage device
US7940600B2 (en) 2008-12-02 2011-05-10 Seagate Technology Llc Non-volatile memory with stray magnetic field compensation
US7936598B2 (en) * 2009-04-28 2011-05-03 Seagate Technology Magnetic stack having assist layer
WO2011121777A1 (ja) * 2010-03-31 2011-10-06 株式会社 東芝 磁気抵抗素子及び磁気メモリ
US8604572B2 (en) * 2010-06-14 2013-12-10 Regents Of The University Of Minnesota Magnetic tunnel junction device
US8772886B2 (en) 2010-07-26 2014-07-08 Avalanche Technology, Inc. Spin transfer torque magnetic random access memory (STTMRAM) having graded synthetic free layer
JP5786341B2 (ja) * 2010-09-06 2015-09-30 ソニー株式会社 記憶素子、メモリ装置
US8565010B2 (en) * 2011-02-16 2013-10-22 Avalanche Technology, Inc. Magnetic random access memory with field compensating layer and multi-level cell
FR2966636B1 (fr) * 2010-10-26 2012-12-14 Centre Nat Rech Scient Element magnetique inscriptible
US20120104522A1 (en) * 2010-11-01 2012-05-03 Seagate Technology Llc Magnetic tunnel junction cells having perpendicular anisotropy and enhancement layer
US8399941B2 (en) * 2010-11-05 2013-03-19 Grandis, Inc. Magnetic junction elements having an easy cone anisotropy and a magnetic memory using such magnetic junction elements
KR101463948B1 (ko) * 2010-11-08 2014-11-27 삼성전자주식회사 자기 기억 소자
US8508973B2 (en) 2010-11-16 2013-08-13 Seagate Technology Llc Method of switching out-of-plane magnetic tunnel junction cells
US8274811B2 (en) * 2010-11-22 2012-09-25 Headway Technologies, Inc. Assisting FGL oscillations with perpendicular anisotropy for MAMR
US8406045B1 (en) * 2011-01-19 2013-03-26 Grandis Inc. Three terminal magnetic element
US9196332B2 (en) * 2011-02-16 2015-11-24 Avalanche Technology, Inc. Perpendicular magnetic tunnel junction (pMTJ) with in-plane magneto-static switching-enhancing layer
US8456894B2 (en) 2011-05-03 2013-06-04 International Business Machines Corporation Noncontact writing of nanometer scale magnetic bits using heat flow induced spin torque effect
US8456895B2 (en) * 2011-05-03 2013-06-04 International Business Machines Corporation Magnonic magnetic random access memory device
US8754491B2 (en) 2011-05-03 2014-06-17 International Business Machines Corporation Spin torque MRAM using bidirectional magnonic writing
JP2012238631A (ja) * 2011-05-10 2012-12-06 Sony Corp 記憶素子、記憶装置
CN103563000B (zh) 2011-05-19 2016-12-07 加利福尼亚大学董事会 电压控制的磁各向异性（vcma）开关和电磁存储器（meram）
US9007818B2 (en) 2012-03-22 2015-04-14 Micron Technology, Inc. Memory cells, semiconductor device structures, systems including such cells, and methods of fabrication
US20130307097A1 (en) * 2012-05-15 2013-11-21 Ge Yi Magnetoresistive random access memory cell design
US9054030B2 (en) 2012-06-19 2015-06-09 Micron Technology, Inc. Memory cells, semiconductor device structures, memory systems, and methods of fabrication
US8923038B2 (en) 2012-06-19 2014-12-30 Micron Technology, Inc. Memory cells, semiconductor device structures, memory systems, and methods of fabrication
WO2014022304A1 (en) 2012-07-30 2014-02-06 The Regents Of The University Of California Multiple-bits-per-cell voltage-controlled magnetic memory
US9231191B2 (en) * 2012-08-20 2016-01-05 Industrial Technology Research Institute Magnetic tunnel junction device and method of making same
US8754500B2 (en) * 2012-08-29 2014-06-17 International Business Machines Corporation Plated lamination structures for integrated magnetic devices
KR101266791B1 (ko) * 2012-09-21 2013-05-27 고려대학교 산학협력단 면내 전류와 전기장을 이용한 자기메모리 소자
KR101266792B1 (ko) * 2012-09-21 2013-05-27 고려대학교 산학협력단 면내 전류와 전기장을 이용한 수평형 자기메모리 소자
US8773821B2 (en) * 2012-10-05 2014-07-08 Nve Corporation Magnetoresistive-based mixed anisotropy high field sensor
US9082950B2 (en) 2012-10-17 2015-07-14 New York University Increased magnetoresistance in an inverted orthogonal spin transfer layer stack
