JP5552653B2 - 基板の処理装置および基板の処理方法 - Google Patents

基板の処理装置および基板の処理方法 Download PDF

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JP5552653B2
JP5552653B2 JP2013006141A JP2013006141A JP5552653B2 JP 5552653 B2 JP5552653 B2 JP 5552653B2 JP 2013006141 A JP2013006141 A JP 2013006141A JP 2013006141 A JP2013006141 A JP 2013006141A JP 5552653 B2 JP5552653 B2 JP 5552653B2
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temperature
substrate
etching solution
etching
pure water
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JP2013077843A5 (enExample
JP2013077843A (ja
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直明 桜井
英明 平林
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Toshiba Corp
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JP2013006141A 2013-01-17 2013-01-17 基板の処理装置および基板の処理方法 Expired - Fee Related JP5552653B2 (ja)

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JP2013077843A5 JP2013077843A5 (enExample) 2013-06-06
JP5552653B2 true JP5552653B2 (ja) 2014-07-16

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Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6473592B2 (ja) * 2014-09-29 2019-02-20 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
US9966282B2 (en) * 2014-09-30 2018-05-08 Shibaura Mechatronics Corporation Substrate processing apparatus and substrate processing method
JP6654534B2 (ja) 2016-09-15 2020-02-26 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
CN110383428B (zh) 2017-03-10 2023-04-04 三菱电机株式会社 半导体制造装置以及半导体制造方法
JP7412990B2 (ja) * 2019-12-04 2024-01-15 東京エレクトロン株式会社 基板処理装置、および基板処理方法
CN114420552B (zh) * 2021-12-31 2025-10-03 上海至纯洁净系统科技股份有限公司 一种基于流场控制的高温蚀刻方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0774140A (ja) * 1993-09-02 1995-03-17 Toshiba Corp 半導体装置の製造装置
JP2000119874A (ja) * 1998-10-07 2000-04-25 Toshiba Corp 基板処理装置
JP2006165372A (ja) * 2004-12-09 2006-06-22 Matsushita Electric Ind Co Ltd 枚葉式洗浄装置および洗浄方法
JP2006344907A (ja) * 2005-06-10 2006-12-21 Dainippon Screen Mfg Co Ltd 基板処理方法および基板処理装置
JP5173502B2 (ja) * 2008-03-14 2013-04-03 大日本スクリーン製造株式会社 基板処理装置および基板処理方法

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