JP5566359B2 - 部品装着装置 - Google Patents

部品装着装置 Download PDF

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Publication number
JP5566359B2
JP5566359B2 JP2011215557A JP2011215557A JP5566359B2 JP 5566359 B2 JP5566359 B2 JP 5566359B2 JP 2011215557 A JP2011215557 A JP 2011215557A JP 2011215557 A JP2011215557 A JP 2011215557A JP 5566359 B2 JP5566359 B2 JP 5566359B2
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JP
Japan
Prior art keywords
led element
phosphor
light
camera
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2011215557A
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English (en)
Japanese (ja)
Other versions
JP2013077648A5 (enExample
JP2013077648A (ja
Inventor
善紀 池田
章祐 川合
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi High Tech Corp
Original Assignee
Hitachi High Tech Instruments Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi High Tech Instruments Co Ltd filed Critical Hitachi High Tech Instruments Co Ltd
Priority to JP2011215557A priority Critical patent/JP5566359B2/ja
Priority to CN201210369549.9A priority patent/CN103079392B/zh
Priority to KR1020120109039A priority patent/KR101562692B1/ko
Publication of JP2013077648A publication Critical patent/JP2013077648A/ja
Publication of JP2013077648A5 publication Critical patent/JP2013077648A5/ja
Application granted granted Critical
Publication of JP5566359B2 publication Critical patent/JP5566359B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Operations Research (AREA)
  • Supply And Installment Of Electrical Components (AREA)
JP2011215557A 2011-09-29 2011-09-29 部品装着装置 Active JP5566359B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2011215557A JP5566359B2 (ja) 2011-09-29 2011-09-29 部品装着装置
CN201210369549.9A CN103079392B (zh) 2011-09-29 2012-09-27 部件安装装置
KR1020120109039A KR101562692B1 (ko) 2011-09-29 2012-09-28 부품 장착 장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011215557A JP5566359B2 (ja) 2011-09-29 2011-09-29 部品装着装置

Publications (3)

Publication Number Publication Date
JP2013077648A JP2013077648A (ja) 2013-04-25
JP2013077648A5 JP2013077648A5 (enExample) 2014-01-23
JP5566359B2 true JP5566359B2 (ja) 2014-08-06

Family

ID=48155757

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011215557A Active JP5566359B2 (ja) 2011-09-29 2011-09-29 部品装着装置

Country Status (3)

Country Link
JP (1) JP5566359B2 (enExample)
KR (1) KR101562692B1 (enExample)
CN (1) CN103079392B (enExample)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6259274B2 (ja) * 2012-12-11 2018-01-10 ヤマハ発動機株式会社 部品装着装置
AT513747B1 (de) 2013-02-28 2014-07-15 Mikroelektronik Ges Mit Beschränkter Haftung Ab Bestückungsverfahren für Schaltungsträger und Schaltungsträger
JP6190172B2 (ja) * 2013-06-12 2017-08-30 ヤマハ発動機株式会社 部品装着装置
KR101497919B1 (ko) * 2013-07-16 2015-03-11 미래산업 주식회사 마운터용 실장좌표 획득장치, 마운터, 및 이를 이용한 렌즈 실장방법
JP5903563B2 (ja) * 2013-08-19 2016-04-13 パナソニックＩｐマネジメント株式会社 部品実装装置
JP6450923B2 (ja) * 2013-12-20 2019-01-16 パナソニックＩｐマネジメント株式会社 電子部品実装システムおよび電子部品実装方法ならびに電子部品実装装置
JP6263028B2 (ja) * 2013-12-27 2018-01-17 ヤマハ発動機株式会社 部品装着装置
DE102014101901B4 (de) * 2014-02-14 2015-10-15 Asm Assembly Systems Gmbh & Co. Kg Optisches Vermessen eines Bauelementes mit an gegenüberliegenden Seiten vorhandenen strukturellen Merkmalen
DE102014210654B4 (de) 2014-06-04 2023-08-31 Automotive Lighting Reutlingen Gmbh Kraftfahrzeugscheinwerfer umfassend ein SMD-Halbleiterlichtquellenbauteil auf einer Leiterplatte
KR102022473B1 (ko) * 2014-07-04 2019-09-18 한화정밀기계 주식회사 테이프 실장 장치
CN106537615B (zh) 2014-08-04 2019-08-20 株式会社富士 安装装置
AT516638A1 (de) * 2014-12-17 2016-07-15 A B Mikroelektronik Ges Mit Beschränkter Haftung Verfahren zur Herstellung eines Schaltungsträgers und Schaltungsträger
AT517259B1 (de) * 2015-06-09 2020-01-15 Zkw Group Gmbh Verfahren zur positionsgenauen Bestückung eines Schaltungsträgers
JP6860440B2 (ja) * 2017-07-20 2021-04-14 日本メクトロン株式会社 基板位置認識装置、位置認識加工装置および基板製造方法
JP7075498B2 (ja) * 2018-10-02 2022-05-25 株式会社Fuji 作業機

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3090567B2 (ja) * 1993-12-29 2000-09-25 ヤマハ発動機株式会社 実装機における部品認識方法および同装置
JP3412224B2 (ja) * 1994-01-07 2003-06-03 住友電気工業株式会社 レンズ実装方法と装置
US6867421B1 (en) * 1998-12-29 2005-03-15 Bayer Materialscience Llc In-line process for monitoring binder dosage and distribution on a surface and apparatus useful therefor
KR101101132B1 (ko) * 2007-11-23 2012-01-12 삼성엘이디 주식회사 발광소자 검사장치 및 이를 이용한 발광소자 검사방법
JP2010225791A (ja) * 2009-03-23 2010-10-07 Stanley Electric Co Ltd 半導体発光装置
JP4797081B2 (ja) * 2009-04-10 2011-10-19 シークス株式会社 レンズ部品の実装方法
CN201903509U (zh) * 2010-12-08 2011-07-20 昆山琉明光电有限公司 Led检查装置

Also Published As

Publication number Publication date
KR20130035235A (ko) 2013-04-08
CN103079392A (zh) 2013-05-01
CN103079392B (zh) 2016-05-11
KR101562692B1 (ko) 2015-10-22
JP2013077648A (ja) 2013-04-25

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