JP5568221B2 - 電子回路部品装着システム - Google Patents
電子回路部品装着システム Download PDFInfo
- Publication number
- JP5568221B2 JP5568221B2 JP2008151135A JP2008151135A JP5568221B2 JP 5568221 B2 JP5568221 B2 JP 5568221B2 JP 2008151135 A JP2008151135 A JP 2008151135A JP 2008151135 A JP2008151135 A JP 2008151135A JP 5568221 B2 JP5568221 B2 JP 5568221B2
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- Prior art keywords
- electronic circuit
- holding
- nozzle
- head
- circuit component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Images
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- Supply And Installment Of Electrical Components (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008151135A JP5568221B2 (ja) | 2008-06-09 | 2008-06-09 | 電子回路部品装着システム |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008151135A JP5568221B2 (ja) | 2008-06-09 | 2008-06-09 | 電子回路部品装着システム |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2009295946A JP2009295946A (ja) | 2009-12-17 |
| JP2009295946A5 JP2009295946A5 (enExample) | 2011-07-14 |
| JP5568221B2 true JP5568221B2 (ja) | 2014-08-06 |
Family
ID=41543836
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008151135A Active JP5568221B2 (ja) | 2008-06-09 | 2008-06-09 | 電子回路部品装着システム |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5568221B2 (enExample) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2010033576A1 (en) | 2008-09-16 | 2010-03-25 | University Of Central Florida Research Foundation, Inc. | Compositions for treating or delaying the onset of hair loss |
| JP5772461B2 (ja) * | 2011-09-30 | 2015-09-02 | 富士通株式会社 | 部品搬送装置及び部品搬送方法 |
| JP6008936B2 (ja) * | 2012-02-28 | 2016-10-19 | 富士機械製造株式会社 | 太陽電池製造用のストリング装置 |
| EP3057392B1 (en) | 2013-10-11 | 2020-07-08 | FUJI Corporation | Suction nozzle and component mounting apparatus |
| JP6770069B2 (ja) * | 2016-06-17 | 2020-10-14 | 株式会社Ｆｕｊｉ | 測定装置 |
| WO2018020682A1 (ja) * | 2016-07-29 | 2018-02-01 | 富士機械製造株式会社 | 部品装着機 |
| JP6438503B2 (ja) * | 2017-02-03 | 2018-12-12 | ファナック株式会社 | 部品供給装置およびそれを備える部品供給ロボット |
| CN116600493B (zh) * | 2023-07-17 | 2023-09-19 | 深圳市易通自动化设备有限公司 | 一种双联飞达 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2861135B2 (ja) * | 1989-10-26 | 1999-02-24 | 松下電工株式会社 | 部品実装方法 |
| JP2990866B2 (ja) * | 1991-07-04 | 1999-12-13 | 松下電器産業株式会社 | 電子部品実装装置 |
| JPH07116984A (ja) * | 1993-08-30 | 1995-05-09 | Sanyo Electric Co Ltd | ロボットハンド及びそれを使用した部品供給装置 |
| JPH10107495A (ja) * | 1996-09-26 | 1998-04-24 | Matsushita Electric Ind Co Ltd | 部品装着装置 |
| JP2000307296A (ja) * | 1999-04-19 | 2000-11-02 | Ricoh Microelectronics Co Ltd | マウンタおよび電子機器 |
-
2008
- 2008-06-09 JP JP2008151135A patent/JP5568221B2/ja active Active
Also Published As
| Publication number | Publication date |
|---|---|
| JP2009295946A (ja) | 2009-12-17 |
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