JP5611152B2 - 基板熱処理装置 - Google Patents
基板熱処理装置 Download PDFInfo
- Publication number
- JP5611152B2 JP5611152B2 JP2011185710A JP2011185710A JP5611152B2 JP 5611152 B2 JP5611152 B2 JP 5611152B2 JP 2011185710 A JP2011185710 A JP 2011185710A JP 2011185710 A JP2011185710 A JP 2011185710A JP 5611152 B2 JP5611152 B2 JP 5611152B2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- arm
- wafer
- hot plate
- cooling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000000758 substrate Substances 0.000 title claims description 126
- 238000010438 heat treatment Methods 0.000 title claims description 59
- 238000001816 cooling Methods 0.000 claims description 115
- 230000007246 mechanism Effects 0.000 claims description 92
- 238000012545 processing Methods 0.000 description 35
- 239000007789 gas Substances 0.000 description 9
- 238000000576 coating method Methods 0.000 description 8
- 238000000034 method Methods 0.000 description 8
- 230000007723 transport mechanism Effects 0.000 description 8
- 239000011248 coating agent Substances 0.000 description 7
- 230000000149 penetrating effect Effects 0.000 description 7
- 238000011282 treatment Methods 0.000 description 5
- 239000007788 liquid Substances 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 239000000470 constituent Substances 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- 239000003507 refrigerant Substances 0.000 description 3
- 230000002209 hydrophobic effect Effects 0.000 description 2
- 238000000206 photolithography Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 101100221835 Arabidopsis thaliana CPL2 gene Proteins 0.000 description 1
- 101100221836 Arabidopsis thaliana CPL3 gene Proteins 0.000 description 1
- 101100221837 Arabidopsis thaliana CPL4 gene Proteins 0.000 description 1
- 101100065702 Arabidopsis thaliana ETC3 gene Proteins 0.000 description 1
- 101100536545 Arabidopsis thaliana TCL2 gene Proteins 0.000 description 1
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- 210000000078 claw Anatomy 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012805 post-processing Methods 0.000 description 1
- 238000007781 pre-processing Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F27—FURNACES; KILNS; OVENS; RETORTS
- F27B—FURNACES, KILNS, OVENS, OR RETORTS IN GENERAL; OPEN SINTERING OR LIKE APPARATUS
- F27B17/00—Furnaces of a kind not covered by any preceding group
- F27B17/0016—Chamber type furnaces
- F27B17/0025—Especially adapted for treating semiconductor wafers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/07—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for semiconductor wafers Not used, see H01L21/677
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F27—FURNACES; KILNS; OVENS; RETORTS
- F27D—DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS, OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE
- F27D15/00—Handling or treating discharged material; Supports or receiving chambers therefor
- F27D15/02—Cooling
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
- H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
- H01L21/0274—Photolithographic processes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Description
第1実施形態の熱処理装置50は、図4及び図5に示すように、閉鎖可能な筐体60内に、ウエハWを載置して所定温度例えば100〜350℃に加熱する熱板70と、ウエハWを載置すると共に、所定温度例えば23℃に冷却し、かつ熱板70に対して相対移動可能な受渡しアーム61と、熱板70によって加熱処理された先行のウエハWが基板搬送手段例えば搬送機構A3に受け渡される間、加熱処理されたウエハWの冷却と、後行のウエハWの熱板70への受け渡しとを支援する基板保持手段であるウエハ冷却アーム80(以下に冷却アーム80という)とを収容している。
