JP5507198B2 - 静電チャック - Google Patents

静電チャック Download PDF

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Publication number
JP5507198B2
JP5507198B2 JP2009245267A JP2009245267A JP5507198B2 JP 5507198 B2 JP5507198 B2 JP 5507198B2 JP 2009245267 A JP2009245267 A JP 2009245267A JP 2009245267 A JP2009245267 A JP 2009245267A JP 5507198 B2 JP5507198 B2 JP 5507198B2
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JP
Japan
Prior art keywords
adhesive layer
heater
electrostatic chuck
adhesive
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2009245267A
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English (en)
Japanese (ja)
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JP2011091297A (ja
JP2011091297A5 (OSRAM
Inventor
寛 米倉
明宏 栗林
和之 小椋
秀大 小松
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
Original Assignee
Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP2009245267A priority Critical patent/JP5507198B2/ja
Priority to US12/910,414 priority patent/US8542474B2/en
Publication of JP2011091297A publication Critical patent/JP2011091297A/ja
Publication of JP2011091297A5 publication Critical patent/JP2011091297A5/ja
Application granted granted Critical
Publication of JP5507198B2 publication Critical patent/JP5507198B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H01L21/6833—Details of electrostatic chucks
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T279/00—Chucks or sockets
    • Y10T279/23—Chucks or sockets with magnetic or electrostatic means

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2009245267A 2009-10-26 2009-10-26 静電チャック Active JP5507198B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2009245267A JP5507198B2 (ja) 2009-10-26 2009-10-26 静電チャック
US12/910,414 US8542474B2 (en) 2009-10-26 2010-10-22 Electrostatic chuck

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009245267A JP5507198B2 (ja) 2009-10-26 2009-10-26 静電チャック

Publications (3)

Publication Number Publication Date
JP2011091297A JP2011091297A (ja) 2011-05-06
JP2011091297A5 JP2011091297A5 (OSRAM) 2012-11-15
JP5507198B2 true JP5507198B2 (ja) 2014-05-28

Family

ID=43898253

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009245267A Active JP5507198B2 (ja) 2009-10-26 2009-10-26 静電チャック

Country Status (2)

Country Link
US (1) US8542474B2 (OSRAM)
JP (1) JP5507198B2 (OSRAM)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20200116506A (ko) * 2018-03-13 2020-10-12 엔지케이 인슐레이터 엘티디 웨이퍼 유지대
KR102260505B1 (ko) * 2020-08-26 2021-06-03 고광노 정전척의 접착층을 평탄화하는 방법

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10537013B2 (en) 2012-04-23 2020-01-14 Applied Materials, Inc. Distributed electro-static chuck cooling
US20130276980A1 (en) * 2012-04-23 2013-10-24 Dmitry Lubomirsky Esc with cooling base
JP6006972B2 (ja) * 2012-04-26 2016-10-12 新光電気工業株式会社 静電チャック
JP6140457B2 (ja) * 2013-01-21 2017-05-31 東京エレクトロン株式会社 接着方法、載置台及び基板処理装置
JP6231443B2 (ja) * 2014-06-27 2017-11-15 京セラ株式会社 接合体およびこれを用いたウエハ支持部材
JP5948513B1 (ja) * 2014-09-04 2016-07-06 日本碍子株式会社 ウエハー保持台及びその製法
JP6513938B2 (ja) * 2014-11-21 2019-05-15 日本特殊陶業株式会社 静電チャックの製造方法
JP6580974B2 (ja) * 2015-12-18 2019-09-25 日本特殊陶業株式会社 静電チャックの製造方法
JP6580975B2 (ja) * 2015-12-18 2019-09-25 日本特殊陶業株式会社 静電チャックの製造方法
JP6531675B2 (ja) * 2016-02-29 2019-06-19 住友大阪セメント株式会社 静電チャック装置
JP6642170B2 (ja) * 2016-03-23 2020-02-05 住友大阪セメント株式会社 静電チャック装置及びその製造方法
US11177151B2 (en) 2017-03-29 2021-11-16 Kyocera Corporation Sample holder
US10490435B2 (en) * 2018-02-07 2019-11-26 Applied Materials, Inc. Cooling element for an electrostatic chuck assembly
JP6971183B2 (ja) 2018-03-23 2021-11-24 新光電気工業株式会社 基板固定装置
CN111081517B (zh) * 2018-10-19 2023-03-03 长鑫存储技术有限公司 一种静电吸盘的防腐蚀方法
JP7496250B2 (ja) * 2020-06-16 2024-06-06 新光電気工業株式会社 基板固定装置、静電チャック及び静電チャックの製造方法
JP2023031603A (ja) 2021-08-25 2023-03-09 新光電気工業株式会社 基板固定装置
JP7583698B2 (ja) * 2021-10-08 2024-11-14 日本碍子株式会社 ウエハ載置台
JP2023071003A (ja) * 2021-11-10 2023-05-22 新光電気工業株式会社 静電チャック
JP7723346B2 (ja) * 2021-11-18 2025-08-14 住友電気工業株式会社 ウエハ保持体
US12434341B2 (en) 2022-04-22 2025-10-07 Samsung Electronics Co., Ltd. Electrostatic chuck apparatus
WO2025046742A1 (ja) * 2023-08-29 2025-03-06 日本碍子株式会社 ウエハ載置台及びその使用方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07335731A (ja) * 1994-06-07 1995-12-22 Fujitsu Ltd 吸着装置およびその製造方法
JP4004086B2 (ja) 1996-07-22 2007-11-07 日本発条株式会社 静電チャック装置
US6256187B1 (en) * 1998-08-03 2001-07-03 Tomoegawa Paper Co., Ltd. Electrostatic chuck device
JP4349952B2 (ja) 2004-03-24 2009-10-21 京セラ株式会社 ウェハ支持部材とその製造方法
US8038796B2 (en) 2004-12-30 2011-10-18 Lam Research Corporation Apparatus for spatial and temporal control of temperature on a substrate
TWI478275B (zh) * 2008-02-26 2015-03-21 Kyocera Corp A wafer support portion and a method of manufacturing the same, and an electrostatic chuck using the same

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20200116506A (ko) * 2018-03-13 2020-10-12 엔지케이 인슐레이터 엘티디 웨이퍼 유지대
KR102427974B1 (ko) * 2018-03-13 2022-08-02 엔지케이 인슐레이터 엘티디 웨이퍼 유지대
KR102260505B1 (ko) * 2020-08-26 2021-06-03 고광노 정전척의 접착층을 평탄화하는 방법

Also Published As

Publication number Publication date
US20110096460A1 (en) 2011-04-28
JP2011091297A (ja) 2011-05-06
US8542474B2 (en) 2013-09-24

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