US9082888B2 (en) 2012-10-17 2015-07-14 New York University Inverted orthogonal spin transfer layer stack
US9379315B2 (en) 2013-03-12 2016-06-28 Micron Technology, Inc. Memory cells, methods of fabrication, semiconductor device structures, and memory systems
US8982613B2 (en) 2013-06-17 2015-03-17 New York University Scalable orthogonal spin transfer magnetic random access memory devices with reduced write error rates
US9368714B2 (en) 2013-07-01 2016-06-14 Micron Technology, Inc. Memory cells, methods of operation and fabrication, semiconductor device structures, and memory systems
US9466787B2 (en) 2013-07-23 2016-10-11 Micron Technology, Inc. Memory cells, methods of fabrication, semiconductor device structures, memory systems, and electronic systems
ES2658984T3 (es) * 2013-09-05 2018-03-13 Deutsches Elektronen-Synchrotron Desy Método de producción de un dispositivo magneto-electrónico multicapa y dispositivo magneto-electrónico
US9461242B2 (en) 2013-09-13 2016-10-04 Micron Technology, Inc. Magnetic memory cells, methods of fabrication, semiconductor devices, memory systems, and electronic systems
US9608197B2 (en) 2013-09-18 2017-03-28 Micron Technology, Inc. Memory cells, methods of fabrication, and semiconductor devices
US9306155B2 (en) 2013-11-11 2016-04-05 Samsung Electronics Co., Ltd. Method and system for providing a bulk perpendicular magnetic anisotropy free layer in a perpendicular magnetic junction usable in spin transfer torque magnetic random access memory applications
US10454024B2 (en) 2014-02-28 2019-10-22 Micron Technology, Inc. Memory cells, methods of fabrication, and memory devices
US9344345B2 (en) * 2014-03-19 2016-05-17 Micron Technology, Inc. Memory cells having a self-aligning polarizer
US9281466B2 (en) 2014-04-09 2016-03-08 Micron Technology, Inc. Memory cells, semiconductor structures, semiconductor devices, and methods of fabrication
US9269888B2 (en) 2014-04-18 2016-02-23 Micron Technology, Inc. Memory cells, methods of fabrication, and semiconductor devices
US9336797B2 (en) * 2014-05-29 2016-05-10 HGST Netherlands B.V. Extended spin torque oscillator
US9792971B2 (en) 2014-07-02 2017-10-17 Samsung Electronics Co., Ltd. Method and system for providing magnetic junctions with rare earth-transition metal layers
US9263667B1 (en) 2014-07-25 2016-02-16 Spin Transfer Technologies, Inc. Method for manufacturing MTJ memory device
JP6168578B2 (ja) * 2014-08-08 2017-07-26 国立大学法人東北大学 磁気抵抗効果素子、及び磁気メモリ装置
US9337412B2 (en) * 2014-09-22 2016-05-10 Spin Transfer Technologies, Inc. Magnetic tunnel junction structure for MRAM device
US9349945B2 (en) 2014-10-16 2016-05-24 Micron Technology, Inc. Memory cells, semiconductor devices, and methods of fabrication
US9768377B2 (en) 2014-12-02 2017-09-19 Micron Technology, Inc. Magnetic cell structures, and methods of fabrication
US10439131B2 (en) 2015-01-15 2019-10-08 Micron Technology, Inc. Methods of forming semiconductor devices including tunnel barrier materials
US9728712B2 (en) 2015-04-21 2017-08-08 Spin Transfer Technologies, Inc. Spin transfer torque structure for MRAM devices having a spin current injection capping layer
US10468590B2 (en) 2015-04-21 2019-11-05 Spin Memory, Inc. High annealing temperature perpendicular magnetic anisotropy structure for magnetic random access memory
US9853206B2 (en) 2015-06-16 2017-12-26 Spin Transfer Technologies, Inc. Precessional spin current structure for MRAM
US9773974B2 (en) 2015-07-30 2017-09-26 Spin Transfer Technologies, Inc. Polishing stop layer(s) for processing arrays of semiconductor elements
US10163479B2 (en) 2015-08-14 2018-12-25 Spin Transfer Technologies, Inc. Method and apparatus for bipolar memory write-verify
US20170077387A1 (en) * 2015-09-16 2017-03-16 Qualcomm Incorporated Magnetic tunnel junction (mtj) devices particularly suited for efficient spin-torque-transfer (stt) magnetic random access memory (mram) (stt mram)
