JP5552044B2 - 膜堆積のための方法および装置 - Google Patents
膜堆積のための方法および装置 Download PDFInfo
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- 238000000034 method Methods 0.000 title claims description 39
- 230000008021 deposition Effects 0.000 title description 28
- 239000000758 substrate Substances 0.000 claims description 95
- 239000012705 liquid precursor Substances 0.000 claims description 61
- 238000000151 deposition Methods 0.000 claims description 40
- 239000012530 fluid Substances 0.000 claims description 35
- 239000000463 material Substances 0.000 claims description 25
- 238000004891 communication Methods 0.000 claims description 19
- 239000002245 particle Substances 0.000 claims description 17
- 239000007787 solid Substances 0.000 claims description 10
- 239000002243 precursor Substances 0.000 claims description 6
- 238000010438 heat treatment Methods 0.000 claims description 4
- 239000010408 film Substances 0.000 description 60
- 238000000576 coating method Methods 0.000 description 43
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 38
- 239000012528 membrane Substances 0.000 description 38
- 239000011248 coating agent Substances 0.000 description 37
- 239000000243 solution Substances 0.000 description 21
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 20
- 239000007888 film coating Substances 0.000 description 19
- 238000009501 film coating Methods 0.000 description 19
- 229910052763 palladium Inorganic materials 0.000 description 15
- 238000007772 electroless plating Methods 0.000 description 9
- 238000007747 plating Methods 0.000 description 9
- 230000015572 biosynthetic process Effects 0.000 description 8
- 239000007788 liquid Substances 0.000 description 8
- 238000005234 chemical deposition Methods 0.000 description 6
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- 239000000203 mixture Substances 0.000 description 4
- 238000001878 scanning electron micrograph Methods 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 238000000137 annealing Methods 0.000 description 3
- 239000011324 bead Substances 0.000 description 3
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- 229910052739 hydrogen Inorganic materials 0.000 description 3
- 239000001257 hydrogen Substances 0.000 description 3
- 238000001027 hydrothermal synthesis Methods 0.000 description 3
- 238000001471 micro-filtration Methods 0.000 description 3
- 108090000623 proteins and genes Proteins 0.000 description 3
- 102000004169 proteins and genes Human genes 0.000 description 3
- 239000002002 slurry Substances 0.000 description 3
- 239000000725 suspension Substances 0.000 description 3
- 238000003786 synthesis reaction Methods 0.000 description 3
- 229910001252 Pd alloy Inorganic materials 0.000 description 2
- 239000011247 coating layer Substances 0.000 description 2
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- 150000002431 hydrogen Chemical class 0.000 description 2
- 239000003112 inhibitor Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000009828 non-uniform distribution Methods 0.000 description 2
- 238000000879 optical micrograph Methods 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 239000011343 solid material Substances 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 101150003085 Pdcl gene Proteins 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
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- 239000007864 aqueous solution Substances 0.000 description 1
- 239000003125 aqueous solvent Substances 0.000 description 1
- 238000000149 argon plasma sintering Methods 0.000 description 1
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- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- HNPSIPDUKPIQMN-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Al]O[Al]=O HNPSIPDUKPIQMN-UHFFFAOYSA-N 0.000 description 1
- 238000003618 dip coating Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
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- 230000004048 modification Effects 0.000 description 1
- 235000015097 nutrients Nutrition 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- -1 organic templates Substances 0.000 description 1
- 230000002572 peristaltic effect Effects 0.000 description 1
- 238000000053 physical method Methods 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000007569 slipcasting Methods 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 238000009987 spinning Methods 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
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- 239000010959 steel Substances 0.000 description 1
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- B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
- B05D7/22—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials to internal surfaces, e.g. of tubes
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
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- B01D63/06—Tubular membrane modules
- B01D63/066—Tubular membrane modules with a porous block having membrane coated passages
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B01D67/0039—Inorganic membrane manufacture