第2実施形態の熱処理装置50Aは、熱板70の上方位置と受渡しアーム61の待機位置の上方位置とを移動可能な基板保持手段である冷却アーム80Aによって、熱板70によって加熱処理された先行のウエハWが搬送機構に受け渡される間、加熱処理された先行のウエハWを冷却して、受渡しアーム61が後行のウエハWの熱板70への受け渡しを支援するようにした場合である。
第3実施形態の熱処理装置50Bは、待機位置における受渡しアーム61と受渡しアーム61の上方位置とを移動可能な基板保持手段である退避バッファ85によって、熱板70によって加熱処理された先行のウエハWが搬送機構に受け渡される間、加熱処理された先行のウエハWを冷却して、受渡しアーム61が後行のウエハWの熱板70への受け渡しを支援するようにした場合である。
上記第1実施形態では、受渡しアーム61の上方に冷却アーム80を配設した場合について説明したが、例えば図14に示すように、熱板70の両側に受渡しアーム61Bと冷却アーム80Bとを対向して配設し、搬送機構である水平のX−Y方向,鉛直のZ方向及び回転(θ)自在な搬送アーム400によって受渡しアーム61Bと冷却アーム80BにウエハWを受渡し可能な配置構造としてもよい。
65 アーム用受渡しピン
65b 昇降駆動部
66 熱板用受渡しピン
66b 昇降駆動部
67 受渡しアーム移動機構
70 熱板
80,80A 基板冷却アーム(基板保持手段)
81,81A 冷却アーム移動機構
85 退避バッファ(基板保持手段)
86 バッファ昇降駆動部
87 冷却機構
90 基板保持機構
91 第1の保持部材
92,93 第2の保持部材
100 コントローラ
205 保持機構駆動用シリンダ
Claims (2)
- 基板を載置して加熱処理する熱板と、上記熱板に対して進退移動可能であって基板を受け渡しする基板受渡しアームと、上記基板受渡しアームを上記熱板の上方位置と熱板から離れた待機位置との間を移動するアーム移動機構と、上記待機位置にある上記基板受渡しアームに対して基板を受け渡しする基板搬送手段と、を具備する基板熱処理装置であって、
上記熱板によって加熱処理された先行の基板が上記基板搬送手段に受け渡される間、加熱処理された上記先行の基板の冷却と、後行の基板の上記熱板への受け渡しとを支援する基板保持手段を具備し、
上記基板受渡しアームは、基板を冷却する冷却機能を具備し、
上記基板保持手段は、上記基板受渡しアームに対して基板を受け渡すと共に、基板受渡しアームから受け取った基板を冷却する冷却機能を具備する退避バッファにて形成される、ことを特徴とする基板熱処理装置。 - 請求項1記載の基板熱処理装置において、
上記退避バッファは、上記基板受渡しアームの待機位置において、バッファ昇降駆動部によって基板受渡しアームに対して上方から進退移動可能に配設されると共に、基板受渡しアームに対して基板を受け渡す際に、基板を着脱可能に保持する保持機構を具備する、ことを特徴とする基板熱処理装置。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011185710A JP5611152B2 (ja) | 2011-08-29 | 2011-08-29 | 基板熱処理装置 |
US13/592,536 US9463938B2 (en) | 2011-08-29 | 2012-08-23 | Substrate heat treatment device |
KR1020120093927A KR101848890B1 (ko) | 2011-08-29 | 2012-08-27 | 기판 열처리 장치 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011185710A JP5611152B2 (ja) | 2011-08-29 | 2011-08-29 | 基板熱処理装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2013048144A JP2013048144A (ja) | 2013-03-07 |
JP5611152B2 true JP5611152B2 (ja) | 2014-10-22 |
Family
ID=47744217
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011185710A Active JP5611152B2 (ja) | 2011-08-29 | 2011-08-29 | 基板熱処理装置 |
Country Status (3)
Country | Link |
---|---|
US (1) | US9463938B2 (ja) |
JP (1) | JP5611152B2 (ja) |
KR (1) | KR101848890B1 (ja) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2016151622A1 (ja) | 2015-03-23 | 2016-09-29 | 株式会社 東芝 | 永久磁石、モータ、および発電機 |
US10474353B2 (en) | 2016-05-31 | 2019-11-12 | Snap Inc. | Application control using a gesture based trigger |
JP6792368B2 (ja) * | 2016-07-25 | 2020-11-25 | 株式会社Screenホールディングス | 熱処理装置、基板処理装置および熱処理方法 |
US10609036B1 (en) | 2016-10-10 | 2020-03-31 | Snap Inc. | Social media post subscribe requests for buffer user accounts |
JP6964005B2 (ja) * | 2018-01-09 | 2021-11-10 | 東京エレクトロン株式会社 | 熱処理装置、熱板の冷却方法及びコンピュータ読み取り可能な記録媒体 |
KR20200021818A (ko) * | 2018-08-21 | 2020-03-02 | 세메스 주식회사 | 가열 플레이트, 이를 구비하는 기판 열처리 장치 및 가열 플레이트의 제조 방법 |
JP7115966B2 (ja) * | 2018-11-30 | 2022-08-09 | 株式会社Screenホールディングス | 基板処理装置 |
KR102379016B1 (ko) * | 2019-10-31 | 2022-03-28 | 세메스 주식회사 | 지지 유닛, 이를 포함하는 기판 처리 장치 및 이를 이용하는 기판 처리 방법 |
CN114830313A (zh) * | 2019-12-20 | 2022-07-29 | 应用材料公司 | 用于基板的处置与均匀烘烤的烘烤装置 |
US11725272B2 (en) | 2021-11-01 | 2023-08-15 | Canon Kabushiki Kaisha | Method, system and apparatus for cooling a substrate |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2194500B (en) * | 1986-07-04 | 1991-01-23 | Canon Kk | A wafer handling apparatus |
JP3734295B2 (ja) * | 1995-09-04 | 2006-01-11 | 大日本スクリーン製造株式会社 | 基板搬送装置 |