US10134808B2 (en) 2015-11-02 2018-11-20 Qualcomm Incorporated Magnetic tunnel junction (MTJ) devices with heterogeneous free layer structure, particularly suited for spin-torque-transfer (STT) magnetic random access memory (MRAM) (STT MRAM)
JP6806375B2 (ja) 2015-11-18 2021-01-06 国立大学法人東北大学 磁気トンネル接合素子及び磁気メモリ
KR102482373B1 (ko) 2015-11-24 2022-12-29 삼성전자주식회사 자기 저항 메모리 장치 및 그 제조 방법
US9741926B1 (en) 2016-01-28 2017-08-22 Spin Transfer Technologies, Inc. Memory cell having magnetic tunnel junction and thermal stability enhancement layer
US12262644B2 (en) * 2016-07-29 2025-03-25 Tdk Corporation Spin current magnetization reversal element, element assembly, and method for producing spin current magnetization reversal element
US10418545B2 (en) 2016-07-29 2019-09-17 Tdk Corporation Spin current magnetization reversal element, element assembly, and method for producing spin current magnetization reversal element
US10446210B2 (en) 2016-09-27 2019-10-15 Spin Memory, Inc. Memory instruction pipeline with a pre-read stage for a write operation for reducing power consumption in a memory device that uses dynamic redundancy registers
US11119910B2 (en) 2016-09-27 2021-09-14 Spin Memory, Inc. Heuristics for selecting subsegments for entry in and entry out operations in an error cache system with coarse and fine grain segments
US11151042B2 (en) 2016-09-27 2021-10-19 Integrated Silicon Solution, (Cayman) Inc. Error cache segmentation for power reduction
US10818331B2 (en) 2016-09-27 2020-10-27 Spin Memory, Inc. Multi-chip module for MRAM devices with levels of dynamic redundancy registers
US10460781B2 (en) 2016-09-27 2019-10-29 Spin Memory, Inc. Memory device with a dual Y-multiplexer structure for performing two simultaneous operations on the same row of a memory bank
US10366774B2 (en) 2016-09-27 2019-07-30 Spin Memory, Inc. Device with dynamic redundancy registers
US10628316B2 (en) 2016-09-27 2020-04-21 Spin Memory, Inc. Memory device with a plurality of memory banks where each memory bank is associated with a corresponding memory instruction pipeline and a dynamic redundancy register
US11119936B2 (en) 2016-09-27 2021-09-14 Spin Memory, Inc. Error cache system with coarse and fine segments for power optimization
US10991410B2 (en) 2016-09-27 2021-04-27 Spin Memory, Inc. Bi-polar write scheme
US10437723B2 (en) 2016-09-27 2019-10-08 Spin Memory, Inc. Method of flushing the contents of a dynamic redundancy register to a secure storage area during a power down in a memory device
US10360964B2 (en) 2016-09-27 2019-07-23 Spin Memory, Inc. Method of writing contents in memory during a power up sequence using a dynamic redundancy register in a memory device
US10546625B2 (en) 2016-09-27 2020-01-28 Spin Memory, Inc. Method of optimizing write voltage based on error buffer occupancy
US10437491B2 (en) 2016-09-27 2019-10-08 Spin Memory, Inc. Method of processing incomplete memory operations in a memory device during a power up sequence and a power down sequence using a dynamic redundancy register
KR101998268B1 (ko) 2016-10-21 2019-07-11 한국과학기술원 반도체 소자
CN109891613B (zh) * 2016-10-21 2023-09-19 韩国科学技术院 半导体器件和半导体逻辑器件
US11276815B2 (en) 2016-10-27 2022-03-15 Tdk Corporation Spin-orbit torque type magnetization reversal element, magnetic memory, and high frequency magnetic device
US10319901B2 (en) 2016-10-27 2019-06-11 Tdk Corporation Spin-orbit torque type magnetization reversal element, magnetic memory, and high frequency magnetic device
US10439130B2 (en) 2016-10-27 2019-10-08 Tdk Corporation Spin-orbit torque type magnetoresistance effect element, and method for producing spin-orbit torque type magnetoresistance effect element
US10079337B2 (en) * 2017-01-11 2018-09-18 International Business Machines Corporation Double magnetic tunnel junction with dynamic reference layer
