DE102008032319B4 - Verfahren zur Herstellung eines MST Bauteils - Google Patents

Verfahren zur Herstellung eines MST Bauteils Download PDF

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Publication number
DE102008032319B4
DE102008032319B4 DE102008032319A DE102008032319A DE102008032319B4 DE 102008032319 B4 DE102008032319 B4 DE 102008032319B4 DE 102008032319 A DE102008032319 A DE 102008032319A DE 102008032319 A DE102008032319 A DE 102008032319A DE 102008032319 B4 DE102008032319 B4 DE 102008032319B4
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DE
Germany
Prior art keywords
cover layer
mst
container
layer
component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE102008032319A
Other languages
German (de)
English (en)
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DE102008032319A1 (de
Inventor
Wolfgang Pahl
Dr. Feiertag Gregor
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TDK Corp
Original Assignee
Epcos AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Epcos AG filed Critical Epcos AG
Priority to DE102008032319A priority Critical patent/DE102008032319B4/de
Priority to JP2011517119A priority patent/JP5530432B2/ja
Priority to GB1101277.0A priority patent/GB2475186B/en
Priority to PCT/EP2009/058520 priority patent/WO2010003925A2/de
Priority to US13/003,148 priority patent/US9051174B2/en
Publication of DE102008032319A1 publication Critical patent/DE102008032319A1/de
Application granted granted Critical
Publication of DE102008032319B4 publication Critical patent/DE102008032319B4/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00261—Processes for packaging MEMS devices
    • B81C1/00309—Processes for packaging MEMS devices suitable for fluid transfer from the MEMS out of the package or vice versa, e.g. transfer of liquid, gas, sound
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00023—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems without movable or flexible elements
    • B81C1/00047—Cavities
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0257—Microphones or microspeakers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0264—Pressure sensors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/1015—Shape
    • H01L2924/10155—Shape being other than a cuboid
    • H01L2924/10158—Shape being other than a cuboid at the passive surface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/146—Mixed devices
    • H01L2924/1461—MEMS
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Micromachines (AREA)
  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
DE102008032319A 2008-07-09 2008-07-09 Verfahren zur Herstellung eines MST Bauteils Active DE102008032319B4 (de)

Priority Applications (5)

Application Number Priority Date Filing Date Title
DE102008032319A DE102008032319B4 (de) 2008-07-09 2008-07-09 Verfahren zur Herstellung eines MST Bauteils
JP2011517119A JP5530432B2 (ja) 2008-07-09 2009-07-06 Ｍｅｍｓ装置を作成するための方法
GB1101277.0A GB2475186B (en) 2008-07-09 2009-07-06 A method of manufacturing an MST device and MST device
PCT/EP2009/058520 WO2010003925A2 (de) 2008-07-09 2009-07-06 Verfahren zur herstellung eines mst bauteils und mst bauteil
US13/003,148 US9051174B2 (en) 2008-07-09 2009-07-06 Method for encapsulating an MEMS component

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102008032319A DE102008032319B4 (de) 2008-07-09 2008-07-09 Verfahren zur Herstellung eines MST Bauteils

Publications (2)

Publication Number Publication Date
DE102008032319A1 DE102008032319A1 (de) 2010-01-14
DE102008032319B4 true DE102008032319B4 (de) 2012-06-06

Family

ID=41412672

Family Applications (1)

Application Number Title Priority Date Filing Date
DE102008032319A Active DE102008032319B4 (de) 2008-07-09 2008-07-09 Verfahren zur Herstellung eines MST Bauteils

Country Status (5)

Country Link
US (1) US9051174B2 (enExample)
JP (1) JP5530432B2 (enExample)
DE (1) DE102008032319B4 (enExample)
GB (1) GB2475186B (enExample)
WO (1) WO2010003925A2 (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8542850B2 (en) * 2007-09-12 2013-09-24 Epcos Pte Ltd Miniature microphone assembly with hydrophobic surface coating
DE102007058951B4 (de) * 2007-12-07 2020-03-26 Snaptrack, Inc. MEMS Package
DE102010006132B4 (de) 2010-01-29 2013-05-08 Epcos Ag Miniaturisiertes elektrisches Bauelement mit einem Stapel aus einem MEMS und einem ASIC
DE102012101505B4 (de) 2012-02-24 2016-03-03 Epcos Ag Verfahren zur Herstellung eines Sensors
JP2013211505A (ja) * 2012-03-02 2013-10-10 Fujifilm Corp 半導体装置の製造方法
US8987871B2 (en) * 2012-05-31 2015-03-24 Stmicroelectronics Pte Ltd. Cap for a microelectromechanical system device with electromagnetic shielding, and method of manufacture
EP2893713B1 (en) 2012-09-10 2020-08-12 Robert Bosch GmbH Mems microphone package with molded interconnect device
DE102014106818B3 (de) * 2014-05-14 2015-11-12 Epcos Ag Mikrofon
US10575374B2 (en) * 2018-03-09 2020-02-25 Ledengin, Inc. Package for flip-chip LEDs with close spacing of LED chips

