JP5592602B2 - 蛍光体およびそれを用いた発光装置 - Google Patents

蛍光体およびそれを用いた発光装置 Download PDF

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Publication number
JP5592602B2
JP5592602B2 JP2008197685A JP2008197685A JP5592602B2 JP 5592602 B2 JP5592602 B2 JP 5592602B2 JP 2008197685 A JP2008197685 A JP 2008197685A JP 2008197685 A JP2008197685 A JP 2008197685A JP 5592602 B2 JP5592602 B2 JP 5592602B2
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phosphor
light
light emitting
emission
green
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JP2010031201A5 (enExample
JP2010031201A (ja
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田 由 美 福
井 博 紀 浅
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Toshiba Corp
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Toshiba Corp
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Priority to JP2008197685A priority Critical patent/JP5592602B2/ja
Priority to US12/504,180 priority patent/US8685277B2/en
Publication of JP2010031201A publication Critical patent/JP2010031201A/ja
Publication of JP2010031201A5 publication Critical patent/JP2010031201A5/ja
Priority to US13/471,864 priority patent/US8603361B2/en
Priority to US14/162,383 priority patent/US20140138583A1/en
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
    • C09K11/7728—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing europium
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    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/515—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics
    • C04B35/58—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on borides, nitrides, i.e. nitrides, oxynitrides, carbonitrides or oxycarbonitrides or silicides
    • C04B35/597—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on borides, nitrides, i.e. nitrides, oxynitrides, carbonitrides or oxycarbonitrides or silicides based on silicon oxynitride, e.g. SIALONS
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    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/0883—Arsenides; Nitrides; Phosphides
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    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
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    • C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
    • C09K11/7728—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing europium
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    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
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    • C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
    • C09K11/7728—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing europium
    • C09K11/77348—Silicon Aluminium Nitrides or Silicon Aluminium Oxynitrides
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    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8511—Wavelength conversion means characterised by their material, e.g. binder
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    • C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
    • C04B2235/30—Constituents and secondary phases not being of a fibrous nature
    • C04B2235/32—Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
    • C04B2235/3217—Aluminum oxide or oxide forming salts thereof, e.g. bauxite, alpha-alumina
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    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
    • C04B2235/30—Constituents and secondary phases not being of a fibrous nature
    • C04B2235/38—Non-oxide ceramic constituents or additives
    • C04B2235/3852—Nitrides, e.g. oxynitrides, carbonitrides, oxycarbonitrides, lithium nitride, magnesium nitride
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    • C04B2235/30—Constituents and secondary phases not being of a fibrous nature
    • C04B2235/38—Non-oxide ceramic constituents or additives
    • C04B2235/3852—Nitrides, e.g. oxynitrides, carbonitrides, oxycarbonitrides, lithium nitride, magnesium nitride
    • C04B2235/3865—Aluminium nitrides
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    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
    • C04B2235/30—Constituents and secondary phases not being of a fibrous nature
    • C04B2235/38—Non-oxide ceramic constituents or additives
    • C04B2235/3852—Nitrides, e.g. oxynitrides, carbonitrides, oxycarbonitrides, lithium nitride, magnesium nitride
    • C04B2235/3873—Silicon nitrides, e.g. silicon carbonitride, silicon oxynitride
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
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    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85909—Post-treatment of the connector or wire bonding area
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    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
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    • H10H20/80—Constructional details
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    • H10H20/8515—Wavelength conversion means not being in contact with the bodies

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  • Inorganic Chemistry (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Structural Engineering (AREA)
  • Luminescent Compositions (AREA)
  • Cathode-Ray Tubes And Fluorescent Screens For Display (AREA)
JP2008197685A 2008-07-31 2008-07-31 蛍光体およびそれを用いた発光装置 Active JP5592602B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2008197685A JP5592602B2 (ja) 2008-07-31 2008-07-31 蛍光体およびそれを用いた発光装置
US12/504,180 US8685277B2 (en) 2008-07-31 2009-07-16 Fluorescent substance and light-emitting device employing the same
US13/471,864 US8603361B2 (en) 2008-07-31 2012-05-15 Fluorescent substance and light-emitting device employing the same
US14/162,383 US20140138583A1 (en) 2008-07-31 2014-01-23 Fluorescent substance and light-emitting device employing the same

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Application Number Priority Date Filing Date Title
JP2008197685A JP5592602B2 (ja) 2008-07-31 2008-07-31 蛍光体およびそれを用いた発光装置

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JP2010183191A Division JP5592729B2 (ja) 2010-08-18 2010-08-18 蛍光体およびそれを用いた発光装置
JP2011103135A Division JP5398778B2 (ja) 2011-05-02 2011-05-02 蛍光体の製造方法

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JP2010031201A JP2010031201A (ja) 2010-02-12
JP2010031201A5 JP2010031201A5 (enExample) 2010-10-07
JP5592602B2 true JP5592602B2 (ja) 2014-09-17

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Families Citing this family (47)

