JP5521317B2 - p型SiC半導体 - Google Patents
p型SiC半導体 Download PDFInfo
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- JP5521317B2 JP5521317B2 JP2008296814A JP2008296814A JP5521317B2 JP 5521317 B2 JP5521317 B2 JP 5521317B2 JP 2008296814 A JP2008296814 A JP 2008296814A JP 2008296814 A JP2008296814 A JP 2008296814A JP 5521317 B2 JP5521317 B2 JP 5521317B2
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- 239000004065 semiconductor Substances 0.000 title claims description 9
- 239000013078 crystal Substances 0.000 claims description 13
- 239000012535 impurity Substances 0.000 claims description 3
- 238000000034 method Methods 0.000 description 11
- 239000000758 substrate Substances 0.000 description 5
- 239000000370 acceptor Substances 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 238000002347 injection Methods 0.000 description 3
- 239000007924 injection Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000000969 carrier Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000002513 implantation Methods 0.000 description 2
- 238000005468 ion implantation Methods 0.000 description 2
- 239000007791 liquid phase Substances 0.000 description 2
- 238000005092 sublimation method Methods 0.000 description 2
- 230000005355 Hall effect Effects 0.000 description 1
- 229910008381 Si—Al-M Inorganic materials 0.000 description 1
- RZJQYRCNDBMIAG-UHFFFAOYSA-N [Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Zn].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Sn].[Sn].[Sn].[Sn].[Sn].[Sn].[Sn].[Sn].[Sn].[Sn].[Sn].[Sn].[Sn].[Sn].[Sn].[Sn].[Sn].[Sn] Chemical class [Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Zn].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Sn].[Sn].[Sn].[Sn].[Sn].[Sn].[Sn].[Sn].[Sn].[Sn].[Sn].[Sn].[Sn].[Sn].[Sn].[Sn].[Sn].[Sn] RZJQYRCNDBMIAG-UHFFFAOYSA-N 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000001004 secondary ion mass spectrometry Methods 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000001947 vapour-phase growth Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/0445—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising crystalline silicon carbide
- H01L21/0455—Making n or p doped regions or layers, e.g. using diffusion
- H01L21/046—Making n or p doped regions or layers, e.g. using diffusion using ion implantation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/12—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/16—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only elements of Group IV of the Periodic System
- H01L29/1608—Silicon carbide
Description
n型エピタキシャル層(ドーピング量:約5×1015/cm3)付き4H−SiC(0001)n型8°オフ基板
<イオン注入条件>
注入深さ:200nm
傾き角:0°
注入角:0°
注入基板温度:500℃
<注入後高温アニール>
加熱温度:1750℃
加熱時間:20分
イオン注入した各試料について、Al濃度およびTi濃度を二次イオン質量分析法(SIMS)により測定した。また、van der Pauw法によるHall効果測定を行なって、各試料の比抵抗を求めた。結果を表1にまとめて示す。なお、表1中には、下記式により求めた比抵抗改善率も併せて示した。
ρ1:Alのみを導入した試料の比抵抗(Ωcm)
ρ2:AlとTiを導入した試料の比抵抗(Ωcm)
Claims (1)
- SiC結晶中に不純物としてAlとTiを含み、原子比でTi濃度≦Al濃度であり、
5×1018/cm3≦Al濃度≦5×1020/cm3であり、かつ、1×1017/cm3≦〔Ti濃度〕≦1×1018/cm3であることを特徴とするp型SiC半導体。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008296814A JP5521317B2 (ja) | 2008-11-20 | 2008-11-20 | p型SiC半導体 |
CN2009801467545A CN102224592B (zh) | 2008-11-20 | 2009-11-19 | p型SiC半导体 |
DE112009003685.6T DE112009003685B4 (de) | 2008-11-20 | 2009-11-19 | p-SiC-Halbleiter |
US13/127,814 US8399888B2 (en) | 2008-11-20 | 2009-11-19 | P-type SiC semiconductor |
PCT/IB2009/007497 WO2010058264A1 (en) | 2008-11-20 | 2009-11-19 | P-TYPE SiC SEMICONDUCTOR |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008296814A JP5521317B2 (ja) | 2008-11-20 | 2008-11-20 | p型SiC半導体 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2010123794A JP2010123794A (ja) | 2010-06-03 |
JP5521317B2 true JP5521317B2 (ja) | 2014-06-11 |
Family
ID=41593032
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008296814A Active JP5521317B2 (ja) | 2008-11-20 | 2008-11-20 | p型SiC半導体 |
Country Status (5)
Country | Link |
---|---|
US (1) | US8399888B2 (ja) |
JP (1) | JP5521317B2 (ja) |
CN (1) | CN102224592B (ja) |
DE (1) | DE112009003685B4 (ja) |
WO (1) | WO2010058264A1 (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6230031B2 (ja) * | 2013-05-20 | 2017-11-15 | 国立研究開発法人産業技術総合研究所 | 炭化珪素単結晶の製造方法 |
JP6380267B2 (ja) * | 2015-07-09 | 2018-08-29 | トヨタ自動車株式会社 | SiC単結晶及びその製造方法 |
CN113279065B (zh) * | 2021-04-01 | 2022-01-11 | 浙江大学杭州国际科创中心 | 一种IVB族原子和铝共掺制备p型4H-SiC的方法 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2650730B2 (ja) * | 1988-08-08 | 1997-09-03 | シャープ株式会社 | 炭化珪素半導体を用いたpn接合型発光ダイオード |
US5281831A (en) * | 1990-10-31 | 1994-01-25 | Kabushiki Kaisha Toshiba | Optical semiconductor device |
JPH04206578A (ja) * | 1990-11-30 | 1992-07-28 | Toshiba Corp | 炭化珪素半導体素子 |
EP0831520B1 (de) | 1996-07-19 | 2004-09-29 | Infineon Technologies AG | Verfahren zur Herstellung einer MIS-Struktur auf Siliziumkarbid (SiC) |
JP2000277448A (ja) * | 1999-03-26 | 2000-10-06 | Ion Kogaku Kenkyusho:Kk | 結晶材料の製造方法および半導体素子 |
US6599644B1 (en) * | 2000-10-06 | 2003-07-29 | Foundation For Research & Technology-Hellas | Method of making an ohmic contact to p-type silicon carbide, comprising titanium carbide and nickel silicide |
SE520968C2 (sv) | 2001-10-29 | 2003-09-16 | Okmetic Oyj | Högresistiv monokristallin kiselkarbid och metod för dess framställning |
GB0215150D0 (en) * | 2002-07-01 | 2002-08-07 | Univ Hull | Photoelectric cell |
JPWO2004090969A1 (ja) * | 2003-03-24 | 2006-07-06 | 独立行政法人産業技術総合研究所 | 炭化珪素半導体装置およびその製造方法 |
JP4987707B2 (ja) * | 2004-07-07 | 2012-07-25 | トゥー‐シックス・インコーポレイテッド | 低ドーピング半絶縁性SiC結晶と方法 |
JP4763314B2 (ja) | 2005-02-25 | 2011-08-31 | 新日本無線株式会社 | p型シリコンカーバイド層の製造方法 |
US7391058B2 (en) | 2005-06-27 | 2008-06-24 | General Electric Company | Semiconductor devices and methods of making same |
JP4419937B2 (ja) | 2005-09-16 | 2010-02-24 | 住友金属工業株式会社 | 炭化珪素単結晶の製造方法 |
JP2008100890A (ja) | 2006-10-20 | 2008-05-01 | Sumitomo Metal Ind Ltd | SiC単結晶の製造方法 |
JP4697235B2 (ja) * | 2008-01-29 | 2011-06-08 | トヨタ自動車株式会社 | p型SiC半導体単結晶の製造方法およびそれにより製造されたp型SiC半導体単結晶 |
-
2008
- 2008-11-20 JP JP2008296814A patent/JP5521317B2/ja active Active
-
2009
- 2009-11-19 WO PCT/IB2009/007497 patent/WO2010058264A1/en active Application Filing
- 2009-11-19 US US13/127,814 patent/US8399888B2/en active Active
- 2009-11-19 CN CN2009801467545A patent/CN102224592B/zh active Active
- 2009-11-19 DE DE112009003685.6T patent/DE112009003685B4/de active Active
Also Published As
Publication number | Publication date |
---|---|
JP2010123794A (ja) | 2010-06-03 |
CN102224592A (zh) | 2011-10-19 |
DE112009003685T5 (de) | 2012-10-18 |
DE112009003685B4 (de) | 2020-03-19 |
US8399888B2 (en) | 2013-03-19 |
WO2010058264A1 (en) | 2010-05-27 |
US20110210341A1 (en) | 2011-09-01 |
CN102224592B (zh) | 2013-05-22 |
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