US10665777B2 (en) 2017-02-28 2020-05-26 Spin Memory, Inc. Precessional spin current structure with non-magnetic insertion layer for MRAM
US10672976B2 (en) 2017-02-28 2020-06-02 Spin Memory, Inc. Precessional spin current structure with high in-plane magnetization for MRAM
US10032978B1 (en) 2017-06-27 2018-07-24 Spin Transfer Technologies, Inc. MRAM with reduced stray magnetic fields
US10481976B2 (en) 2017-10-24 2019-11-19 Spin Memory, Inc. Forcing bits as bad to widen the window between the distributions of acceptable high and low resistive bits thereby lowering the margin and increasing the speed of the sense amplifiers
US10529439B2 (en) 2017-10-24 2020-01-07 Spin Memory, Inc. On-the-fly bit failure detection and bit redundancy remapping techniques to correct for fixed bit defects
US10489245B2 (en) 2017-10-24 2019-11-26 Spin Memory, Inc. Forcing stuck bits, waterfall bits, shunt bits and low TMR bits to short during testing and using on-the-fly bit failure detection and bit redundancy remapping techniques to correct them
US10656994B2 (en) 2017-10-24 2020-05-19 Spin Memory, Inc. Over-voltage write operation of tunnel magnet-resistance (“TMR”) memory device and correcting failure bits therefrom by using on-the-fly bit failure detection and bit redundancy remapping techniques
US10679685B2 (en) 2017-12-27 2020-06-09 Spin Memory, Inc. Shared bit line array architecture for magnetoresistive memory
US10395712B2 (en) 2017-12-28 2019-08-27 Spin Memory, Inc. Memory array with horizontal source line and sacrificial bitline per virtual source
US10891997B2 (en) 2017-12-28 2021-01-12 Spin Memory, Inc. Memory array with horizontal source line and a virtual source line
US10424726B2 (en) 2017-12-28 2019-09-24 Spin Memory, Inc. Process for improving photoresist pillar adhesion during MRAM fabrication
US10395711B2 (en) 2017-12-28 2019-08-27 Spin Memory, Inc. Perpendicular source and bit lines for an MRAM array
US10971293B2 (en) * 2017-12-28 2021-04-06 Tdk Corporation Spin-orbit-torque magnetization rotational element, spin-orbit-torque magnetoresistance effect element, and spin-orbit-torque magnetization rotational element manufacturing method
US10516094B2 (en) 2017-12-28 2019-12-24 Spin Memory, Inc. Process for creating dense pillars using multiple exposures for MRAM fabrication
US10360962B1 (en) 2017-12-28 2019-07-23 Spin Memory, Inc. Memory array with individually trimmable sense amplifiers
US10811594B2 (en) 2017-12-28 2020-10-20 Spin Memory, Inc. Process for hard mask development for MRAM pillar formation using photolithography
US10199083B1 (en) 2017-12-29 2019-02-05 Spin Transfer Technologies, Inc. Three-terminal MRAM with ac write-assist for low read disturb
US10840436B2 (en) 2017-12-29 2020-11-17 Spin Memory, Inc. Perpendicular magnetic anisotropy interface tunnel junction devices and methods of manufacture
US10840439B2 (en) 2017-12-29 2020-11-17 Spin Memory, Inc. Magnetic tunnel junction (MTJ) fabrication methods and systems
US10270027B1 (en) 2017-12-29 2019-04-23 Spin Memory, Inc. Self-generating AC current assist in orthogonal STT-MRAM
US10424723B2 (en) 2017-12-29 2019-09-24 Spin Memory, Inc. Magnetic tunnel junction devices including an optimization layer
US10784439B2 (en) 2017-12-29 2020-09-22 Spin Memory, Inc. Precessional spin current magnetic tunnel junction devices and methods of manufacture
US10236047B1 (en) 2017-12-29 2019-03-19 Spin Memory, Inc. Shared oscillator (STNO) for MRAM array write-assist in orthogonal STT-MRAM
US10360961B1 (en) 2017-12-29 2019-07-23 Spin Memory, Inc. AC current pre-charge write-assist in orthogonal STT-MRAM
US10236048B1 (en) 2017-12-29 2019-03-19 Spin Memory, Inc. AC current write-assist in orthogonal STT-MRAM
US10367139B2 (en) 2017-12-29 2019-07-30 Spin Memory, Inc. Methods of manufacturing magnetic tunnel junction devices