* Cited by examiner, † Cited by third party
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JP5578597B2 (ja) 2007-09-03 2014-08-27 独立行政法人物質・材料研究機構 蛍光体及びその製造方法、並びにそれを用いた発光装置
JP5592602B2 (ja) * 2008-07-31 2014-09-17 株式会社東芝 蛍光体およびそれを用いた発光装置
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JP5517037B2 (ja) * 2009-08-06 2014-06-11 独立行政法人物質・材料研究機構 蛍光体及びその製造方法、並びにそれを用いた発光装置
KR101172143B1 (ko) * 2009-08-10 2012-08-07 엘지이노텍 주식회사 백색 발광다이오드 소자용 시온계 산화질화물 형광체, 그의 제조방법 및 그를 이용한 백색 ｌｅｄ 소자
JP5129392B2 (ja) * 2009-08-28 2013-01-30 株式会社東芝 蛍光体の製造方法およびそれにより製造された蛍光体
WO2011028033A2 (ko) * 2009-09-02 2011-03-10 엘지이노텍주식회사 형광체, 형광체 제조방법 및 백색 발광 소자
JP5732038B2 (ja) * 2010-02-16 2015-06-10 株式会社東芝 フルカラー液晶表示装置のバックライト用の白色ｌｅｄ、フルカラー液晶表示装置用のバックライト、およびフルカラー液晶表示装置
JP5190475B2 (ja) * 2010-02-19 2013-04-24 株式会社東芝 蛍光体およびそれを用いた発光装置
JP2011199193A (ja) * 2010-03-23 2011-10-06 Toshiba Corp 発光装置及びその製造方法
JP5101650B2 (ja) * 2010-03-25 2012-12-19 株式会社東芝 半導体発光装置及びその製造方法
US20120019126A1 (en) * 2010-07-22 2012-01-26 General Electric Company Oxynitride phosphors, method of preparation, and light emitting instrument
KR101762473B1 (ko) * 2010-08-19 2017-07-27 우베 고산 가부시키가이샤 규질화물 형광체용 질화규소 분말 및 그것을 이용한 Sr3Al3Si13O2N21계 형광체, β-사이알론 형광체, 그리고 그들의 제조방법
JP5076017B2 (ja) 2010-08-23 2012-11-21 株式会社東芝 発光装置
JP5127940B2 (ja) * 2010-08-31 2013-01-23 株式会社東芝 蛍光体の製造方法
JP5127965B2 (ja) * 2010-09-02 2013-01-23 株式会社東芝 蛍光体およびそれを用いた発光装置
US8414145B2 (en) 2010-09-06 2013-04-09 Kabushiki Kaisha Toshiba Light emitting device
JP5127964B2 (ja) 2010-09-06 2013-01-23 株式会社東芝 発光装置
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JP5172915B2 (ja) * 2010-09-07 2013-03-27 株式会社東芝 発光装置
JP4929413B2 (ja) * 2010-09-07 2012-05-09 株式会社東芝 発光装置
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JP5319743B2 (ja) 2010-09-08 2013-10-16 株式会社東芝 発光装置
WO2012036016A1 (ja) * 2010-09-17 2012-03-22 株式会社東芝 蛍光体および発光装置
JP5702569B2 (ja) * 2010-09-17 2015-04-15 株式会社東芝 蛍光体の製造方法および発光装置
JP2012099381A (ja) * 2010-11-04 2012-05-24 Denki Kagaku Kogyo Kk 高輝度放電ランプ
JP5787343B2 (ja) * 2011-02-06 2015-09-30 国立研究開発法人物質・材料研究機構 蛍光体及び発光装置
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JP5690159B2 (ja) * 2011-02-06 2015-03-25 独立行政法人物質・材料研究機構 蛍光体、その製造方法及び発光装置
JP2013227587A (ja) * 2011-03-09 2013-11-07 Toshiba Corp 蛍光体およびそれを用いた発光装置
JP5325959B2 (ja) * 2011-03-09 2013-10-23 株式会社東芝 蛍光体およびそれを用いた発光装置
JP5634352B2 (ja) 2011-08-24 2014-12-03 株式会社東芝 蛍光体、発光装置および蛍光体の製造方法
KR101876103B1 (ko) * 2011-10-12 2018-07-06 우베 고산 가부시키가이샤 산질화물 형광체 분말, 산질화물 형광체 분말 제조용 질화규소 분말 및 산질화물 형광체 분말의 제조 방법
JP5851214B2 (ja) * 2011-11-16 2016-02-03 株式会社東芝 蛍光体、発光装置、および蛍光体の製造方法
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JP6300973B2 (ja) * 2012-06-13 2018-03-28 アルパッド株式会社 蛍光体の特性評価方法
JP6285100B2 (ja) * 2012-06-13 2018-02-28 アルパッド株式会社 蛍光体および発光装置
JP5746672B2 (ja) 2012-09-25 2015-07-08 株式会社東芝 蛍光体、発光装置、および蛍光体の製造方法
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