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10342981A1 (de) * 2003-09-17 2005-04-21 Disco Hi Tec Europ Gmbh Vorrichtung zur partiellen Bearbeitung von Wafern sowie Verfahren zum selektiven Aufbringen einer Folie auf definierte Bereiche eines Wafers
DE102006005419A1 (de) * 2006-02-03 2007-08-16 Infineon Technologies Ag Mikroelektromechanisches Halbleiterbauelement mit Hohlraumstruktur und Verfahren zur Herstellung desselben
DE102006046292A1 (de) * 2006-09-29 2008-04-03 Epcos Ag Bauelement mit MEMS-Mikrofon und Verfahren zur Herstellung

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0510838A (ja) * 1991-07-08 1993-01-19 Mitsubishi Electric Corp 圧力検出装置
JPH11230846A (ja) * 1998-02-09 1999-08-27 Denso Corp 半導体力学量センサの製造方法
US7166910B2 (en) * 2000-11-28 2007-01-23 Knowles Electronics Llc Miniature silicon condenser microphone
US6781231B2 (en) * 2002-09-10 2004-08-24 Knowles Electronics Llc Microelectromechanical system package with environmental and interference shield
US20050189635A1 (en) * 2004-03-01 2005-09-01 Tessera, Inc. Packaged acoustic and electromagnetic transducer chips
CN1926919B (zh) 2004-03-09 2011-01-26 松下电器产业株式会社 驻极体电容式麦克风
US7202552B2 (en) * 2005-07-15 2007-04-10 Silicon Matrix Pte. Ltd. MEMS package using flexible substrates, and method thereof
DE102005053765B4 (de) * 2005-11-10 2016-04-14 Epcos Ag MEMS-Package und Verfahren zur Herstellung
US7936062B2 (en) * 2006-01-23 2011-05-03 Tessera Technologies Ireland Limited Wafer level chip packaging
DE102006017115B4 (de) * 2006-04-10 2008-08-28 Infineon Technologies Ag Halbleiterbauteil mit einem Kunststoffgehäuse und Verfahren zu seiner Herstellung

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10342981A1 (de) * 2003-09-17 2005-04-21 Disco Hi Tec Europ Gmbh Vorrichtung zur partiellen Bearbeitung von Wafern sowie Verfahren zum selektiven Aufbringen einer Folie auf definierte Bereiche eines Wafers
DE102006005419A1 (de) * 2006-02-03 2007-08-16 Infineon Technologies Ag Mikroelektromechanisches Halbleiterbauelement mit Hohlraumstruktur und Verfahren zur Herstellung desselben
DE102006046292A1 (de) * 2006-09-29 2008-04-03 Epcos Ag Bauelement mit MEMS-Mikrofon und Verfahren zur Herstellung

Also Published As

Publication number Publication date
JP5530432B2 (ja) 2014-06-25
US9051174B2 (en) 2015-06-09
WO2010003925A2 (de) 2010-01-14
GB2475186B (en) 2012-10-10
JP2011527241A (ja) 2011-10-27
DE102008032319A1 (de) 2010-01-14
WO2010003925A3 (de) 2010-05-06
GB2475186A (en) 2011-05-11
GB201101277D0 (en) 2011-03-09
US20110180885A1 (en) 2011-07-28

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OP8 Request for examination as to paragraph 44 patent law
R016 Response to examination communication
R018 Grant decision by examination section/examining division
R020 Patent grant now final

Effective date: 20120907

R081 Change of applicant/patentee

Owner name: TDK CORPORATION, JP

Free format text: FORMER OWNER: EPCOS AG, 81669 MUENCHEN, DE

R082 Change of representative

Representative=s name: EPPING HERMANN FISCHER, PATENTANWALTSGESELLSCH, DE

Representative=s name: EPPING HERMANN FISCHER PATENTANWALTSGESELLSCHA, DE