US10886330B2 (en) 2017-12-29 2021-01-05 Spin Memory, Inc. Memory device having overlapping magnetic tunnel junctions in compliance with a reference pitch
US10546624B2 (en) 2017-12-29 2020-01-28 Spin Memory, Inc. Multi-port random access memory
US10319900B1 (en) 2017-12-30 2019-06-11 Spin Memory, Inc. Perpendicular magnetic tunnel junction device with precessional spin current layer having a modulated moment density
US10236439B1 (en) 2017-12-30 2019-03-19 Spin Memory, Inc. Switching and stability control for perpendicular magnetic tunnel junction device
US10229724B1 (en) 2017-12-30 2019-03-12 Spin Memory, Inc. Microwave write-assist in series-interconnected orthogonal STT-MRAM devices
US10141499B1 (en) 2017-12-30 2018-11-27 Spin Transfer Technologies, Inc. Perpendicular magnetic tunnel junction device with offset precessional spin current layer
US10255962B1 (en) 2017-12-30 2019-04-09 Spin Memory, Inc. Microwave write-assist in orthogonal STT-MRAM
US10339993B1 (en) 2017-12-30 2019-07-02 Spin Memory, Inc. Perpendicular magnetic tunnel junction device with skyrmionic assist layers for free layer switching
US10468588B2 (en) 2018-01-05 2019-11-05 Spin Memory, Inc. Perpendicular magnetic tunnel junction device with skyrmionic enhancement layers for the precessional spin current magnetic layer
US10438995B2 (en) 2018-01-08 2019-10-08 Spin Memory, Inc. Devices including magnetic tunnel junctions integrated with selectors
CN108267698B (zh) * 2018-01-08 2020-07-14 上海交通大学 一种提高层叠复合磁传感器灵敏度的方法
US10438996B2 (en) 2018-01-08 2019-10-08 Spin Memory, Inc. Methods of fabricating magnetic tunnel junctions integrated with selectors
US10446744B2 (en) 2018-03-08 2019-10-15 Spin Memory, Inc. Magnetic tunnel junction wafer adaptor used in magnetic annealing furnace and method of using the same
US10388861B1 (en) 2018-03-08 2019-08-20 Spin Memory, Inc. Magnetic tunnel junction wafer adaptor used in magnetic annealing furnace and method of using the same
US10734573B2 (en) 2018-03-23 2020-08-04 Spin Memory, Inc. Three-dimensional arrays with magnetic tunnel junction devices including an annular discontinued free magnetic layer and a planar reference magnetic layer
US11107978B2 (en) 2018-03-23 2021-08-31 Spin Memory, Inc. Methods of manufacturing three-dimensional arrays with MTJ devices including a free magnetic trench layer and a planar reference magnetic layer
US10784437B2 (en) 2018-03-23 2020-09-22 Spin Memory, Inc. Three-dimensional arrays with MTJ devices including a free magnetic trench layer and a planar reference magnetic layer
US11107974B2 (en) 2018-03-23 2021-08-31 Spin Memory, Inc. Magnetic tunnel junction devices including a free magnetic trench layer and a planar reference magnetic layer
US10411185B1 (en) 2018-05-30 2019-09-10 Spin Memory, Inc. Process for creating a high density magnetic tunnel junction array test platform
US10692569B2 (en) 2018-07-06 2020-06-23 Spin Memory, Inc. Read-out techniques for multi-bit cells
US10559338B2 (en) 2018-07-06 2020-02-11 Spin Memory, Inc. Multi-bit cell read-out techniques
US10600478B2 (en) 2018-07-06 2020-03-24 Spin Memory, Inc. Multi-bit cell read-out techniques for MRAM cells with mixed pinned magnetization orientations
US10593396B2 (en) 2018-07-06 2020-03-17 Spin Memory, Inc. Multi-bit cell read-out techniques for MRAM cells with mixed pinned magnetization orientations
US10650875B2 (en) 2018-08-21 2020-05-12 Spin Memory, Inc. System for a wide temperature range nonvolatile memory
US10699761B2 (en) 2018-09-18 2020-06-30 Spin Memory, Inc. Word line decoder memory architecture
US10971680B2 (en) 2018-10-01 2021-04-06 Spin Memory, Inc. Multi terminal device stack formation methods
US11621293B2 (en) 2018-10-01 2023-04-04 Integrated Silicon Solution, (Cayman) Inc. Multi terminal device stack systems and methods
