JP5549340B2 - 振動片、振動片の製造方法、振動デバイスおよび電子機器 - Google Patents

振動片、振動片の製造方法、振動デバイスおよび電子機器 Download PDF

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Publication number
JP5549340B2
JP5549340B2 JP2010092030A JP2010092030A JP5549340B2 JP 5549340 B2 JP5549340 B2 JP 5549340B2 JP 2010092030 A JP2010092030 A JP 2010092030A JP 2010092030 A JP2010092030 A JP 2010092030A JP 5549340 B2 JP5549340 B2 JP 5549340B2
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Prior art keywords
layer
piezoelectric
vibrating
electrode layer
vibrating arm
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JP2010092030A
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Japanese (ja)
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JP2011223435A (ja
JP2011223435A5 (enExample
Inventor
剛夫 舟川
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Seiko Epson Corp
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Seiko Epson Corp
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  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
JP2010092030A 2010-04-13 2010-04-13 振動片、振動片の製造方法、振動デバイスおよび電子機器 Expired - Fee Related JP5549340B2 (ja)

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JP2010092030A JP5549340B2 (ja) 2010-04-13 2010-04-13 振動片、振動片の製造方法、振動デバイスおよび電子機器

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JP2010092030A JP5549340B2 (ja) 2010-04-13 2010-04-13 振動片、振動片の製造方法、振動デバイスおよび電子機器

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JP2011223435A JP2011223435A (ja) 2011-11-04
JP2011223435A5 JP2011223435A5 (enExample) 2013-04-18
JP5549340B2 true JP5549340B2 (ja) 2014-07-16

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JP2010092030A Expired - Fee Related JP5549340B2 (ja) 2010-04-13 2010-04-13 振動片、振動片の製造方法、振動デバイスおよび電子機器

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Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102629861A (zh) 2011-02-02 2012-08-08 精工爱普生株式会社 振动片、振子、振荡器以及电子设备
JP5685962B2 (ja) 2011-02-02 2015-03-18 セイコーエプソン株式会社 振動片、振動子、発振器及び電子機器
JP2014170998A (ja) * 2013-03-01 2014-09-18 Seiko Epson Corp Ｍｅｍｓ素子、電子デバイス、電子機器および移動体
JP6482169B2 (ja) 2013-07-19 2019-03-13 セイコーエプソン株式会社 振動片、振動子、発振器、電子機器及び移動体

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3954395B2 (ja) * 2001-10-26 2007-08-08 富士通株式会社 圧電薄膜共振子、フィルタ、および圧電薄膜共振子の製造方法
JP2005136115A (ja) * 2003-10-30 2005-05-26 Tdk Corp 電子デバイス及びその製造方法
JP4693406B2 (ja) * 2004-12-28 2011-06-01 京セラキンセキ株式会社 圧電薄膜デバイス及びその製造方法
JP4404218B2 (ja) * 2006-03-29 2010-01-27 セイコーエプソン株式会社 音叉振動子およびその製造方法
JP4533934B2 (ja) * 2008-01-15 2010-09-01 エプソントヨコム株式会社 振動片及び振動子の製造方法
JP5444662B2 (ja) * 2008-08-25 2014-03-19 ソニー株式会社 圧電デバイスの製造方法
JP2010081156A (ja) * 2008-09-25 2010-04-08 Seiko Epson Corp 圧電薄膜振動片、圧電薄膜振動片の製造方法、圧電薄膜振動子及び発振回路

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