JP5598865B2 - ウエハ加工用テープ - Google Patents

ウエハ加工用テープ Download PDF

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Publication number
JP5598865B2
JP5598865B2 JP2011275329A JP2011275329A JP5598865B2 JP 5598865 B2 JP5598865 B2 JP 5598865B2 JP 2011275329 A JP2011275329 A JP 2011275329A JP 2011275329 A JP2011275329 A JP 2011275329A JP 5598865 B2 JP5598865 B2 JP 5598865B2
Authority
JP
Japan
Prior art keywords
adhesive layer
tape
pressure
peeling
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2011275329A
Other languages
English (en)
Japanese (ja)
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JP2013125924A (ja
Inventor
一貴 建部
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
THE FURUKAW ELECTRIC CO., LTD.
Original Assignee
THE FURUKAW ELECTRIC CO., LTD.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by THE FURUKAW ELECTRIC CO., LTD. filed Critical THE FURUKAW ELECTRIC CO., LTD.
Priority to JP2011275329A priority Critical patent/JP5598865B2/ja
Priority to KR1020120146130A priority patent/KR101428287B1/ko
Publication of JP2013125924A publication Critical patent/JP2013125924A/ja
Application granted granted Critical
Publication of JP5598865B2 publication Critical patent/JP5598865B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Dicing (AREA)
  • Adhesive Tapes (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2011275329A 2011-12-16 2011-12-16 ウエハ加工用テープ Active JP5598865B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2011275329A JP5598865B2 (ja) 2011-12-16 2011-12-16 ウエハ加工用テープ
KR1020120146130A KR101428287B1 (ko) 2011-12-16 2012-12-14 웨이퍼 가공용 테이프 및 그의 제조 방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011275329A JP5598865B2 (ja) 2011-12-16 2011-12-16 ウエハ加工用テープ

Publications (2)

Publication Number Publication Date
JP2013125924A JP2013125924A (ja) 2013-06-24
JP5598865B2 true JP5598865B2 (ja) 2014-10-01

Family

ID=48776985

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011275329A Active JP5598865B2 (ja) 2011-12-16 2011-12-16 ウエハ加工用テープ

Country Status (2)

Country Link
JP (1) JP5598865B2 (ko)
KR (1) KR101428287B1 (ko)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6278178B2 (ja) * 2013-11-11 2018-02-14 日立化成株式会社 ウエハ加工用テープ
JP6790025B2 (ja) * 2018-05-31 2020-11-25 古河電気工業株式会社 電子デバイス加工用テープおよび電子デバイス加工用テープの製造方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4283596B2 (ja) * 2003-05-29 2009-06-24 日東電工株式会社 チップ状ワークの固定方法
JP2005350520A (ja) * 2004-06-08 2005-12-22 Hitachi Chem Co Ltd 接着シート及びその製造方法、並びに、半導体装置の製造方法及び半導体装置
JP2007036111A (ja) * 2005-07-29 2007-02-08 Tokyo Seimitsu Co Ltd フィルム剥離方法およびフィルム剥離装置
JP2008021858A (ja) * 2006-07-13 2008-01-31 Shin Etsu Chem Co Ltd ダイシング・ダイボンド用接着フィルム
JP4999066B2 (ja) * 2006-12-20 2012-08-15 古河電気工業株式会社 ウェハ加工用テープ
JP5323601B2 (ja) * 2009-07-24 2013-10-23 古河電気工業株式会社 ウエハ加工用テープ
US9076833B2 (en) * 2010-10-15 2015-07-07 Hitachi Chemical Company, Ltd. Tape for processing wafer, method for manufacturing tape for processing wafer, and method for manufacturing semiconductor device
JP4904432B1 (ja) * 2011-03-01 2012-03-28 古河電気工業株式会社 ウエハ加工用テープ
JP5370414B2 (ja) 2011-06-06 2013-12-18 日立化成株式会社 接着シートの製造方法
JP5839931B2 (ja) * 2011-10-20 2016-01-06 古河電気工業株式会社 ウエハ加工用テープ及びその製造方法

Also Published As

Publication number Publication date
JP2013125924A (ja) 2013-06-24
KR20130069491A (ko) 2013-06-26
KR101428287B1 (ko) 2014-08-07

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