- B01D67/0046—Inorganic membrane manufacture by slurry techniques, e.g. die or slip-casting
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B01D67/00—Processes specially adapted for manufacturing semi-permeable membranes for separation processes or apparatus
- B01D67/0039—Inorganic membrane manufacture
- B01D67/0069—Inorganic membrane manufacture by deposition from the liquid phase, e.g. electrochemical deposition
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B38/00—Porous mortars, concrete, artificial stone or ceramic ware; Preparation thereof
- C04B38/0093—Other features
- C04B38/0096—Pores with coated inner walls
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
- C23C18/1204—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material inorganic material, e.g. non-oxide and non-metallic such as sulfides, nitrides based compounds
- C23C18/1208—Oxides, e.g. ceramics
- C23C18/1216—Metal oxides
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1619—Apparatus for electroless plating
- C23C18/1628—Specific elements or parts of the apparatus
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1635—Composition of the substrate
- C23C18/1644—Composition of the substrate porous substrates
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1675—Process conditions
- C23C18/1678—Heating of the substrate
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/42—Coating with noble metals
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
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- B01D2323/00—Details relating to membrane preparation
- B01D2323/42—Details of membrane preparation apparatus
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C7/00—Apparatus specially designed for applying liquid or other fluent material to the inside of hollow work
- B05C7/04—Apparatus specially designed for applying liquid or other fluent material to the inside of hollow work the liquid or other fluent material flowing or being moved through the work; the work being filled with liquid or other fluent material and emptied
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- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
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- Separation Using Semi-Permeable Membranes (AREA)
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Description
別記しない限り、外径8.7mm〜9.2mm、長さ約150mmのα−アルミナ製のモノリシック基体(「モノリシック支持体」とも呼ばれる)を本実施例において用いた。各モノリシック支持体は、モノリシック支持体の断面領域に均一に分配された19のスルーチャネルを有していた。スルーチャネルの平均直径は0.75mmであった。
実施例1に記載した方法で形成された2組の膜を用いて、乳液/水混合物のろ過を試験した。1組の膜を、4体積%のα−アルミナを含むコーティング溶液を用いて形成し(試料2A)、第2の組の膜を、6体積%のα−アルミナを含むコーティング溶液を用いて形成した(試料2B)。α−アルミナ膜の精密ろ過性能を表1に示す。
本実施例は、本明細書に記載した方法および装置を用いた膜フィルムの化学堆積を例示するものである。
2Pd(NH3)4 2++N2H4+4OH ̄→2Pd↓+N2↑+8NH3+4H2O
という化学反応により、支持体表面で合成された。
比較のために、従来の技術を用いて、無電解めっきを行った。第2のγ−アルミナモノリシック支持体を、めっき溶液433、436と同じ組成を有するめっき溶液を含むビーカーに浸漬した。
Claims (3)
- 基体に配置された複数のスルーチャネルに成膜する方法であって、
a.第1の端部と、第2の端部と、前記第1の端部から第2の端部まで前記基体を通して延在する複数のスルーチャネルとを有する前記基体を、入口セクションと、中間セクションと、出口セクションとを有するチャンバに提供する工程であって、前記基体は前記中間セクションに配置されて、前記第1の端部が前記入口セクションに近接して、流体連通し、前記第2の端部が前記出口セクションに近接して、流体連通するようにする工程と、
b.複数の固体粒子を含む成膜材料を含む液体前駆体を、前記入口セクションに提供する工程と、
c.前記入口セクションと前記出口セクションとの間に、前記液体前駆体が前記複数のスルーチャネルを均一に流れるよう圧力差を提供する工程と、
d.熱源によって前記チャンバおよび前記基体を加熱し所定の温度に維持しながら、前記圧力差により前記複数のスルーチャネルの表面に成膜する工程であって、前記液体前駆体の前記複数の固体粒子を、前記複数のスルーチャネルの少なくとも一部の表面に移動し、前記複数の固体粒子を前記表面に堆積して成膜する工程と、
を含むことを特徴とする方法。 - 前記複数のスルーチャネルの表面に成膜する工程が、前記成膜材料を前記表面と、または互いに反応させて成膜する工程であることを特徴とする請求項1に記載の方法。
- a.複数の固体粒子を含む成膜材料を含む液体前駆体を供給する液体前駆体源と、
b.チャンバであって、
i.第1の端部と、第2の端部と、前記第1の端部から第2の端部まで基体を通して延在する複数のスルーチャネルとを有する基体を支持するように構成された中間セクションと、
ii.前記基体の前記第1の端部と接触している、前記中間セクションに近接していて、前記液体前駆体源および前記基体の前記第1の端部と流体連通していて、前記液体前駆体を前記基体の前記第1の端部に均一に分配することのできる入口セクションと、
iii.前記基体の前記第2の端部に近接して、流体連通していて、前記基体の前記第2の端部から流体を均一に放出し、前記流体を前記チャンバから結果として除去することのできる出口セクションと、
を含むチャンバと、
c.前記チャンバに結合し、前記入口セクションと前記出口セクションの少なくとも1つと流体連通していて、前記複数のスルーチャネルを通して、前記第1の端部と前記第2の端部との間に圧力差を与える加圧システムと、
d.前記液体前駆体が前記複数のスルーチャネルを均一に流れるよう、前記加圧システムにより前記第1の端部と前記第2の端部との間に圧力差が与えられ、該圧力差により、前記液体前駆体の前記複数の固体粒子が前記複数のスルーチャネルの少なくとも一部の表面に移動させられ、前記複数の固体粒子が前記表面に堆積され成膜がなされる間において、前記チャンバおよび前記基体を加熱し所定の温度に維持するための熱源と、
を含むことを特徴とする、膜を堆積するための装置。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/729,732 US8006637B2 (en) | 2007-03-29 | 2007-03-29 | Method and apparatus for membrane deposition |
US11/729,732 | 2007-03-29 | ||
PCT/US2008/003894 WO2008121275A2 (en) | 2007-03-29 | 2008-03-25 | Method and apparatus for membrane deposition |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2010522827A JP2010522827A (ja) | 2010-07-08 |
JP5552044B2 true JP5552044B2 (ja) | 2014-07-16 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010500959A Active JP5552044B2 (ja) | 2007-03-29 | 2008-03-25 | 膜堆積のための方法および装置 |
Country Status (5)
Country | Link |
---|---|
US (2) | US8006637B2 (ja) |
EP (1) | EP2061597B1 (ja) |
JP (1) | JP5552044B2 (ja) |
CN (1) | CN101646496A (ja) |
WO (1) | WO2008121275A2 (ja) |
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US20080237919A1 (en) | 2008-10-02 |
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US8006637B2 (en) | 2011-08-30 |
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