US10580827B1 (en) 2018-11-16 2020-03-03 Spin Memory, Inc. Adjustable stabilizer/polarizer method for MRAM with enhanced stability and efficient switching
KR102698784B1 (ko) * 2018-11-19 2024-08-27 삼성전자주식회사 자기 기억 소자
US10726892B2 (en) * 2018-12-06 2020-07-28 Sandisk Technologies Llc Metallic magnetic memory devices for cryogenic operation and methods of operating the same
US11107979B2 (en) 2018-12-28 2021-08-31 Spin Memory, Inc. Patterned silicide structures and methods of manufacture
US10852369B2 (en) 2019-01-09 2020-12-01 Infineon Technologies Ag Stray field robust xMR sensor using perpendicular anisotropy
CN112186099B (zh) * 2019-07-02 2022-09-20 中电海康集团有限公司 磁性隧道结
WO2021056483A1 (zh) * 2019-09-27 2021-04-01 华为技术有限公司 一种mtj单元、vcma驱动方法及mram
KR102632986B1 (ko) 2019-10-01 2024-02-05 에스케이하이닉스 주식회사 전자 장치
KR102710350B1 (ko) * 2019-10-02 2024-09-27 삼성전자주식회사 자기 기억 소자
KR102702693B1 (ko) * 2019-12-13 2024-09-05 에스케이하이닉스 주식회사 전자 장치
US11276446B1 (en) 2020-08-27 2022-03-15 Western Digital Technologies, Inc. Multiferroic-assisted voltage controlled magnetic anisotropy memory device and methods of manufacturing the same
US11264562B1 (en) * 2020-08-27 2022-03-01 Western Digital Technologies, Inc. Multiferroic-assisted voltage controlled magnetic anisotropy memory device and methods of manufacturing the same
US11610731B2 (en) 2021-03-09 2023-03-21 Hirofusa Otsubo Apparatus for assembling a non-directional free electron generating repelling magnet combination
EP4362626A1 (en) * 2022-10-31 2024-05-01 Commissariat à l'énergie atomique et aux énergies alternatives Magnetic device and corresponding method
WO2025220658A1 (ja) * 2024-04-16 2025-10-23 国立研究開発法人物質・材料研究機構 磁性積層体、ｔｍｒセンサ、及び磁性積層体の製造方法
TWI912000B (zh) * 2024-11-11 2026-01-11 力晶積成電子製造股份有限公司 磁性記憶體結構

Family Cites Families (74)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US708869A (en) * 1901-10-09 1902-09-09 Joseph Davidoff Folding cot.
US6462919B1 (en) * 1999-04-28 2002-10-08 Seagate Technology Llc Spin valve sensor with exchange tabs
US6650513B2 (en) * 2001-01-29 2003-11-18 International Business Machines Corporation Magnetic devices with a ferromagnetic layer having perpendicular magnetic anisotropy and an antiferromagnetic layer for perpendicularly exchange biasing the ferromagnetic layer
JP4944315B2 (ja) * 2001-08-13 2012-05-30 キヤノン株式会社 磁気抵抗効果膜、それを備えたメモリ素子及びそれを用いたメモリ
TWI222630B (en) * 2001-04-24 2004-10-21 Matsushita Electric Industrial Co Ltd Magnetoresistive element and magnetoresistive memory device using the same
JP2003124541A (ja) * 2001-10-12 2003-04-25 Nec Corp 交換結合膜、磁気抵抗効果素子、磁気ヘッド及び磁気ランダムアクセスメモリ
US6714444B2 (en) * 2002-08-06 2004-03-30 Grandis, Inc. Magnetic element utilizing spin transfer and an MRAM device using the magnetic element
US6888742B1 (en) * 2002-08-28 2005-05-03 Grandis, Inc. Off-axis pinned layer magnetic element utilizing spin transfer and an MRAM device using the magnetic element
US6838740B2 (en) * 2002-09-27 2005-01-04 Grandis, Inc. Thermally stable magnetic elements utilizing spin transfer and an MRAM device using the magnetic element
US6958927B1 (en) * 2002-10-09 2005-10-25 Grandis Inc. Magnetic element utilizing spin-transfer and half-metals and an MRAM device using the magnetic element
CN100533589C (zh) * 2002-11-26 2009-08-26 株式会社东芝 磁单元和磁存储器
US7190611B2 (en) * 2003-01-07 2007-03-13 Grandis, Inc. Spin-transfer multilayer stack containing magnetic layers with resettable magnetization
US6829161B2 (en) * 2003-01-10 2004-12-07 Grandis, Inc. Magnetostatically coupled magnetic elements utilizing spin transfer and an MRAM device using the magnetic element
US6847547B2 (en) * 2003-02-28 2005-01-25 Grandis, Inc. Magnetostatically coupled magnetic elements utilizing spin transfer and an MRAM device using the magnetic element
US6933155B2 (en) * 2003-05-21 2005-08-23 Grandis, Inc. Methods for providing a sub .15 micron magnetic memory structure
US6980469B2 (en) * 2003-08-19 2005-12-27 New York University High speed low power magnetic devices based on current induced spin-momentum transfer
US7245462B2 (en) * 2003-08-21 2007-07-17 Grandis, Inc. Magnetoresistive element having reduced spin transfer induced noise
US6985385B2 (en) * 2003-08-26 2006-01-10 Grandis, Inc. Magnetic memory element utilizing spin transfer switching and storing multiple bits
US7161829B2 (en) * 2003-09-19 2007-01-09 Grandis, Inc. Current confined pass layer for magnetic elements utilizing spin-transfer and an MRAM device using such magnetic elements
US20050136600A1 (en) * 2003-12-22 2005-06-23 Yiming Huai Magnetic elements with ballistic magnetoresistance utilizing spin-transfer and an MRAM device using such magnetic elements
US7105372B2 (en) * 2004-01-20 2006-09-12 Headway Technologies, Inc. Magnetic tunneling junction film structure with process determined in-plane magnetic anisotropy
US7110287B2 (en) * 2004-02-13 2006-09-19 Grandis, Inc. Method and system for providing heat assisted switching of a magnetic element utilizing spin transfer
US7242045B2 (en) * 2004-02-19 2007-07-10 Grandis, Inc. Spin transfer magnetic element having low saturation magnetization free layers
US6967863B2 (en) * 2004-02-25 2005-11-22 Grandis, Inc. Perpendicular magnetization magnetic element utilizing spin transfer
US6992359B2 (en) * 2004-02-26 2006-01-31 Grandis, Inc. Spin transfer magnetic element with free layers having high perpendicular anisotropy and in-plane equilibrium magnetization
US7201977B2 (en) * 2004-03-23 2007-04-10 Seagate Technology Llc Anti-ferromagnetically coupled granular-continuous magnetic recording media
US7233039B2 (en) * 2004-04-21 2007-06-19 Grandis, Inc. Spin transfer magnetic elements with spin depolarization layers
US7088609B2 (en) 2004-05-11 2006-08-08 Grandis, Inc. Spin barrier enhanced magnetoresistance effect element and magnetic memory using the same
US7057921B2 (en) * 2004-05-11 2006-06-06 Grandis, Inc. Spin barrier enhanced dual magnetoresistance effect element and magnetic memory using the same
US7576956B2 (en) * 2004-07-26 2009-08-18 Grandis Inc. Magnetic tunnel junction having diffusion stop layer
US7369427B2 (en) * 2004-09-09 2008-05-06 Grandis, Inc. Magnetic elements with spin engineered insertion layers and MRAM devices using the magnetic elements
US7126202B2 (en) * 2004-11-16 2006-10-24 Grandis, Inc. Spin scattering and heat assisted switching of a magnetic element
US7313013B2 (en) * 2004-11-18 2007-12-25 International Business Machines Corporation Spin-current switchable magnetic memory element and method of fabricating the memory element
JP4575136B2 (ja) * 2004-12-20 2010-11-04 株式会社東芝 磁気記録素子、磁気記録装置、および情報の記録方法
US7241631B2 (en) * 2004-12-29 2007-07-10 Grandis, Inc. MTJ elements with high spin polarization layers configured for spin-transfer switching and spintronics devices using the magnetic elements
FR2883066B1 (fr) * 2005-03-08 2007-05-11 Valeo Vision Sa Projecteur lumineux a plusieurs fonctions pour vehicule automobile
US7241632B2 (en) * 2005-04-14 2007-07-10 Headway Technologies, Inc. MTJ read head with sidewall spacers
US7230265B2 (en) * 2005-05-16 2007-06-12 International Business Machines Corporation Spin-polarization devices using rare earth-transition metal alloys
US7518835B2 (en) * 2005-07-01 2009-04-14 Grandis, Inc. Magnetic elements having a bias field and magnetic memory devices using the magnetic elements
US7230845B1 (en) * 2005-07-29 2007-06-12 Grandis, Inc. Magnetic devices having a hard bias field and magnetic memory devices using the magnetic devices
US7489541B2 (en) * 2005-08-23 2009-02-10 Grandis, Inc. Spin-transfer switching magnetic elements using ferrimagnets and magnetic memories using the magnetic elements
