JP5620310B2 - 拡張性粘着フィルム、半導体用ダイシングフィルム、及びそれを用いた半導体装置の製造方法 - Google Patents

拡張性粘着フィルム、半導体用ダイシングフィルム、及びそれを用いた半導体装置の製造方法 Download PDF

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Publication number
JP5620310B2
JP5620310B2 JP2011054766A JP2011054766A JP5620310B2 JP 5620310 B2 JP5620310 B2 JP 5620310B2 JP 2011054766 A JP2011054766 A JP 2011054766A JP 2011054766 A JP2011054766 A JP 2011054766A JP 5620310 B2 JP5620310 B2 JP 5620310B2
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Japan
Prior art keywords
film
expandable
polymer
dicing
pentene
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JP2011054766A
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Japanese (ja)
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JP2012188597A (ja
JP2012188597A5 (enExample
Inventor
節子 大池
節子 大池
千明 丸子
千明 丸子
万依 加藤
万依 加藤
暁直 橋本
暁直 橋本
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Mitsui Chemicals Inc
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Mitsui Chemicals Inc
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Priority to JP2011054766A priority Critical patent/JP5620310B2/ja
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Publication of JP2012188597A5 publication Critical patent/JP2012188597A5/ja
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
    • C09J7/02—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices

Landscapes

  • Laminated Bodies (AREA)
  • Adhesive Tapes (AREA)
  • Dicing (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
JP2011054766A 2011-03-11 2011-03-11 拡張性粘着フィルム、半導体用ダイシングフィルム、及びそれを用いた半導体装置の製造方法 Active JP5620310B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2011054766A JP5620310B2 (ja) 2011-03-11 2011-03-11 拡張性粘着フィルム、半導体用ダイシングフィルム、及びそれを用いた半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011054766A JP5620310B2 (ja) 2011-03-11 2011-03-11 拡張性粘着フィルム、半導体用ダイシングフィルム、及びそれを用いた半導体装置の製造方法

Publications (3)

Publication Number Publication Date
JP2012188597A JP2012188597A (ja) 2012-10-04
JP2012188597A5 JP2012188597A5 (enExample) 2014-02-27
JP5620310B2 true JP5620310B2 (ja) 2014-11-05

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JP2011054766A Active JP5620310B2 (ja) 2011-03-11 2011-03-11 拡張性粘着フィルム、半導体用ダイシングフィルム、及びそれを用いた半導体装置の製造方法

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JP (1) JP5620310B2 (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6542502B2 (ja) * 2013-11-15 2019-07-10 三井化学株式会社 拡張性基材フィルム、ダイシングフィルム、半導体用表面保護フィルム、及び半導体装置の製造方法
JP6303754B2 (ja) * 2014-04-21 2018-04-04 住友ベークライト株式会社 ダイシングフィルム
JP2015214658A (ja) * 2014-05-12 2015-12-03 三井化学株式会社 拡張性基材フィルム、拡張性粘着フィルム、ダイシングフィルム、拡張性基材フィルムの製造方法、及び半導体装置の製造方法
JP2016162787A (ja) * 2015-02-27 2016-09-05 住友ベークライト株式会社 ダイシングフィルム用基材フィルムおよびダイシングフィルム
TW201901847A (zh) * 2017-05-11 2019-01-01 日商三井化學東賽璐股份有限公司 零件製造用具以及零件製造方法
JP2018076517A (ja) * 2017-12-01 2018-05-17 三井化学株式会社 ダイシングフィルム、半導体用表面保護フィルム、及び半導体装置の製造方法
JP7236366B2 (ja) * 2019-09-25 2023-03-09 日東電工株式会社 表面保護フィルム
JP7744748B2 (ja) * 2020-08-31 2025-09-26 ダイヤプラスフィルム株式会社 熱可塑性樹脂フィルム、粘着フィルム、化粧フィルム、化粧用粘着フィルム

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4545379B2 (ja) * 2003-01-06 2010-09-15 グンゼ株式会社 ダイシング用粘着シート
JP5448430B2 (ja) * 2007-12-18 2014-03-19 古河電気工業株式会社 ウエハ貼着用貼着シートおよびウエハの加工方法
JP2010092945A (ja) * 2008-10-03 2010-04-22 Mitsui Chemicals Inc 半導体ウェハ保護用粘着フィルム及びそれを用いた半導体ウェハの保護方法
JP2012153775A (ja) * 2011-01-25 2012-08-16 Mitsui Chemicals Inc フィルム、前記フィルムの製造方法及びそれを用いたｌｅｄパッケージの製造方法

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JP2012188597A (ja) 2012-10-04

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