JP5530432B2 - Ｍｅｍｓ装置を作成するための方法 - Google Patents

Ｍｅｍｓ装置を作成するための方法 Download PDF

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Publication number
JP5530432B2
JP5530432B2 JP2011517119A JP2011517119A JP5530432B2 JP 5530432 B2 JP5530432 B2 JP 5530432B2 JP 2011517119 A JP2011517119 A JP 2011517119A JP 2011517119 A JP2011517119 A JP 2011517119A JP 5530432 B2 JP5530432 B2 JP 5530432B2
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Japan
Prior art keywords
layer
covering layer
container
mst
coating layer
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Expired - Fee Related
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JP2011517119A
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English (en)
Japanese (ja)
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JP2011527241A (ja
JP2011527241A5 (enExample
Inventor
パール，ボルフガング
ファイエルターク，グレゴール
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TDK Electronics AG
Original Assignee
Epcos AG
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Publication date
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Publication of JP2011527241A publication Critical patent/JP2011527241A/ja
Publication of JP2011527241A5 publication Critical patent/JP2011527241A5/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00261—Processes for packaging MEMS devices
    • B81C1/00309—Processes for packaging MEMS devices suitable for fluid transfer from the MEMS out of the package or vice versa, e.g. transfer of liquid, gas, sound
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00023—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems without movable or flexible elements
    • B81C1/00047—Cavities
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0257—Microphones or microspeakers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0264—Pressure sensors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Micromachines (AREA)
  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
JP2011517119A 2008-07-09 2009-07-06 Ｍｅｍｓ装置を作成するための方法 Expired - Fee Related JP5530432B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102008032319.5 2008-07-09
DE102008032319A DE102008032319B4 (de) 2008-07-09 2008-07-09 Verfahren zur Herstellung eines MST Bauteils
PCT/EP2009/058520 WO2010003925A2 (de) 2008-07-09 2009-07-06 Verfahren zur herstellung eines mst bauteils und mst bauteil

Publications (3)

Publication Number Publication Date
JP2011527241A JP2011527241A (ja) 2011-10-27
JP2011527241A5 JP2011527241A5 (enExample) 2012-04-05
JP5530432B2 true JP5530432B2 (ja) 2014-06-25

Family

ID=41412672

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011517119A Expired - Fee Related JP5530432B2 (ja) 2008-07-09 2009-07-06 Ｍｅｍｓ装置を作成するための方法

Country Status (5)

Country Link
US (1) US9051174B2 (enExample)
JP (1) JP5530432B2 (enExample)
DE (1) DE102008032319B4 (enExample)
GB (1) GB2475186B (enExample)
WO (1) WO2010003925A2 (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8542850B2 (en) * 2007-09-12 2013-09-24 Epcos Pte Ltd Miniature microphone assembly with hydrophobic surface coating
DE102007058951B4 (de) * 2007-12-07 2020-03-26 Snaptrack, Inc. MEMS Package
DE102010006132B4 (de) 2010-01-29 2013-05-08 Epcos Ag Miniaturisiertes elektrisches Bauelement mit einem Stapel aus einem MEMS und einem ASIC
DE102012101505B4 (de) * 2012-02-24 2016-03-03 Epcos Ag Verfahren zur Herstellung eines Sensors
JP2013211505A (ja) * 2012-03-02 2013-10-10 Fujifilm Corp 半導体装置の製造方法
US8987871B2 (en) * 2012-05-31 2015-03-24 Stmicroelectronics Pte Ltd. Cap for a microelectromechanical system device with electromagnetic shielding, and method of manufacture
US9002038B2 (en) 2012-09-10 2015-04-07 Robert Bosch Gmbh MEMS microphone package with molded interconnect device
DE102014106818B3 (de) * 2014-05-14 2015-11-12 Epcos Ag Mikrofon
US10575374B2 (en) * 2018-03-09 2020-02-25 Ledengin, Inc. Package for flip-chip LEDs with close spacing of LED chips

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0510838A (ja) * 1991-07-08 1993-01-19 Mitsubishi Electric Corp 圧力検出装置
JPH11230846A (ja) * 1998-02-09 1999-08-27 Denso Corp 半導体力学量センサの製造方法
US7166910B2 (en) * 2000-11-28 2007-01-23 Knowles Electronics Llc Miniature silicon condenser microphone
US6781231B2 (en) * 2002-09-10 2004-08-24 Knowles Electronics Llc Microelectromechanical system package with environmental and interference shield
DE10342981B4 (de) * 2003-09-17 2007-05-24 Disco Hi-Tec Europe Gmbh Verfahren zum selektiven Aufbringen einer Folie auf definierte Bereiche eines Wafers
EP1720794A2 (en) * 2004-03-01 2006-11-15 Tessera, Inc. Packaged acoustic and electromagnetic transducer chips
WO2005086535A1 (ja) 2004-03-09 2005-09-15 Matsushita Electric Industrial Co., Ltd. エレクトレットコンデンサーマイクロホン
US7202552B2 (en) * 2005-07-15 2007-04-10 Silicon Matrix Pte. Ltd. MEMS package using flexible substrates, and method thereof
DE102005053765B4 (de) * 2005-11-10 2016-04-14 Epcos Ag MEMS-Package und Verfahren zur Herstellung
US7936062B2 (en) * 2006-01-23 2011-05-03 Tessera Technologies Ireland Limited Wafer level chip packaging
DE102006017115B4 (de) * 2006-04-10 2008-08-28 Infineon Technologies Ag Halbleiterbauteil mit einem Kunststoffgehäuse und Verfahren zu seiner Herstellung
DE102006005419B4 (de) * 2006-02-03 2019-05-02 Infineon Technologies Ag Mikroelektromechanisches Halbleiterbauelement mit Hohlraumstruktur und Verfahren zur Herstellung desselben
DE102006046292B9 (de) * 2006-09-29 2014-04-30 Epcos Ag Bauelement mit MEMS-Mikrofon und Verfahren zur Herstellung

Also Published As

Publication number Publication date
DE102008032319B4 (de) 2012-06-06
WO2010003925A3 (de) 2010-05-06
GB201101277D0 (en) 2011-03-09
US20110180885A1 (en) 2011-07-28
GB2475186A (en) 2011-05-11
JP2011527241A (ja) 2011-10-27
US9051174B2 (en) 2015-06-09
DE102008032319A1 (de) 2010-01-14
WO2010003925A2 (de) 2010-01-14
GB2475186B (en) 2012-10-10

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