JP5578377B2 - 基板処理装置及び方法 - Google Patents

基板処理装置及び方法 Download PDF

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Publication number
JP5578377B2
JP5578377B2 JP2012166684A JP2012166684A JP5578377B2 JP 5578377 B2 JP5578377 B2 JP 5578377B2 JP 2012166684 A JP2012166684 A JP 2012166684A JP 2012166684 A JP2012166684 A JP 2012166684A JP 5578377 B2 JP5578377 B2 JP 5578377B2
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Prior art keywords
gantry
substrate
nozzle
processing liquid
inkjet
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JP2012166684A
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Japanese (ja)
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JP2013031840A (ja
Inventor
チュルウ キム
スンヘ イ
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Semes Co Ltd
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Semes Co Ltd
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Priority claimed from KR1020110104761A external-priority patent/KR101223037B1/ko
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  • Application Of Or Painting With Fluid Materials (AREA)
  • Coating Apparatus (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Liquid Crystal (AREA)
JP2012166684A 2011-07-29 2012-07-27 基板処理装置及び方法 Active JP5578377B2 (ja)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR20110075771 2011-07-29
KR10-2011-0075771 2011-07-29
KR1020110104761A KR101223037B1 (ko) 2011-07-29 2011-10-13 기판 처리 장치 및 방법
KR10-2011-0104761 2011-10-13

Publications (2)

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JP2013031840A JP2013031840A (ja) 2013-02-14
JP5578377B2 true JP5578377B2 (ja) 2014-08-27

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JP2012166684A Active JP5578377B2 (ja) 2011-07-29 2012-07-27 基板処理装置及び方法

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JP (1) JP5578377B2 (zh)
CN (1) CN102898032B (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104722444B (zh) * 2013-12-23 2017-03-29 昆山国显光电有限公司 一种涂布装置
CN109116596B (zh) * 2018-09-06 2024-04-05 武汉精测电子集团股份有限公司 用于连接显示面板上t-fpc和主fpc的半自动反折工装及设备
CN109759278B (zh) * 2019-01-29 2021-02-26 苏州威格尔纳米科技有限公司 一种挤压式狭缝涂布封装设备
CN115921168B (zh) * 2023-02-10 2023-10-03 东莞市华纬涂装设备有限公司 一种多工位喷涂机械手

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3236703B2 (ja) * 1993-05-31 2001-12-10 平田機工株式会社 流体塗布装置
DE10224128A1 (de) * 2002-05-29 2003-12-18 Schmid Rhyner Ag Adliswil Verfahren zum Auftrag von Beschichtungen auf Oberflächen
JP4679895B2 (ja) * 2003-12-17 2011-05-11 大日本印刷株式会社 パターン形成装置、ヘッドユニット
JP4573645B2 (ja) * 2004-12-27 2010-11-04 大日本スクリーン製造株式会社 塗布装置
JP4980644B2 (ja) * 2005-05-30 2012-07-18 東京エレクトロン株式会社 塗布方法及び塗布装置
KR100889308B1 (ko) * 2007-11-21 2009-03-18 세메스 주식회사 스크라이빙 장치 및 방법 및 이를 이용한 기판 절단 장치
JP5417186B2 (ja) * 2010-01-08 2014-02-12 大日本スクリーン製造株式会社 基板処理装置

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Publication number Publication date
JP2013031840A (ja) 2013-02-14
CN102898032A (zh) 2013-01-30
CN102898032B (zh) 2016-04-27

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