JP3451166B2 (ja) * | 1996-07-08 | 2003-09-29 | 大日本スクリーン製造株式会社 | 基板熱処理装置 |
JPH11135600A (ja) * | 1997-08-25 | 1999-05-21 | Shibaura Mechatronics Corp | ロボット装置および処理装置 |
JP4083371B2 (ja) * | 1999-06-11 | 2008-04-30 | 東京エレクトロン株式会社 | 基板処理装置 |
JP4053728B2 (ja) * | 1999-12-09 | 2008-02-27 | 東京エレクトロン株式会社 | 加熱・冷却処理装置及び基板処理装置 |
JP2001274232A (ja) * | 2000-03-27 | 2001-10-05 | Tokyo Electron Ltd | 基板処理装置 |
JP4274736B2 (ja) * | 2002-03-28 | 2009-06-10 | 大日本スクリーン製造株式会社 | 基板処理装置 |
JP2005005441A (ja) * | 2003-06-11 | 2005-01-06 | Dainippon Screen Mfg Co Ltd | 基板処理装置および基板処理方法 |
JP4414910B2 (ja) * | 2005-02-17 | 2010-02-17 | 東京エレクトロン株式会社 | 半導体製造装置及び半導体製造方法 |
KR100637717B1 (ko) | 2005-09-28 | 2006-10-25 | 세메스 주식회사 | 베이크 유닛, 상기 베이크 유닛에 사용되는 가열플레이트를 냉각하는 방법, 그리고 상기 베이크 유닛을포함하는 기판 처리 장치 및 방법 |
JP5029535B2 (ja) * | 2007-10-12 | 2012-09-19 | 東京エレクトロン株式会社 | 熱処理装置、熱処理方法及び記憶媒体 |
KR101365405B1 (ko) * | 2007-10-12 | 2014-02-19 | 도쿄엘렉트론가부시키가이샤 | 열처리장치, 열처리방법 및 기억매체 |
JP4811882B2 (ja) * | 2009-03-27 | 2011-11-09 | 東京エレクトロン株式会社 | 基板熱処理装置 |
JP5322847B2 (ja) * | 2009-08-20 | 2013-10-23 | 東京エレクトロン株式会社 | 加熱処理装置及び熱処理装置 |
-
2011
- 2011-08-29 JP JP2011185710A patent/JP5611152B2/ja active Active
-
2012
- 2012-08-23 US US13/592,536 patent/US9463938B2/en active Active
- 2012-08-27 KR KR1020120093927A patent/KR101848890B1/ko active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
JP2013048144A (ja) | 2013-03-07 |
US9463938B2 (en) | 2016-10-11 |
KR20130024808A (ko) | 2013-03-08 |
US20130052599A1 (en) | 2013-02-28 |
KR101848890B1 (ko) | 2018-04-13 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5611152B2 (ja) | 基板熱処理装置 | |
KR101268261B1 (ko) | 기판 버퍼 장치, 기판 버퍼링 방법, 기판 처리 장치 및컴퓨터 판독 가능한 기억 매체 | |
KR100997829B1 (ko) | 기판 처리 장치 및 기판 위치 결정 장치 | |
CN100429758C (zh) | 基板校准装置,基板处理装置及基板搬运装置 | |
US20160035601A1 (en) | Bake unit, substrate treating apparatus including the unit, and substrate treating method | |
KR20100007725A (ko) | 기판 처리 장치 | |
JP2018182263A (ja) | 基板加熱装置 | |
KR20090031271A (ko) | 상압 건조 장치 및 기판 처리 장치 및 기판 처리 방법 | |
TWI311633B (en) | Decompression drier | |
JP2008160011A (ja) | 基板処理装置 | |
JP4665037B2 (ja) | 基板処理システム | |
JP2000306973A (ja) | 処理システム | |
JP3983481B2 (ja) | 基板処理装置及び基板処理装置における基板搬送方法 | |
JP3485990B2 (ja) | 搬送方法及び搬送装置 | |
WO2019138911A1 (ja) | 基板処理装置、基板処理方法及びコンピュータ読み取り可能な記録媒体 | |
KR20100031453A (ko) | 기판 처리 장치 | |
KR102054221B1 (ko) | 기판반송장치 및 이를 가지는 기판처리장치 | |
JP4884991B2 (ja) | 塗布処理装置 | |
TWI246146B (en) | Substrate transfer apparatus and substrate transfer method | |
JP2010161407A (ja) | 基板処理システム | |
KR20160081010A (ko) | 베이크 유닛, 이를 포함하는 기판 처리 장치 및 방법 | |
KR102534608B1 (ko) | 기판 처리 장치 및 배기 방법 | |
KR101768518B1 (ko) | 반송 챔버, 기판 처리 설비, 그리고 기판 반송 방법 | |
JP2010192685A (ja) | 基板搬送装置及び基板処理システム | |
KR20200026563A (ko) | 기판 반송 로봇 및 기판 처리 설비 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20130902 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20140129 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20140203 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20140313 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20140523 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20140704 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20140901 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20140902 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 5611152 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |