WO2010003925A3 - Verfahren zur verkapselung eines mems bauteils - Google Patents

Verfahren zur verkapselung eines mems bauteils Download PDF

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Publication number
WO2010003925A3
WO2010003925A3 PCT/EP2009/058520 EP2009058520W WO2010003925A3 WO 2010003925 A3 WO2010003925 A3 WO 2010003925A3 EP 2009058520 W EP2009058520 W EP 2009058520W WO 2010003925 A3 WO2010003925 A3 WO 2010003925A3
Authority
WO
WIPO (PCT)
Prior art keywords
cover layer
encapsulating
outer area
mems component
container
Prior art date
Application number
PCT/EP2009/058520
Other languages
English (en)
French (fr)
Other versions
WO2010003925A2 (de
Inventor
Wolfgang Pahl
Gregor Feiertag
Original Assignee
Epcos Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Epcos Ag filed Critical Epcos Ag
Priority to JP2011517119A priority Critical patent/JP5530432B2/ja
Priority to US13/003,148 priority patent/US9051174B2/en
Priority to GB1101277.0A priority patent/GB2475186B/en
Publication of WO2010003925A2 publication Critical patent/WO2010003925A2/de
Publication of WO2010003925A3 publication Critical patent/WO2010003925A3/de

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00261—Processes for packaging MEMS devices
    • B81C1/00309—Processes for packaging MEMS devices suitable for fluid transfer from the MEMS out of the package or vice versa, e.g. transfer of liquid, gas, sound
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00023—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems without movable or flexible elements
    • B81C1/00047—Cavities
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0257—Microphones or microspeakers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0264—Pressure sensors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/1015—Shape
    • H01L2924/10155—Shape being other than a cuboid
    • H01L2924/10158—Shape being other than a cuboid at the passive surface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/146—Mixed devices
    • H01L2924/1461—MEMS
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
  • Micromachines (AREA)

Abstract

Es wird ein Verfahren zur Herstellung eines elektromechanischen Wandlers beschrieben, bei dem - ein MST Bauelement in einem Behälter angeordnet wird, und - der Behälter mit einer Deckschicht verschlossen wird, wobei - die Deckschicht mit zumindest einer Aussparung versehen wird, die die Deckschicht in einen inneren und einen äußeren Bereich derart aufteilt, dass sowohl der innere als auch der äußere Bereich mit der der Deckschicht zugewandten Oberseite des MST Bauelement (3) verbunden sind, und — der innere Bereich abgehoben wird während der äußere Bereich haften bleibt.
PCT/EP2009/058520 2008-07-09 2009-07-06 Verfahren zur herstellung eines mst bauteils und mst bauteil WO2010003925A2 (de)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2011517119A JP5530432B2 (ja) 2008-07-09 2009-07-06 Ｍｅｍｓ装置を作成するための方法
US13/003,148 US9051174B2 (en) 2008-07-09 2009-07-06 Method for encapsulating an MEMS component
GB1101277.0A GB2475186B (en) 2008-07-09 2009-07-06 A method of manufacturing an MST device and MST device

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102008032319A DE102008032319B4 (de) 2008-07-09 2008-07-09 Verfahren zur Herstellung eines MST Bauteils
DE102008032319.5 2008-07-09

Publications (2)

Publication Number Publication Date
WO2010003925A2 WO2010003925A2 (de) 2010-01-14
WO2010003925A3 true WO2010003925A3 (de) 2010-05-06

Family

ID=41412672

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2009/058520 WO2010003925A2 (de) 2008-07-09 2009-07-06 Verfahren zur herstellung eines mst bauteils und mst bauteil

Country Status (5)

Country Link
US (1) US9051174B2 (de)
JP (1) JP5530432B2 (de)
DE (1) DE102008032319B4 (de)
GB (1) GB2475186B (de)
WO (1) WO2010003925A2 (de)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8542850B2 (en) * 2007-09-12 2013-09-24 Epcos Pte Ltd Miniature microphone assembly with hydrophobic surface coating
DE102007058951B4 (de) * 2007-12-07 2020-03-26 Snaptrack, Inc. MEMS Package
DE102010006132B4 (de) 2010-01-29 2013-05-08 Epcos Ag Miniaturisiertes elektrisches Bauelement mit einem Stapel aus einem MEMS und einem ASIC
DE102012101505B4 (de) 2012-02-24 2016-03-03 Epcos Ag Verfahren zur Herstellung eines Sensors
JP2013211505A (ja) * 2012-03-02 2013-10-10 Fujifilm Corp 半導体装置の製造方法
US8987871B2 (en) * 2012-05-31 2015-03-24 Stmicroelectronics Pte Ltd. Cap for a microelectromechanical system device with electromagnetic shielding, and method of manufacture
TWI606731B (zh) 2012-09-10 2017-11-21 博世股份有限公司 麥克風封裝件及製造麥克風封裝件之方法
DE102014106818B3 (de) * 2014-05-14 2015-11-12 Epcos Ag Mikrofon
US10575374B2 (en) * 2018-03-09 2020-02-25 Ledengin, Inc. Package for flip-chip LEDs with close spacing of LED chips

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1722596A1 (de) * 2004-03-09 2006-11-15 Matsushita Electric Industrial Co., Ltd. Elektretkondensatormikrofon
US20070013036A1 (en) * 2005-07-15 2007-01-18 Silicon Matrix Pte Ltd MEMS package using flexible substrates, and method thereof

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0510838A (ja) * 1991-07-08 1993-01-19 Mitsubishi Electric Corp 圧力検出装置
JPH11230846A (ja) * 1998-02-09 1999-08-27 Denso Corp 半導体力学量センサの製造方法
US7166910B2 (en) 2000-11-28 2007-01-23 Knowles Electronics Llc Miniature silicon condenser microphone
US6781231B2 (en) 2002-09-10 2004-08-24 Knowles Electronics Llc Microelectromechanical system package with environmental and interference shield
DE10342981B4 (de) * 2003-09-17 2007-05-24 Disco Hi-Tec Europe Gmbh Verfahren zum selektiven Aufbringen einer Folie auf definierte Bereiche eines Wafers
US20050189635A1 (en) * 2004-03-01 2005-09-01 Tessera, Inc. Packaged acoustic and electromagnetic transducer chips
DE102005053765B4 (de) * 2005-11-10 2016-04-14 Epcos Ag MEMS-Package und Verfahren zur Herstellung
US7936062B2 (en) * 2006-01-23 2011-05-03 Tessera Technologies Ireland Limited Wafer level chip packaging
DE102006005419B4 (de) * 2006-02-03 2019-05-02 Infineon Technologies Ag Mikroelektromechanisches Halbleiterbauelement mit Hohlraumstruktur und Verfahren zur Herstellung desselben
DE102006017115B4 (de) 2006-04-10 2008-08-28 Infineon Technologies Ag Halbleiterbauteil mit einem Kunststoffgehäuse und Verfahren zu seiner Herstellung
DE102006046292B9 (de) * 2006-09-29 2014-04-30 Epcos Ag Bauelement mit MEMS-Mikrofon und Verfahren zur Herstellung

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1722596A1 (de) * 2004-03-09 2006-11-15 Matsushita Electric Industrial Co., Ltd. Elektretkondensatormikrofon
US20070013036A1 (en) * 2005-07-15 2007-01-18 Silicon Matrix Pte Ltd MEMS package using flexible substrates, and method thereof

Also Published As

Publication number Publication date
GB2475186A (en) 2011-05-11
WO2010003925A2 (de) 2010-01-14
GB2475186B (en) 2012-10-10
DE102008032319A1 (de) 2010-01-14
US9051174B2 (en) 2015-06-09
JP2011527241A (ja) 2011-10-27
DE102008032319B4 (de) 2012-06-06
GB201101277D0 (en) 2011-03-09
US20110180885A1 (en) 2011-07-28
JP5530432B2 (ja) 2014-06-25

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