JP2007088415A (ja) * 2005-08-25 2007-04-05 Fujitsu Ltd 磁気抵抗効果素子、磁気ヘッド、磁気記憶装置、および磁気メモリ装置
US20070054450A1 (en) * 2005-09-07 2007-03-08 Magic Technologies, Inc. Structure and fabrication of an MRAM cell
JP2007080952A (ja) * 2005-09-12 2007-03-29 Fuji Electric Holdings Co Ltd 多値記録スピン注入磁化反転素子およびこれを用いた装置
US7973349B2 (en) * 2005-09-20 2011-07-05 Grandis Inc. Magnetic device having multilayered free ferromagnetic layer
JP4444241B2 (ja) * 2005-10-19 2010-03-31 株式会社東芝 磁気抵抗効果素子、磁気ランダムアクセスメモリ、電子カード及び電子装置
US20070096229A1 (en) 2005-10-28 2007-05-03 Masatoshi Yoshikawa Magnetoresistive element and magnetic memory device
US7486545B2 (en) * 2005-11-01 2009-02-03 Magic Technologies, Inc. Thermally assisted integrated MRAM design and process for its manufacture
US7880249B2 (en) * 2005-11-30 2011-02-01 Magic Technologies, Inc. Spacer structure in MRAM cell and method of its fabrication
US7430135B2 (en) * 2005-12-23 2008-09-30 Grandis Inc. Current-switched spin-transfer magnetic devices with reduced spin-transfer switching current density
KR100706806B1 (ko) * 2006-01-27 2007-04-12 삼성전자주식회사 자기 메모리 소자 및 그 제조 방법
US7630177B2 (en) * 2006-02-14 2009-12-08 Hitachi Global Storage Technologies Netherlands B.V. Tunnel MR head with closed-edge laminated free layer
JP2007266498A (ja) * 2006-03-29 2007-10-11 Toshiba Corp 磁気記録素子及び磁気メモリ
US20070297220A1 (en) * 2006-06-22 2007-12-27 Masatoshi Yoshikawa Magnetoresistive element and magnetic memory
JP2008028362A (ja) * 2006-06-22 2008-02-07 Toshiba Corp 磁気抵抗素子及び磁気メモリ
JP2008098523A (ja) 2006-10-13 2008-04-24 Toshiba Corp 磁気抵抗効果素子および磁気メモリ
US8593862B2 (en) 2007-02-12 2013-11-26 Avalanche Technology, Inc. Spin-transfer torque magnetic random access memory having magnetic tunnel junction with perpendicular magnetic anisotropy
US7738287B2 (en) * 2007-03-27 2010-06-15 Grandis, Inc. Method and system for providing field biased magnetic memory devices
JP2008252037A (ja) * 2007-03-30 2008-10-16 Toshiba Corp 磁気抵抗素子及び磁気メモリ
JP2008252018A (ja) * 2007-03-30 2008-10-16 Toshiba Corp 磁気抵抗効果素子およびそれを用いた磁気ランダムアクセスメモリ
US7486551B1 (en) * 2007-04-03 2009-02-03 Grandis, Inc. Method and system for providing domain wall assisted switching of magnetic elements and magnetic memories using such magnetic elements
US7486552B2 (en) * 2007-05-21 2009-02-03 Grandis, Inc. Method and system for providing a spin transfer device with improved switching characteristics
WO2008154519A1 (en) * 2007-06-12 2008-12-18 Grandis, Inc. Method and system for providing a magnetic element and magnetic memory being unidirectional writing enabled
US7742328B2 (en) * 2007-06-15 2010-06-22 Grandis, Inc. Method and system for providing spin transfer tunneling magnetic memories utilizing non-planar transistors
US7394248B1 (en) * 2007-08-02 2008-07-01 Magic Technologies, Inc. Method and structure to reset multi-element MTJ
US7982275B2 (en) * 2007-08-22 2011-07-19 Grandis Inc. Magnetic element having low saturation magnetization
JP4738395B2 (ja) 2007-09-25 2011-08-03 株式会社東芝 磁気抵抗効果素子およびそれを用いた磁気ランダムアクセスメモリ
JP4649457B2 (ja) * 2007-09-26 2011-03-09 株式会社東芝 磁気抵抗素子及び磁気メモリ
US7826258B2 (en) * 2008-03-24 2010-11-02 Carnegie Mellon University Crossbar diode-switched magnetoresistive random access memory system
US20090302403A1 (en) * 2008-06-05 2009-12-10 Nguyen Paul P Spin torque transfer magnetic memory cell
US8054677B2 (en) * 2008-08-07 2011-11-08 Seagate Technology Llc Magnetic memory with strain-assisted exchange coupling switch
US8134864B2 (en) * 2008-08-14 2012-03-13 Regents Of The University Of Minnesota Exchange-assisted spin transfer torque switching
US7936598B2 (en) * 2009-04-28 2011-05-03 Seagate Technology Magnetic stack having assist layer
US8374048B2 (en) 2010-08-11 2013-02-12 Grandis, Inc. Method and system for providing magnetic tunneling junction elements having a biaxial anisotropy

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