JP5576885B2 - 補強層を伴う半導体チップ - Google Patents
補強層を伴う半導体チップ Download PDFInfo
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- JP5576885B2 JP5576885B2 JP2011550323A JP2011550323A JP5576885B2 JP 5576885 B2 JP5576885 B2 JP 5576885B2 JP 2011550323 A JP2011550323 A JP 2011550323A JP 2011550323 A JP2011550323 A JP 2011550323A JP 5576885 B2 JP5576885 B2 JP 5576885B2
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Description
Claims (21)
- 不動態化層(55)を有する半導体チップ(15)を提供することと、
中央部分(65)及び前記中央部分から空間的に分離される第1のフレーム部分(70)を伴うポリマ層(60)を前記不動態化層(55)上に形成して、前記不動態化層(55)にまで延びてはいるが前記不動態化層(55)を貫通してはいない第1のチャネル(80)を画定することとを備えた製造の方法。 - 複数の半田構造(90)を前記中央部分(65)に結合することを備えた請求項1の方法。
- 長方形設置面を伴う前記第1のフレーム部分(70)を形成することを備えた請求項1の方法。
- 蛇行設置面を伴う前記第1のチャネル(80’)を画定する前記第1のフレーム部分(70)を形成することを備えた請求項1の方法。
- 前記半導体チップ(15”)の前記不動態化層(55)から外側に向く前記第1のフレーム部分(75”)の表面内に溝(250a)を形成することを備えた請求項1の方法。
- 前記溝(250a)は前記第1のフレーム部分(75”)の周囲にわたって延在する請求項5の方法。
- 前記第1のフレーム部分(70)からから空間的に分離される第2のフレーム部分(75)を伴う前記ポリマ層(60)を形成して第2のチャネル(85)を画定することを備えた請求項1の方法。
- 中央部分(65)及び前記中央部分から空間的に分離される第1のフレーム部分(70)を有するポリマ層(60)を半導体チップ(15)の不動態化層(55)上に形成して、前記不動態化層(55)にまで延びてはいるが前記不動態化層(55)を貫通してはいない第1のチャネル(80)を画定することと、
前記不動態化層(55)が基板(20)に対向するが接合部領域を残して前記基板(20)からは分離されている状態で前記半導体チップ(15)を前記基板(20)に結合することと、
前記接合部領域内に下層充填(30)を配置することとを備えた製造の方法であって、
前記下層充填の一部分が前記チャネル(80)内に侵入して前記ポリマ層(60)と前記下層充填(30)の間の機械的な結合を確立する製造の方法。 - 前記半導体チップ(15)と前記基板(20)の間に複数の相互接続(105,110)を形成することを備えた請求項8の方法。
- 前記相互接続は半田接合を備えている請求項9の方法。
- 長方形設置面を伴う前記第1のフレーム部分(70)を形成することを備えた請求項8の方法。
- 前記第1のフレーム部分を形成して長方形の設置面を伴う前記第1のチャネル(80)を画定することを備えた請求項11の方法。
- 前記第1のフレーム部分を形成して蛇行設置面を伴う前記第1のチャネル(80’)を画定することを備えた請求項8の方法。
- 前記半導体チップ(15”)の前記不動態化層(55)から外側に向く前記第1のフレーム部分(75”)の表面内に溝(250a)を形成することを備えた請求項8の方法。
- 前記溝(250a)は前記第1のフレーム部分の周囲にわたって延在する請求項14の方法。
- 前記第1のフレーム部分からから空間的に分離される第2のフレーム部分を伴う前記ポリマ層を形成して第2のチャネルを画定することを備えた請求項8の方法。
- 不動態化層(55)を有する半導体チップ(15)と、前記不動態化層(55)上のポリマ層(60)とを備えた装置であって、
前記ポリマ層(60)は前記不動態化層(55)にまで延びてはいるが前記不動態化層(55)を貫通してはいない第1のチャネル(80)を画定するために中央部分(65)と前記中央部分(65)から空間的に分離される第1のフレーム部分(70)とを有している装置。 - 前記中央部分に結合される複数の半田構造(115)を備えた請求項17の装置。
- 前記第1のフレーム部分(70)は長方形の設置面を備えている請求項17の装置。
- 前記第1のチャネル(80)は長方形の設置面を備えている請求項19の装置。
- 前記第1のチャネル(80’)は蛇行設置面を備えている請求項17の装置。
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US12/388,092 | 2009-02-18 | ||
US12/388,092 US7897433B2 (en) | 2009-02-18 | 2009-02-18 | Semiconductor chip with reinforcement layer and method of making the same |
PCT/US2010/024462 WO2010096473A2 (en) | 2009-02-18 | 2010-02-17 | Semiconductor chip with reinforcement layer |
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JP2012518282A5 JP2012518282A5 (ja) | 2013-04-04 |
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EP (1) | EP2399284B1 (ja) |
JP (1) | JP5576885B2 (ja) |
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CN (1) | CN102318051B (ja) |
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WO2010096473A3 (en) | 2011-02-03 |
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