JP5582248B2 - 伝送システムとバックプレーンシステム構築方法 - Google Patents

伝送システムとバックプレーンシステム構築方法 Download PDF

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Publication number
JP5582248B2
JP5582248B2 JP2013507775A JP2013507775A JP5582248B2 JP 5582248 B2 JP5582248 B2 JP 5582248B2 JP 2013507775 A JP2013507775 A JP 2013507775A JP 2013507775 A JP2013507775 A JP 2013507775A JP 5582248 B2 JP5582248 B2 JP 5582248B2
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JP
Japan
Prior art keywords
backplane
hole
connector
circuit
holes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2013507775A
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English (en)
Japanese (ja)
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JPWO2012133755A1 (ja
Inventor
和弘 柏倉
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NEC Corp
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NEC Corp
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Publication date
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Priority to JP2013507775A priority Critical patent/JP5582248B2/ja
Publication of JPWO2012133755A1 publication Critical patent/JPWO2012133755A1/ja
Application granted granted Critical
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Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04Q—SELECTING
    • H04Q1/00—Details of selecting apparatus or arrangements
    • H04Q1/02—Constructional details
    • H04Q1/15—Backplane arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/66—Structural association with built-in electrical component
    • H01R13/6608—Structural association with built-in electrical component with built-in single component
    • H01R13/6616—Structural association with built-in electrical component with built-in single component with resistor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/66—Structural association with built-in electrical component
    • H01R13/6608—Structural association with built-in electrical component with built-in single component
    • H01R13/6625—Structural association with built-in electrical component with built-in single component with capacitive component
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/66—Structural association with built-in electrical component
    • H01R13/665—Structural association with built-in electrical component with built-in electronic circuit
    • H01R13/6658—Structural association with built-in electrical component with built-in electronic circuit on printed circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0246—Termination of transmission lines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1438—Back panels or connecting means therefor; Terminals; Coding means to avoid wrong insertion
    • H05K7/1439—Back panel mother boards
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04L—TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
    • H04L25/00—Baseband systems
    • H04L25/02—Details ; arrangements for supplying electrical power along data transmission lines
    • H04L25/0264—Arrangements for coupling to transmission lines
    • H04L25/0298—Arrangement for terminating transmission lines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
    • H05K1/0231—Capacitors or dielectric substances
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0245—Lay-out of balanced signal pairs, e.g. differential lines or twisted lines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
    • H05K1/0251—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance related to vias or transitions between vias and transmission lines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/044—Details of backplane or midplane for mounting orthogonal PCBs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09618—Via fence, i.e. one-dimensional array of vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10015—Non-printed capacitor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49128—Assembling formed circuit to base

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Manufacturing & Machinery (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Dc Digital Transmission (AREA)
  • Structure Of Printed Boards (AREA)
JP2013507775A 2011-03-30 2012-03-30 伝送システムとバックプレーンシステム構築方法 Expired - Fee Related JP5582248B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2013507775A JP5582248B2 (ja) 2011-03-30 2012-03-30 伝送システムとバックプレーンシステム構築方法

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2011073983 2011-03-30
JP2011073983 2011-03-30
JP2013507775A JP5582248B2 (ja) 2011-03-30 2012-03-30 伝送システムとバックプレーンシステム構築方法
PCT/JP2012/058556 WO2012133755A1 (fr) 2011-03-30 2012-03-30 Procédé et système de transmission pour élaborer un système de fond de panier

Publications (2)

Publication Number Publication Date
JPWO2012133755A1 JPWO2012133755A1 (ja) 2014-07-28
JP5582248B2 true JP5582248B2 (ja) 2014-09-03

Family

ID=46931452

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013507775A Expired - Fee Related JP5582248B2 (ja) 2011-03-30 2012-03-30 伝送システムとバックプレーンシステム構築方法

Country Status (3)

Country Link
US (1) US9380704B2 (fr)
JP (1) JP5582248B2 (fr)
WO (1) WO2012133755A1 (fr)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140273556A1 (en) * 2013-03-15 2014-09-18 Silicon Graphics International Corp. High-density multidirectional midplane
US9297971B2 (en) * 2013-04-26 2016-03-29 Oracle International Corporation Hybrid-integrated photonic chip package with an interposer
US20160034412A1 (en) * 2014-08-03 2016-02-04 Michael Feldman Pci express cluster
JP6662463B2 (ja) * 2016-09-21 2020-03-11 日本電気株式会社 接続構造及び回路
CN106704993A (zh) * 2017-01-09 2017-05-24 宁波亚茂光电股份有限公司 一种插卡式电源与光源板的连接结构
JP6707486B2 (ja) * 2017-03-23 2020-06-10 キオクシア株式会社 半導体デバイス及び電子機器
CN109388195A (zh) * 2017-08-03 2019-02-26 华硕电脑股份有限公司 电脑系统及其主板
CN109309484B (zh) * 2018-10-23 2022-04-01 杭州电子科技大学 针对差分硅通孔传输通道的无源均衡器及其设计方法
JP7446209B2 (ja) * 2020-12-03 2024-03-08 株式会社日立製作所 信号伝送装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007317716A (ja) * 2006-05-23 2007-12-06 Ricoh Co Ltd プリント配線板
JP2009188272A (ja) * 2008-02-07 2009-08-20 Jtekt Corp 多層回路基板

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Publication number Priority date Publication date Assignee Title
GB8924282D0 (en) * 1989-10-27 1989-12-13 Bicc Plc An improved circuit board
US6118350A (en) 1998-11-10 2000-09-12 Gennum Corporation Bus through termination circuit
CN1989503B (zh) 2003-03-06 2010-08-04 新美亚通讯设备有限公司 优化过孔结构的高频性能的方法
JP4834385B2 (ja) 2005-11-22 2011-12-14 株式会社日立製作所 プリント基板および電子装置
US8158892B2 (en) 2007-08-13 2012-04-17 Force10 Networks, Inc. High-speed router with backplane using muli-diameter drilled thru-holes and vias
WO2010056312A2 (fr) * 2008-11-14 2010-05-20 Amphenol Corporation Connecteur d'alimentation à filtre

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007317716A (ja) * 2006-05-23 2007-12-06 Ricoh Co Ltd プリント配線板
JP2009188272A (ja) * 2008-02-07 2009-08-20 Jtekt Corp 多層回路基板

Also Published As

Publication number Publication date
WO2012133755A1 (fr) 2012-10-04
US20140063765A1 (en) 2014-03-06
US9380704B2 (en) 2016-06-28
JPWO2012133755A1 (ja) 2014-07-28

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