JP5621371B2 - 遅延硬化性樹脂組成物 - Google Patents

遅延硬化性樹脂組成物 Download PDF

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Publication number
JP5621371B2
JP5621371B2 JP2010159574A JP2010159574A JP5621371B2 JP 5621371 B2 JP5621371 B2 JP 5621371B2 JP 2010159574 A JP2010159574 A JP 2010159574A JP 2010159574 A JP2010159574 A JP 2010159574A JP 5621371 B2 JP5621371 B2 JP 5621371B2
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Prior art keywords
component
resin composition
type
present
epoxy
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JP2010159574A
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Japanese (ja)
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JP2011038090A (ja
Inventor
孝司 椙尾
孝司 椙尾
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THREEBOND FINE CHEMICAL CO.,LTD.
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THREEBOND FINE CHEMICAL CO.,LTD.
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Priority to JP2010159574A priority Critical patent/JP5621371B2/ja
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols

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  • Epoxy Resins (AREA)
  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
JP2010159574A 2009-07-15 2010-07-14 遅延硬化性樹脂組成物 Active JP5621371B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2010159574A JP5621371B2 (ja) 2009-07-15 2010-07-14 遅延硬化性樹脂組成物

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2009166956 2009-07-15
JP2009166956 2009-07-15
JP2010159574A JP5621371B2 (ja) 2009-07-15 2010-07-14 遅延硬化性樹脂組成物

Publications (2)

Publication Number Publication Date
JP2011038090A JP2011038090A (ja) 2011-02-24
JP5621371B2 true JP5621371B2 (ja) 2014-11-12

Family

ID=43483238

Family Applications (1)

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JP2010159574A Active JP5621371B2 (ja) 2009-07-15 2010-07-14 遅延硬化性樹脂組成物

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JP (1) JP5621371B2 (zh)
CN (1) CN101955630B (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2618638A4 (en) 2011-04-22 2013-08-14 Panasonic Corp ORGANIC ELECTROLUMINESCENT DISPLAY PANEL AND METHOD FOR MANUFACTURING THE SAME
CN103412443A (zh) * 2013-07-22 2013-11-27 北京京东方光电科技有限公司 显示面板的对盒方法
CN113165371A (zh) 2018-12-18 2021-07-23 三键有限公司 层叠钢板的制造方法、层叠钢板的制造装置以及用于其的固化性组合物
CN111394028A (zh) * 2019-05-08 2020-07-10 枚林优交(上海)新材料开发有限公司 光激活延迟热固化胶黏剂及其制备方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4857562A (en) * 1987-01-30 1989-08-15 General Electric Company UV curable epoxy resin compositions with delayed cure
JP4409683B2 (ja) * 1999-11-12 2010-02-03 ダイセル化学工業株式会社 光学的造形用樹脂組成物、その製造方法及び光学的造形物
JP4837187B2 (ja) * 2001-06-06 2011-12-14 株式会社クラレ 活性エネルギー線硬化性樹脂組成物
JP2005339609A (ja) * 2004-05-24 2005-12-08 Sekisui Chem Co Ltd 光ディスク用ハードコート剤
JP4810887B2 (ja) * 2004-06-07 2011-11-09 パナソニック電工株式会社 エポキシ樹脂フィルム、光導波路、光電気複合基板、光通信モジュール
KR101250033B1 (ko) * 2005-01-20 2013-04-02 스미토모 베이클리트 컴퍼니 리미티드 에폭시 수지 조성물, 그 잠복화 방법 및 반도체 장치
JP5539605B2 (ja) * 2006-04-19 2014-07-02 株式会社ダイセル 活性エネルギー線硬化性コーティング剤およびその用途

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Publication number Publication date
CN101955630A (zh) 2011-01-26
CN101955630B (zh) 2013-05-08
JP2011038090A (ja) 2011-02-24

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