JP5507575B2 - 高強度/低微小クラックセラミックハニカム及びそのための方法 - Google Patents
高強度/低微小クラックセラミックハニカム及びそのための方法 Download PDFInfo
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- JP5507575B2 JP5507575B2 JP2011538660A JP2011538660A JP5507575B2 JP 5507575 B2 JP5507575 B2 JP 5507575B2 JP 2011538660 A JP2011538660 A JP 2011538660A JP 2011538660 A JP2011538660 A JP 2011538660A JP 5507575 B2 JP5507575 B2 JP 5507575B2
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Description
(a)PC≦4.0を満たす、セル密度,N、壁厚,w、総細孔体積分率,p、及び細孔径中央値,d50,ここで、PCは:
PC=0.156(w)+0.00632(N)+2.429(w)/[(d50 2)(p)];
として定義され、セル密度の単位はセル(チャネル)/平方インチ、壁厚の単位は10−3インチ(ミル)であって、総細孔体積分率は総%多孔度/100で無次元であり、d50の単位はμmであり、d50及び%多孔度は水銀多孔度計測法で測定される;
(b)≦14μmの細孔径中間値,d50及び≦20μmの第2の細孔径,d90,ここで、d50及びd90は、単位がμmすなわちマイクロメータ(10−6m)の、総細孔体積の50%及び90%がそれより径が微細な細孔の累積体積である細孔径を表す。例えば、d90は、細孔の(体積で)90%がそれより径が小さい(そこまでの累計水銀侵入体積が総水銀侵入体積の10%に等しい径より小さい)細孔であり、したがって、d50<d90である。さらに、少なくとも200psi(1.38×106Pa)の軸方向ハニカム試料の室温4点破壊係数及び少なくとも1100psi(7.58×106Pa)のMOR/CFA比,ここでCFAは:
CFA=(w/1000)[2(N−0.5)−(w/1000)](N);
と定義される、ハニカム基体の面の前面閉鎖面積分率である;
(c)0.97を超えない弾性率比,E(900)/E(25),ここで、E(900)の値は加熱時に測定される900℃での弾性率であり、E(25)の値は加熱前に室温近くで測定される弾性率であって、いずれも音波共鳴法を用いてハニカムの軸方向に平行なバーで測定される;及び
(d)>800℃の:
TSL(200)=200+(MOR/E)[CTE(200-1000)];
で定義される、熱衝撃限界,TSL(200),ここで、MOR及びEは室温で測定され、CTE(200-1000)はハニカムの軸方向に沿って体膨張計測によって測定された200〜1000℃の平均熱膨張係数である;
を示す。これらの実施形態のいくつかにおいてPC≦3.6であり、他の実施形態においてPC≦3.4である。
(a)焼結するとコージェライトセラミック体を卓越的に形成するに十分な比でマグネシウム含有原材料、アルミニウム含有原材料及びケイ素含有原材料を含む、コージェライト形成原材料を混合することで得られる無機材料混合物であって:
(i) 少なくとも15重量%の、粒径中間値が10μmを超えない、(以降「スピネル」と称される)アルミン酸マグネシウムスピネル粉末及び少なくとも10重量%のカオリン粉末;または
(ii) 少なくとも0.001重量%の、予備反応済コージェライト粉末または、1150℃より低い温度でコージェライトに、少なくともある程度、結晶化することができる、マグネシウムアルミノケイ酸ガラス粉末;または
(iii)リチウム、ナトリウム、カリウム、ルビジウム、セシウム、カルシウム、ストロンチウム、バリウム、イットリウム、ランタンのような三価希土類元素、及び亜鉛からなる群から選ばれる1つ以上の金属の、セラミック体内のそのような金属の総濃度が金属酸化物として重量で少なくとも0.5%になる、供給源、
の1つ以上も含む、無機材料混合物を提供する工程;
(b)セラミック形成前駆体バッチ混合物を得るために、無機材料混合物を、(いずれも、燃焼するか、蒸発するか、そうではなくとも加熱中にセラミック体から除去される)有機結合剤、滑材、可塑剤または細孔形成材あるいはこれらの組合せと混合する工程;
(c)可塑化セラミック形成前駆体バッチ混合物を形成するために、セラミック形成前駆体バッチ混合物を水またはその他の液媒のような液体ビヒクルと混合する工程;
(d)混合物を、ハニカム構造を有する成形体のような、成形体に成形する工程;
(e)成形体を乾燥させる工程;及び
(f)次いで成形体を炉内環境において、炉温で、バッチ混合物内の材料を反応させて多孔質コージェライトセラミックを形成するに十分な時間、焼成する工程;
を含む。本方法はさらに:
(g)多孔質コージェライトセラミックの焼成成形体を室温まで冷却する工程;
を含む。
PC=0.156(w)+0.00632(N)+2.429(w)/[(d50 2)(p)];
から計算し、MORは関係式:
MOR=(MOR/CFA){(w/1000)[2(N−0.5)−(w/1000)](N)};
から計算した。ここで、(MOR/CFA)は実施例について表にしてあり、Nとwは、200と8,200と6,300と6及び400と4のそれぞれの値に合わせられる。計算は、有益な特性を示すセル形状寸法の例示的な範囲を示す。
PC=0.156(w)+0.00632(N)+2.429(w)/[(d50 2)(p)];
で表され、Nの単位はセル(チャネル)/平方インチであり、wの単位は10−3インチ(ミル)であり、pは無次元であって、%で表した総多孔度(%多孔度)を100で割った値に等しく、d50の単位はμmであり、d50及び%多孔度は水銀多孔度計測法によって測定され、PC≦4.0である。フィルタ体は、≦14μmのd50,≦14μmのd90,少なくとも200psi(1.38×106Pa)のハニカム構造の軸方向試料についての室温4点破壊係数(MOR),少なくとも1100psi(7.58×106Pa)のMOR/CFA比を有し、ここで、CFAは:
CFA=(w/1000)[2(N−0.5)−(w/1000)](N);
と定義される、ハニカム基体の面の前面閉鎖面積分率である。フィルタ体は、0.97を超えない弾性率比,E(900)/E(25)を有し、E(900)の値は加熱時に測定される900℃における弾性率であり、E(25)の値は加熱前にほぼ室温で測定される弾性率であって、いずれもハニカムの軸方向に平行なバーについて測定される。フィルタ体は:
TSL(200)=200+(MOR/E)/[CTE(200-1000)];
と定義される、熱衝撃限界,TSL(200)を有し、ここで、MOR及びEは室温で測定され、CTE(200-1000)はハニカムの軸方向に沿う体膨張計測によって測定される200℃から1000℃までの平均熱膨張係数である。いくつかの実施形態ではPC≦3.6であり、いくつかの実施形態ではPC≦3.4である。いくつかの実施形態ではCFA≦0.23であり、これらの実施形態のいくつかではCFA≦0.21であり、これらの実施形態のいくつかではCFA≦0.18である。いくつかの実施形態では、%多孔度≧52%である。いくつかの実施形態ではd50≧7μmであり、これらの実施形態のいくつかでは、7μm≦d50≦14μmであり、これらの実施形態のいくつかでは8μm≦d50≦12μmである。いくつかの実施形態ではd90≦18μmであり、これらの実施形態のいくつかではd90≦16μmである。いくつかの実施形態では(d50)2(%多孔度/100)≧30μm2であり、これらの実施形態のいくつかでは(d50)2(%多孔度/100)≧50μm2であり、これらの実施形態のいくつかでは(d50)2(%多孔度/100)≧70μm2であり、これらの実施形態のいくつかでは、(d50)2(%多孔度/100)≧90μm2である。いくつかの実施形態では、df=(d50−d10)/d50において、df≦0.35である。いくつかの実施形態では、db=(d90−d10)/d50において、db≦1.00である。いくつかの実施形態ではMOR/E≧1500psi(1.03×107Pa)であり、これらの実施形態のいくつかでは、MOR/E≧2000psi(1.38×107Pa)である。いくつかの実施形態では、E(900)/E(25)≦0.94である。いくつかの実施形態において、フィルタ体は≦0.02の微小クラック指数,Nb3を有する。
Claims (5)
- 多孔質セラミックのハニカム構造をもつフィルタ体を有する微粒子フィルタであって、前記フィルタ体がセル密度,N、及び壁厚,wを有し、前記多孔質セラミックが総細孔体積分率,p、及び細孔径中央値,d50を有する、微粒子フィルタにおいて、
Nの単位がセル(チャネル)/平方インチであり、wの単位が10−3インチ(ミル)であり、pは無次元であって、%で表した総多孔度(%多孔度)を100で割った値に等しく、またd50の単位がμmであり、d50及び%多孔度が水銀多孔度計測法によって測定されるときに、前記フィルタ体の特徴が:
PC=0.156(w)+0.00632(N)+2.429(w)/[(d50 2)(p)];
で表されて、PC≦4.0であり、
前記フィルタ体が、
≦14μmのd50,
≦20μmのd90,
少なくとも200psi(1.38×106Pa)の、前記ハニカム構造の軸方向試料についての、室温4点破壊係数(MOR),
CFAを:
CFA=(w/1000)[2(N−0.5)−(w/1000)](N);
と定義される、前記ハニカム構造の面の前面閉鎖面積分率として、少なくとも1100psi(7.58×106Pa)のMOR/CFA比,
E(900)及びE(25)のいずれもが前記ハニカムの軸方向に平行なバーについて測定され、E(900)の値は加熱時に測定される900℃における弾性率であり、E(25)の値は加熱前にほぼ室温で測定される弾性率であるとして、0.97を超えない弾性率比,E(900)/E(25),及び
MOR及びEが室温で測定され、CTE(200-1000)が前記ハニカムの軸方向に沿って体膨張計測法で測定される200℃から1000℃までの平均熱膨張係数であるとして:
TSL(200)=200+(MOR/E)/[CTE(200-1000)];
と定義される、>800℃の熱衝撃限界,TSL(200),
を有することを特徴とする微粒子フィルタ。 - CFA≦0.23であることを特徴とする請求項1に記載の微粒子フィルタ。
- %多孔度≧52%であることを特徴とする請求項1に記載の微粒子フィルタ。
- d50≧7μmであることを特徴とする請求項1に記載の微粒子フィルタ。
- df=(d50−d10)/d50であって、df≦0.35であることを特徴とする請求項1に記載の微粒子フィルタ。
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US8999224B2 (en) | 2010-11-30 | 2015-04-07 | Corning Incorporated | Cordierite porous ceramic honeycomb articles with delayed microcrack evolution |
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2009
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US20100126132A1 (en) | 2010-05-27 |
EP2379198A1 (en) | 2011-10-26 |
US8007557B2 (en) | 2011-08-30 |
JP2012509765A (ja) | 2012-04-26 |
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